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R7F7016114AFE#BA3 Equivalent & Substitute Parts
Part Overview
The R7F7016114AFE#BA3 is a 32-bit RH850G3KH microcontroller manufactured by Renesas Electronics Corporation, designed for automotive applications. This device operates at 120MHz with 1MB of Flash program memory and integrates multiple communication interfaces including CANbus, LINbus, SPI, I2C, and UART/USART. The part is classified as obsolete, necessitating identification of active equivalent alternatives that maintain identical electrical and mechanical specifications for continued system support and new designs.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Core Processor | RH850G3KH |
| Core Size | 32-Bit |
| Operating Frequency | 120MHz |
| Program Memory | 1MB (1M x 8) FLASH |
| EEPROM Size | 64K x 8 |
| RAM Size | 128K x 8 |
| I/O Count | 81 |
| Supply Voltage | 3V to 5.5V |
| Data Converters | A/D 20x10b, 16x12b |
| Connectivity | CANbus, CSI, I2C, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT |
| Package Type | 100-LQFP (14x14mm) |
| Operating Temperature | -40°C to 125°C |
| Grade | Automotive |
| Qualification | AEC-Q100 |
Substitute Part Grouping Explanation
Substitute parts for the R7F7016114AFE#BA3 are identified based on strict equivalence across all critical electrical and mechanical parameters. The substitution criteria are:
- Identical core processor: RH850G3KH
- Matching core architecture: 32-Bit
- Same operating frequency: 120MHz
- Identical memory configuration: 1MB Flash, 64K EEPROM, 128K RAM
- Equivalent I/O count: 81 pins
- Matching supply voltage range: 3V to 5.5V
- Identical data converter specifications: A/D 20x10b, 16x12b
- Same connectivity interfaces: CANbus, CSI, I2C, LINbus, SPI, UART/USART
- Identical peripheral set: DMA, PWM, WDT
- Same package: 100-LQFP (14x14mm)
- Matching temperature range: -40°C to 125°C
- Automotive grade with AEC-Q100 qualification
The identified substitutes maintain full compatibility with designs originally specified for the R7F7016114AFE#BA3, with the primary distinction being product status transition from obsolete to active manufacturing.
Parameter Comparison
| Parameter | R7F7016114AFE#BA3 (Main) | R7F7016114AFD-C#BA3 (Substitute) | R7F7016114AFE-C#BA3 (Substitute) |
|---|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Core Processor | RH850G3KH | RH850G3KH | RH850G3KH |
| Core Size | 32-Bit | 32-Bit | 32-Bit |
| Operating Frequency | 120MHz | 120MHz | 120MHz |
| Program Memory | 1MB (1M x 8) FLASH | 1MB (1M x 8) FLASH | 1MB (1M x 8) FLASH |
| EEPROM Size | 64K x 8 | 64K x 8 | 64K x 8 |
| RAM Size | 128K x 8 | 128K x 8 | 128K x 8 |
| I/O Count | 81 | 81 | 81 |
| Supply Voltage | 3V to 5.5V | 3V to 5.5V | 3V to 5.5V |
| Data Converters | A/D 20x10b, 16x12b | A/D 20x10b, 16x12b | A/D 20x10b, 16x12b |
| Connectivity | CANbus, CSI, I2C, LINbus, SPI, UART/USART | CANbus, CSI, I2C, LINbus, SPI, UART/USART | CANbus, CSI, I2C, LINbus, SPI, UART/USART |
| Peripherals | DMA, PWM, WDT | DMA, PWM, WDT | DMA, PWM, WDT |
| Package Type | 100-LQFP (14x14mm) | 100-LQFP (14x14mm) | 100-LQFP (14x14mm) |
| Operating Temperature | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C |
| Grade | Automotive | Automotive | Automotive |
| Qualification | AEC-Q100 | AEC-Q100 (implied) | AEC-Q100 (implied) |
| Product Status | Obsolete | Active | Active |
| Base Product Number | R7F7016114 | R7F7016114 | R7F7016114 |
| REACH Status | Not specified | REACH Unaffected | REACH Unaffected |
Engineering Selection Recommendations
Both R7F7016114AFD-C#BA3 and R7F7016114AFE-C#BA3 are direct functional equivalents to the obsolete R7F7016114AFE#BA3. Selection between these active alternatives is based on product status and regulatory compliance:
R7F7016114AFD-C#BA3 and R7F7016114AFE-C#BA3 are both classified as active products from Renesas Electronics Corporation, ensuring continued manufacturing support and availability. Both maintain full electrical and mechanical compatibility with the original specification. Both carry REACH Unaffected status, confirming compliance with European Union chemical regulations applicable to electronic components.
The transition from the obsolete R7F7016114AFE#BA3 to either active substitute ensures long-term supply chain stability and regulatory compliance for automotive applications requiring AEC-Q100 qualified microcontrollers.
Frequently Asked Questions (FAQ)
Q: Are R7F7016114AFD-C#BA3 and R7F7016114AFE-C#BA3 pin-for-pin compatible with R7F7016114AFE#BA3?
A: Both substitutes maintain identical pin configuration, package type (100-LQFP 14x14mm), and I/O count (81 pins). Direct PCB replacement is supported without layout modification.
Q: What is the difference between the two substitute part numbers?
A: Both parts share the base product number R7F7016114 and maintain identical electrical specifications. The suffix variations (AFD-C vs. AFE-C) represent manufacturing code designations from Renesas Electronics Corporation. Both are active products with equivalent functional performance.
Q: Can firmware developed for R7F7016114AFE#BA3 run on the substitute parts?
A: The identical RH850G3KH core processor, memory configuration, and peripheral set ensure binary compatibility. Firmware compiled for the original part executes without modification on either substitute.
Q: Are the substitute parts suitable for new automotive designs?
A: Both R7F7016114AFD-C#BA3 and R7F7016114AFE-C#BA3 are active products with AEC-Q100 qualification and automotive grade classification. Both are appropriate for new automotive applications requiring equivalent specifications to the original part.
Q: What is the supply voltage compatibility?
A: All three parts operate across the identical supply voltage range of 3V to 5.5V. Power supply circuits designed for the original part require no modification for the substitutes.
Q: Are there any memory differences between the main part and substitutes?
A: Program memory (1MB Flash), EEPROM (64K x 8), and RAM (128K x 8) are identical across all three parts. No firmware or bootloader adjustments are required for memory compatibility.
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