Equivalent & Substitute Parts for R7F100GPL2DFB#BA0

Part Overview

The R7F100GPL2DFB#BA0 is a 16-bit microcontroller from Renesas Electronics Corporation belonging to the RL78/G23 series. This embedded IC features 512KB FLASH program memory, 48KB RAM, and 8KB EEPROM, operating at 32MHz with a supply voltage range of 1.6V to 5.5V. The device is housed in a 100-LQFP surface mount package and maintains Active product status with full RoHS3 compliance. Substitute parts are identified to provide design flexibility when the primary part number becomes unavailable or when alternative packaging configurations are required for specific manufacturing processes.

Key Parameters

Parameter	Value
Series	RL78/G23
Core Processor	RL78
Core Size	16-Bit
Speed	32MHz
Program Memory Size	512KB (512K x 8)
Program Memory Type	FLASH
RAM Size	48K x 8
EEPROM Size	8K x 8
Voltage Supply (Vcc/Vdd)	1.6V ~ 5.5V
Number of I/O	88
Connectivity	CSI, I2C, LINbus, SPI, UART/USART
Data Converters	A/D 20x10b, 8x12b; D/A 2x8b
Peripherals	Capacitive Touch, LVD, POR, PWM, WDT
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	100-LQFP
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the R7F100GPL2DFB#BA0 is determined by strict equivalence across all critical electrical and functional parameters. The substitute parts R7F100GPL2DFA#AA0 and R7F100GPL2DFA#BA0 maintain identical specifications for core processor architecture, memory configuration, operating voltage, speed, connectivity interfaces, and peripheral functionality. The primary distinction between the main part and substitutes lies in the physical package dimensions: the main part R7F100GPL2DFB#BA0 utilizes a 100-LFQFP (14x14) package, while both substitute parts employ a 100-LQFP (14x20) package configuration. This dimensional difference affects PCB layout and footprint design but does not alter electrical compatibility or functional performance. All three parts share identical base product number R7F100G, series designation RL78/G23, and compliance certifications.

Parameter Comparison

Parameter	R7F100GPL2DFB#BA0	R7F100GPL2DFA#AA0	R7F100GPL2DFA#BA0
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Series	RL78/G23	RL78/G23	RL78/G23
Core Processor	RL78	RL78	RL78
Core Size	16-Bit	16-Bit	16-Bit
Speed	32MHz	32MHz	32MHz
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH	FLASH
RAM Size	48K x 8	48K x 8	48K x 8
EEPROM Size	8K x 8	8K x 8	8K x 8
Voltage Supply (Vcc/Vdd)	1.6V ~ 5.5V	1.6V ~ 5.5V	1.6V ~ 5.5V
Number of I/O	88	88	88
Connectivity	CSI, I2C, LINbus, SPI, UART/USART	CSI, I2C, LINbus, SPI, UART/USART	CSI, I2C, LINbus, SPI, UART/USART
Data Converters	A/D 20x10b, 8x12b; D/A 2x8b	A/D 20x10b, 8x12b; D/A 2x8b	A/D 20x10b, 8x12b; D/A 2x8b
Peripherals	Capacitive Touch, LVD, POR, PWM, WDT	Capacitive Touch, LVD, POR, PWM, WDT	Capacitive Touch, LVD, POR, PWM, WDT
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Package / Case	100-LQFP	100-LQFP	100-LQFP
Supplier Device Package	100-LFQFP (14x14)	100-LQFP (14x20)	100-LQFP (14x20)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three parts maintain Active product status with identical electrical specifications and full compliance with RoHS3 and REACH regulations. Selection between R7F100GPL2DFB#BA0 and its substitutes R7F100GPL2DFA#AA0 or R7F100GPL2DFA#BA0 is determined by PCB layout requirements and package footprint compatibility. The main part utilizes a 100-LFQFP (14x14) package, while both substitutes employ a 100-LQFP (14x20) package. This dimensional difference requires corresponding adjustments to PCB design and component placement. All parts share identical moisture sensitivity level (MSL 3, 168 Hours) and storage requirements. The choice between substitute parts R7F100GPL2DFA#AA0 and R7F100GPL2DFA#BA0 is determined by specific procurement and inventory availability, as both maintain identical electrical and physical specifications.

Frequently Asked Questions (FAQ)

Q: What is the primary difference between R7F100GPL2DFB#BA0 and its substitute parts?

A: The primary difference is the physical package dimension. R7F100GPL2DFB#BA0 uses a 100-LFQFP (14x14) package, while R7F100GPL2DFA#AA0 and R7F100GPL2DFA#BA0 use a 100-LQFP (14x20) package. All electrical specifications and functional parameters are identical.

Q: Are the substitute parts electrically compatible with the main part?

A: Yes. R7F100GPL2DFA#AA0 and R7F100GPL2DFA#BA0 are parametric equivalents with identical core processor, memory configuration, operating voltage, speed, connectivity interfaces, and peripheral functionality as R7F100GPL2DFB#BA0.

Q: What considerations are necessary when substituting the package?

A: PCB layout and footprint design must be modified to accommodate the different package dimensions. The 100-LFQFP (14x14) footprint differs from the 100-LQFP (14x20) footprint. Component placement, trace routing, and thermal management design may require adjustment.

Q: Do all three parts share the same compliance certifications?

A: Yes. R7F100GPL2DFB#BA0, R7F100GPL2DFA#AA0, and R7F100GPL2DFA#BA0 all maintain RoHS3 compliance, REACH Unaffected status, and identical MSL ratings (3, 168 Hours).

Q: What is the difference between R7F100GPL2DFA#AA0 and R7F100GPL2DFA#BA0?

A: Both parts are parametrically identical with the same 100-LQFP (14x20) package. The difference in part number suffix (#AA0 versus #BA0) reflects different manufacturing or procurement batches but does not affect electrical or functional specifications.

Q: Can I use these substitutes in existing designs without firmware modification?

A: Firmware compatibility depends on design implementation. Since all parts share identical processor architecture, memory configuration, and peripheral functionality, firmware developed for one part operates on the substitutes. However, PCB layout changes are required due to package dimension differences.

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