R7F701379EAFP-C#AA2 Equivalent & Substitute Parts

Part Overview

The R7F701379EAFP-C#AA2 is a 32-bit single-core microcontroller from Renesas Electronics Corporation, part of the RH850/P1M-E series. This embedded IC features a RH850G3M core operating at 160MHz with 2MB FLASH program memory, 64KB EEPROM, and 192KB RAM. The device integrates multiple communication protocols including CANbus, CSI, FlexRay, LINbus, PSI5, and UART/USART, along with DMA, temperature sensor, and watchdog timer peripherals. The part is housed in a 144-LFQFP (20x20) surface mount package with 86 I/O pins and operates across an extended temperature range of -40°C to 150°C with supply voltage tolerance of 3V to 5.5V.

This microcontroller maintains Active product status and is ROHS3 compliant with REACH unaffected classification. Equivalent substitute parts are identified based on matching core electrical specifications, memory configuration, and functional capabilities while accommodating packaging variations.

Substiute Parts

R7F701379EAFP-C#AA2

Renesas Electronics CorporationIn Stock: 1211R7F701379EAFP-C#AA2 Datasheet

Current PartRFQ

R7F701378EAFP-C#BA2

Renesas Electronics CorporationIn Stock: 1832R7F701378EAFP-C#BA2 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the R7F701379EAFP-C#AA2 is determined by strict equivalence across the following critical parameters:

Core Electrical Specifications: The substitute part must maintain identical core processor architecture (RH850G3M), bit width (32-bit single-core), and operating frequency (160MHz).

Memory Configuration: Program memory capacity (2MB FLASH), EEPROM size (64K x 8), and RAM capacity (192K x 8) must be identical to ensure firmware compatibility and functional equivalence.

Functional Capabilities: The substitute must provide the same number of I/O pins (86), identical data converter specifications (A/D 24x12b), and equivalent peripheral set (DMA, temperature sensor, watchdog timer).

Communication Protocols: All connectivity options (CANbus, CSI, FlexRay, LINbus, PSI5, UART/USART) must be present in the substitute part.

Electrical Operating Conditions: Supply voltage range (3V ~ 5.5V) and operating temperature range (-40°C ~ 150°C) must match or exceed the original specification.

Compliance and Certification: Both parts must maintain ROHS3 compliance and REACH unaffected status.

Package Accommodation: Substitutes may differ in physical package dimensions (LFQFP footprint size variation) provided the pin count (144 pins) and package family (LQFP) remain constant, allowing for PCB layout adaptation.

Parameter Comparison

Engineering Selection Recommendations

Both the R7F701379EAFP-C#AA2 and R7F701378EAFP-C#BA2 are Active product status microcontrollers from Renesas Electronics Corporation within the RH850/P1M-E series. Both parts maintain full ROHS3 compliance and REACH unaffected classification, meeting current environmental and regulatory requirements.

The parts are electrically and functionally equivalent across all core specifications including processor architecture, memory configuration, I/O count, peripheral set, and communication protocol support. Selection between these parts is determined by physical package footprint requirements.

The R7F701379EAFP-C#AA2 utilizes a 144-LFQFP (20x20mm) package, while the R7F701378EAFP-C#BA2 utilizes a 144-LFQFP (16x16mm) package. This dimensional difference requires PCB layout adaptation but does not affect electrical performance or firmware compatibility. The choice between these parts depends on available PCB real estate and design constraints.

Both parts are supplied in Active inventory status with high availability. The R7F701378EAFP-C#BA2 is available in Tray packaging, while the R7F701379EAFP-C#AA2 packaging specification is not detailed in the provided parameters.

Frequently Asked Questions (FAQ)

Q: Are the R7F701379EAFP-C#AA2 and R7F701378EAFP-C#BA2 pin-compatible?

A: Both parts feature 144 pins in the LQFP package family with identical pin assignments. The parts are pin-compatible, though the physical package dimensions differ (20x20mm versus 16x16mm), requiring PCB footprint adjustment.

Q: Can firmware developed for the R7F701379EAFP-C#AA2 run on the R7F701378EAFP-C#BA2?

A: Yes. Both microcontrollers share identical core processor architecture (RH850G3M), memory configuration (2MB FLASH, 64KB EEPROM, 192KB RAM), and peripheral set. Firmware compiled for one part executes identically on the substitute without modification.

Q: What is the primary difference between these two parts?

A: The primary difference is the physical package footprint. The R7F701379EAFP-C#AA2 uses a 20x20mm LFQFP package, while the R7F701378EAFP-C#BA2 uses a 16x16mm LFQFP package. All electrical and functional specifications are identical.

Q: Do both parts support the same communication protocols?

A: Yes. Both parts provide identical connectivity support including CANbus, CSI, FlexRay, LINbus, PSI5, and UART/USART protocols with no functional differences.

Q: Are there any compliance or certification differences between these parts?

A: No. Both parts maintain identical ROHS3 compliance status, REACH unaffected classification, and Moisture Sensitivity Level 3 (168 Hours) rating.

Q: Which part should be selected for new designs?

A: Selection is based on PCB layout constraints and available board space. The 16x16mm package (R7F701378EAFP-C#BA2) is suitable for space-constrained applications, while the 20x20mm package (R7F701379EAFP-C#AA2) may be preferred for designs with less stringent footprint requirements. Both parts are equally suitable from an electrical and functional perspective.

Q: Are there any temperature or voltage operating condition differences?

A: No. Both parts operate identically across the -40°C to 150°C temperature range with 3V to 5.5V supply voltage tolerance.

Q: What is the impact of package dimension differences on circuit design?

A: The package dimension difference affects only PCB layout and routing. The smaller 16x16mm package requires more compact board design, while the larger 20x20mm package provides slightly more routing flexibility around the device. No schematic or electrical design changes are required.