R7F7010244AFP#AA2 Equivalent & Substitute Parts

Part Overview

The R7F7010244AFP#AA2 is a 32-bit microcontroller from Renesas Electronics Corporation belonging to the RH850/F1L series. This device integrates an RH850G3K core operating at 80MHz with 768KB of FLASH program memory, 32KB EEPROM, and 96KB RAM in a 100-LFQFP surface mount package. The microcontroller provides comprehensive connectivity options including CANbus, CSI, I2C, LINbus, SPI, and UART/USART interfaces, along with integrated peripherals such as DMA, I2S, LCD controller, LVD, POR, PWM, and WDT functions.

The R7F7010244AFP#AA2 carries an Obsolete product status. Identifying equivalent substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support long-term production requirements for applications utilizing this microcontroller platform.

Substiute Parts

R7F7010244AFP#AA2

Renesas Electronics CorporationIn Stock: 1176R7F7010244AFP#AA2 Datasheet

Current PartRFQ

R7F7010244AFP-C#AA2

Renesas Electronics CorporationIn Stock: 1178R7F7010244AFP-C#AA2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the R7F7010244AFP#AA2 is determined by strict equivalence across the following critical parameters:

Core Architecture & Performance: The substitute part must utilize the identical RH850G3K core processor operating at 80MHz to ensure binary compatibility with existing firmware and software stacks.

Memory Configuration: Program memory capacity must be 768KB FLASH, EEPROM must be 32K x 8, and RAM must be 96K x 8. These specifications are non-negotiable for application compatibility.

Electrical Specifications: Supply voltage range must remain 3V ~ 5.5V to maintain compatibility with existing power distribution designs.

Connectivity & Peripherals: The substitute must provide identical connectivity interfaces (CANbus, CSI, I2C, LINbus, SPI, UART/USART) and peripheral functions (DMA, I2S, LCD, LVD, POR, PWM, WDT).

Package & Form Factor: The 100-LFQFP (14x14) surface mount package is mandatory to ensure PCB layout compatibility without redesign.

I/O Configuration: The 81 I/O pins must be maintained for signal routing equivalence.

Data Converter Specifications: A/D converter configuration (20x10-bit, 16x12-bit) must be identical.

The primary distinction between the main part and its substitute relates to product status: the main part is Obsolete, while the substitute maintains Active status, providing ongoing manufacturer support and supply availability.

Parameter Comparison

Engineering Selection Recommendations

The R7F7010244AFP-C#AA2 is the direct equivalent substitute for the R7F7010244AFP#AA2. Both parts are manufactured by Renesas Electronics Corporation and share identical electrical, functional, and mechanical specifications across all critical parameters.

Product Status Consideration: The primary distinction is product lifecycle status. The main part (R7F7010244AFP#AA2) is classified as Obsolete, indicating discontinued manufacturing and limited long-term availability. The substitute part (R7F7010244AFP-C#AA2) maintains Active status, ensuring ongoing production, manufacturer support, and supply chain availability.

Design Compatibility: The substitute part provides complete functional equivalence. Existing firmware, software, and hardware designs developed for the R7F7010244AFP#AA2 require no modification for implementation with the R7F7010244AFP-C#AA2. Pin assignments, memory organization, peripheral functionality, and electrical characteristics are fully compatible.

Supply Chain Strategy: For new production runs, design revisions, or long-term product support, the R7F7010244AFP-C#AA2 is the appropriate selection. This substitution ensures access to current manufacturing processes, quality assurance protocols, and manufacturer technical support resources.

Inventory Management: Current stock of R7F7010244AFP#AA2 (1104 units) may be utilized for existing production commitments. Transition to R7F7010244AFP-C#AA2 (1068 units available) is recommended for ongoing and future production requirements.

Frequently Asked Questions (FAQ)

Q: Are the R7F7010244AFP#AA2 and R7F7010244AFP-C#AA2 pin-compatible?

A: Yes. Both parts utilize the identical 100-LFQFP (14x14) package with 81 I/O pins in the same configuration. PCB layouts designed for either part are directly interchangeable without modification.

Q: Will existing firmware compiled for the R7F7010244AFP#AA2 execute on the R7F7010244AFP-C#AA2?

A: Yes. Both microcontrollers employ the identical RH850G3K core processor operating at 80MHz with identical memory organization (768KB FLASH, 32KB EEPROM, 96KB RAM). Firmware binaries are fully compatible without recompilation or modification.

Q: What is the significance of the product status difference?

A: The R7F7010244AFP#AA2 is Obsolete, indicating Renesas has discontinued manufacturing. The R7F7010244AFP-C#AA2 is Active, meaning Renesas continues production with ongoing quality assurance and technical support. For new designs or long-term production, the Active part is the appropriate selection.

Q: Are there any electrical or thermal differences between these parts?

A: No. Both parts operate within the identical supply voltage range (3V ~ 5.5V) and temperature range (-40°C ~ 125°C). Electrical characteristics, power consumption profiles, and thermal behavior are equivalent.

Q: Can I use the R7F7010244AFP-C#AA2 as a direct replacement in existing production?

A: Yes. The R7F7010244AFP-C#AA2 is a direct functional equivalent. No circuit modifications, firmware updates, or design changes are required. The part can be substituted directly into existing manufacturing processes and assemblies.

Q: What connectivity interfaces are available on both parts?

A: Both the R7F7010244AFP#AA2 and R7F7010244AFP-C#AA2 provide identical connectivity: CANbus, CSI, I2C, LINbus, SPI, and UART/USART. Peripheral functions include DMA, I2S, LCD controller, LVD, POR, PWM, and WDT.

Q: Are there any package or mounting differences?

A: No. Both parts are supplied in 100-LFQFP (14x14) surface mount packages. Soldering profiles, PCB footprints, and assembly processes are identical.