R7F701422EAFB-C#KA1 Equivalent & Substitute Parts

Part Overview

The R7F701422EAFB-C#KA1 is a 32-bit single-core microcontroller from Renesas Electronics Corporation, part of the RH850/D1L series. This embedded IC features 4MB FLASH program memory, 512KB RAM, and 64KB EEPROM, operating at 120MHz with a 144-LFQFP (20x20) surface mount package. The device integrates multiple connectivity interfaces including CANbus, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, and USB, along with comprehensive peripherals such as DMA, I2S, LCD, LVD, POR, PWM, and WDT. The part is currently in active production status and ROHS3 compliant. Identifying equivalent and substitute parts is necessary to ensure design flexibility, manage supply chain continuity, and maintain component availability across manufacturing cycles.

Substiute Parts

R7F701422EAFB-C#KA1
Renesas Electronics CorporationIn Stock: 1113R7F701422EAFB-C#KA1 Datasheet
R7F701422EAFB-C#KA1
Current Part
R7F701422EAFB-C#BA1
Renesas Electronics CorporationIn Stock: 2087R7F701422EAFB-C#BA1 Datasheet
R7F701422EAFB-C#BA1
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Part Number R7F701422EAFB-C#KA1
Manufacturer Renesas Electronics Corporation
Series RH850/D1L
Core Processor RH850G3M
Core Size 32-Bit Single-Core
Speed 120MHz
Program Memory Size 4MB (4M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 512K x 8
Number of I/O 103
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 16x12b
Operating Temperature -40°C ~ 150°C (TA)
Package / Case 144-LQFP
Supplier Device Package 144-LFQFP (20x20)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Product Status Active

Substitute Part Grouping Explanation

Substitution of the R7F701422EAFB-C#KA1 is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part R7F701422EAFB-C#BA1 qualifies as a parametric equivalent based on the following criteria:

Core Electrical Parameters (Must Match Exactly):

  • Processor architecture: RH850G3M 32-bit single-core
  • Operating frequency: 120MHz
  • Program memory: 4MB FLASH (4M x 8)
  • EEPROM: 64K x 8
  • RAM: 512K x 8
  • I/O count: 103 pins
  • Supply voltage range: 2.7V ~ 5.5V
  • Data converter specification: A/D 16x12b
  • Operating temperature range: -40°C ~ 150°C

Mechanical Parameters (Must Match Exactly):

  • Package type: 144-LQFP
  • Physical package: 144-LFQFP (20x20)
  • Mounting type: Surface Mount
  • MSL rating: 3 (168 Hours)

Connectivity & Peripherals (Must Match Exactly):

  • All interfaces: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
  • All peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT

Compliance & Status (Must Match Exactly):

  • RoHS Status: ROHS3 Compliant
  • REACH Status: REACH Unaffected
  • Product Status: Active

The only difference between the main part and substitute is the packaging format (Tray vs. standard packaging designation), which does not affect electrical or mechanical compatibility.

Parameter Comparison

Parameter R7F701422EAFB-C#KA1 R7F701422EAFB-C#BA1 Match
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Series RH850/D1L RH850/D1L
Core Processor RH850G3M RH850G3M
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 120MHz 120MHz
Program Memory Size 4MB (4M x 8) 4MB (4M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 64K x 8 64K x 8
RAM Size 512K x 8 512K x 8
Number of I/O 103 103
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 16x12b A/D 16x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 150°C (TA) -40°C ~ 150°C (TA)
Package / Case 144-LQFP 144-LQFP
Supplier Device Package 144-LFQFP (20x20) 144-LFQFP (20x20)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
Product Status Active Active
Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT DMA, I2S, LCD, LVD, POR, PWM, WDT

Engineering Selection Recommendations

The R7F701422EAFB-C#BA1 is a direct parametric equivalent to the R7F701422EAFB-C#KA1 and is suitable for substitution in applications requiring the RH850/D1L microcontroller platform. Both parts maintain identical electrical specifications, memory configurations, I/O capabilities, and peripheral feature sets. Both devices are in active production status and carry ROHS3 compliance certification, ensuring regulatory alignment for current manufacturing standards. The REACH Unaffected status applies to both parts, confirming compliance with chemical substance restrictions.

Selection between these two parts should be based on packaging format requirements and supply chain availability. The R7F701422EAFB-C#BA1 is available in Tray packaging with higher inventory levels (1980 Pcs), while the R7F701422EAFB-C#KA1 is available with standard packaging designation (1051 Pcs). Both parts satisfy identical functional and mechanical requirements for PCB assembly and system integration.

Frequently Asked Questions (FAQ)

Q: Can R7F701422EAFB-C#BA1 be used as a direct replacement for R7F701422EAFB-C#KA1?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, memory architecture, I/O configuration, operating temperature range, supply voltage range, and peripheral feature sets. The parts are functionally interchangeable at the component level.

Q: What is the difference between these two part numbers?

A: The primary difference is the packaging format designation. R7F701422EAFB-C#BA1 specifies Tray packaging, while R7F701422EAFB-C#KA1 uses standard packaging designation. Both parts use the same 144-LFQFP (20x20) physical package and have identical MSL ratings of 3 (168 Hours).

Q: Are both parts RoHS compliant?

A: Yes. Both R7F701422EAFB-C#KA1 and R7F701422EAFB-C#BA1 are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: Do these parts have the same pin configuration and footprint?

A: Yes. Both parts use the 144-LQFP package with 144-LFQFP (20x20) physical dimensions. Pin configuration, signal assignments, and PCB footprint requirements are identical.

Q: What is the operating temperature range for both parts?

A: Both parts operate across the temperature range of -40°C to 150°C (TA), supporting industrial and automotive applications requiring extended temperature performance.

Q: Are the memory specifications identical?

A: Yes. Both parts feature 4MB FLASH program memory (4M x 8), 512KB RAM (512K x 8), and 64KB EEPROM (64K x 8). Memory organization, access timing, and functional capabilities are identical.

Q: Can these parts be used interchangeably in production?

A: Yes. Both parts are in active production status with identical electrical and mechanical specifications. They can be used interchangeably in manufacturing, subject to packaging format and supply chain considerations.

Q: What connectivity interfaces are supported?

A: Both parts support CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, and USB interfaces. Peripheral support includes DMA, I2S, LCD, LVD, POR, PWM, and WDT.

Q: Is the supply voltage range the same for both parts?

A: Yes. Both parts operate with a supply voltage range of 2.7V to 5.5V (Vcc/Vdd), supporting single and multiple supply rail configurations.

Q: What is the moisture sensitivity level for these parts?

A: Both parts have an MSL rating of 3 with a floor life of 168 hours, requiring standard moisture control procedures during storage and handling.

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