R7F701381EAFP-C#KA2 Equivalent & Substitute Parts

Part Overview

The R7F701381EAFP-C#KA2 is a 32-bit single-core microcontroller from Renesas Electronics Corporation, part of the RH850/P1M-E series. This embedded IC features 1MB FLASH program memory, 192KB RAM, and 32KB EEPROM, operating at 160MHz with integrated connectivity interfaces including CANbus, FlexRay, LINbus, and UART/USART. The device is housed in a 100-LFQFP surface mount package and operates across an extended temperature range of -40°C to 150°C.

The R7F701381EAFP-C#KA2 maintains Active product status and is ROHS3 compliant. Equivalent substitute parts are necessary when specific packaging configurations, inventory availability, or supply chain requirements necessitate alternative sourcing while maintaining identical electrical and functional specifications.

Substiute Parts

R7F701381EAFP-C#KA2

Renesas Electronics CorporationIn Stock: 999R7F701381EAFP-C#KA2 Datasheet

Current PartRFQ

R7F701381EAFP-C#BA2

Renesas Electronics CorporationIn Stock: 1855R7F701381EAFP-C#BA2 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the R7F701381EAFP-C#KA2 is determined by strict equivalence across all electrical and functional parameters. The primary substitute identified is the R7F701381EAFP-C#BA2, which maintains identical specifications across the following critical parameters:

Substitution-Determining Parameters:

• Core processor architecture (RH850G3M)
• Operating frequency (160MHz)
• Program memory capacity and type (1MB FLASH)
• RAM and EEPROM configuration (192KB RAM, 32KB EEPROM)
• Supply voltage range (3V ~ 5.5V)
• I/O pin count (50)
• Data converter specifications (A/D 24x12b)
• Connectivity interfaces (CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART)
• Peripheral set (DMA, Temp Sensor, WDT)
• Operating temperature range (-40°C ~ 150°C)
• Physical package footprint (100-LFQFP 14x14)
• Compliance certifications (ROHS3, REACH Unaffected)

The distinction between the main part and substitute lies exclusively in packaging configuration: the R7F701381EAFP-C#KA2 is supplied in standard packaging, while the R7F701381EAFP-C#BA2 is supplied in Tray packaging. Both parts share the identical base product number R7F701381 and are functionally interchangeable at the circuit level.

Parameter Comparison

Engineering Selection Recommendations

Both the R7F701381EAFP-C#KA2 and R7F701381EAFP-C#BA2 are Active product status devices from Renesas Electronics Corporation and maintain full ROHS3 compliance and REACH Unaffected status. Selection between these parts is determined by packaging and supply chain requirements rather than electrical or functional differences.

The R7F701381EAFP-C#KA2 is appropriate for applications requiring standard packaging configuration. The R7F701381EAFP-C#BA2 is appropriate for applications where Tray packaging is specified or preferred for automated assembly processes. Both parts are suitable for automotive, industrial, and embedded control applications requiring extended temperature operation and integrated connectivity interfaces.

Component selection should be based on:

• Packaging configuration requirements for assembly and handling
• Supply chain availability and lead time considerations
• Inventory management and storage protocols
• Manufacturing process compatibility with packaging type

Frequently Asked Questions (FAQ)

Q: Are the R7F701381EAFP-C#KA2 and R7F701381EAFP-C#BA2 electrically identical?

A: Yes. Both parts share identical electrical specifications, including core processor architecture, operating frequency, memory configuration, supply voltage range, I/O count, connectivity interfaces, and peripheral set. The parts are functionally interchangeable at the circuit level.

Q: What is the difference between these two part numbers?

A: The primary difference is packaging configuration. The R7F701381EAFP-C#KA2 uses standard packaging, while the R7F701381EAFP-C#BA2 uses Tray packaging. All other specifications remain identical.

Q: Can I substitute the R7F701381EAFP-C#BA2 for the R7F701381EAFP-C#KA2 in my design?

A: Yes, provided your assembly process and handling procedures are compatible with Tray packaging. The electrical and functional specifications are identical, and both parts maintain the same physical footprint (100-LFQFP 14x14).

Q: Do both parts have the same compliance certifications?

A: Yes. Both the R7F701381EAFP-C#KA2 and R7F701381EAFP-C#BA2 are ROHS3 compliant and REACH Unaffected.

Q: What is the operating temperature range for these microcontrollers?

A: Both parts operate across -40°C to 150°C, suitable for extended temperature industrial and automotive applications.

Q: How many I/O pins are available on these devices?

A: Both parts provide 50 I/O pins configured within the 100-LFQFP package.

Q: What connectivity interfaces are supported?

A: Both parts support CANbus, CSI, FlexRay, LINbus, PSI5, and UART/USART connectivity interfaces.

Q: What is the program memory capacity?

A: Both parts feature 1MB (1M x 8) FLASH program memory, 192KB RAM, and 32KB EEPROM.