Equivalent & Substitute Parts for R7F100GLN3CFB#BA0

Part Overview

The R7F100GLN3CFB#BA0 is a 16-bit microcontroller from Renesas Electronics Corporation belonging to the RL78/G23 series. This embedded IC features 768KB of FLASH program memory, 48KB of RAM, and 8KB of EEPROM, operating at 32MHz with a supply voltage range of 1.8V to 5.5V. The device integrates multiple communication interfaces including CSI, I2C, LINbus, SPI, and UART/USART, along with peripheral functions such as capacitive touch sensing, low voltage detection, power-on reset, PWM, and watchdog timer. The part is housed in a 64-LQFP package (10x10mm footprint) and is currently in active production status with ROHS3 compliance. Identifying equivalent substitute parts is necessary when the primary part number becomes unavailable, when alternative packaging configurations are required for specific board layouts, or when inventory constraints necessitate sourcing from alternative stock positions.

Substiute Parts

R7F100GLN3CFB#BA0
Renesas Electronics CorporationIn Stock: 952R7F100GLN3CFB#BA0 Datasheet
R7F100GLN3CFB#BA0
Current Part
R7F100GLN3CFA#AA0
Renesas Electronics CorporationIn Stock: 1479R7F100GLN3CFA#AA0 Datasheet
R7F100GLN3CFA#AA0
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RL78/G23
Core Processor RL78
Core Size 16-Bit
Operating Speed 32MHz
Program Memory 768KB FLASH (768K x 8)
EEPROM Size 8K x 8
RAM Size 48K x 8
Supply Voltage 1.8V ~ 5.5V
I/O Count 54
Package Type 64-LQFP
Operating Temperature -40°C ~ 105°C
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitution eligibility for the R7F100GLN3CFB#BA0 is determined by strict parametric equivalence across the following critical criteria:

Core Functional Parameters: The substitute part must belong to the same RL78/G23 series with identical RL78 core processor architecture, 16-bit core size, and 32MHz operating speed. Memory configuration must match exactly: 768KB FLASH program memory, 48KB RAM, and 8KB EEPROM.

Electrical Specifications: Supply voltage range must be identical (1.8V ~ 5.5V). Data converter specifications must match: A/D converters (12x10-bit and 8x12-bit) and D/A converters (2x8-bit).

Connectivity and Peripherals: All communication interfaces (CSI, I2C, LINbus, SPI, UART/USART) and peripheral functions (capacitive touch, LVD, POR, PWM, WDT) must be present and identical.

I/O Configuration: The number of I/O pins must remain at 54.

Environmental and Compliance: Operating temperature range (-40°C ~ 105°C), RoHS3 compliance, and MSL rating (3, 168 Hours) must be maintained.

Package Consideration: While the package type remains 64-LQFP, the physical footprint dimensions may differ (10x10mm versus 12x12mm). This represents a mechanical variation that does not affect electrical functionality but requires PCB layout verification.

The R7F100GLN3CFA#AA0 meets all parametric equivalence criteria and qualifies as a direct substitute with the noted package footprint difference.

Parameter Comparison

Parameter R7F100GLN3CFB#BA0 R7F100GLN3CFA#AA0 Match Status
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Identical
Series RL78/G23 RL78/G23 Identical
Core Processor RL78 RL78 Identical
Core Size 16-Bit 16-Bit Identical
Operating Speed 32MHz 32MHz Identical
Program Memory 768KB FLASH (768K x 8) 768KB FLASH (768K x 8) Identical
EEPROM Size 8K x 8 8K x 8 Identical
RAM Size 48K x 8 48K x 8 Identical
Supply Voltage 1.8V ~ 5.5V 1.8V ~ 5.5V Identical
I/O Count 54 54 Identical
Connectivity CSI, I2C, LINbus, SPI, UART/USART CSI, I2C, LINbus, SPI, UART/USART Identical
Peripherals Capacitive Touch, LVD, POR, PWM, WDT Capacitive Touch, LVD, POR, PWM, WDT Identical
Data Converters A/D 12x10b, 8x12b; D/A 2x8b A/D 12x10b, 8x12b; D/A 2x8b Identical
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C Identical
Package Type 64-LQFP (10x10mm) 64-LQFP (12x12mm) Different Footprint
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
MSL Rating 3 (168 Hours) 3 (168 Hours) Identical
Product Status Active Active Identical

Engineering Selection Recommendations

The R7F100GLN3CFA#AA0 is a parametrically equivalent substitute for the R7F100GLN3CFB#BA0 based on identical electrical specifications, memory configuration, processing capability, and compliance certifications. Both parts maintain active production status with ROHS3 compliance and identical MSL ratings, ensuring equivalent reliability and environmental performance.

The primary distinction between these parts is the package footprint dimension: the R7F100GLN3CFB#BA0 uses a 10x10mm footprint while the R7F100GLN3CFA#AA0 uses a 12x12mm footprint. Both are 64-LQFP packages with identical pin counts and electrical characteristics. Selection between these parts depends on PCB layout constraints and available board space. The larger footprint of the R7F100GLN3CFA#AA0 may provide improved thermal characteristics and easier handling during assembly, while the smaller footprint of the R7F100GLN3CFB#BA0 offers space efficiency for compact designs.

Both parts are suitable for applications requiring 16-bit microcontroller functionality with extensive memory, multiple communication protocols, and integrated analog/digital conversion capabilities across industrial temperature ranges.

Frequently Asked Questions (FAQ)

Q: Can the R7F100GLN3CFA#AA0 be used as a direct replacement for the R7F100GLN3CFB#BA0 on an existing PCB?

A: Electrical substitution is complete; however, the different package footprints (10x10mm versus 12x12mm) require PCB layout verification. The pad pattern and spacing differ between the two packages. If the PCB is designed specifically for the 10x10mm footprint, the 12x12mm package cannot be mounted without layout modifications.

Q: Are there any firmware or software compatibility differences between these two parts?

A: No. Both parts use the identical RL78 core processor, memory configuration, and peripheral set. Firmware compiled for one part executes identically on the other.

Q: What is the significance of the different part number suffixes (#BA0 versus #AA0)?

A: The suffix designates the specific package variant and manufacturing batch code. The #BA0 and #AA0 suffixes indicate different package configurations (footprint dimensions) and manufacturing dates, but do not affect electrical functionality or performance.

Q: If my application requires the 10x10mm footprint specifically, are there other alternatives besides the R7F100GLN3CFB#BA0?

A: Based on the provided parametric data, the R7F100GLN3CFB#BA0 is the specified part for the 10x10mm footprint within the RL78/G23 series with this memory and feature configuration. Alternative sourcing would require consultation with Renesas Electronics Corporation for additional part variants.

Q: Can these parts be used interchangeably in high-temperature applications?

A: Yes. Both parts share identical operating temperature specifications (-40°C ~ 105°C) and are rated for the same environmental conditions. No thermal performance difference exists between the two variants.

Q: What is the impact of the different package sizes on thermal management?

A: The larger 12x12mm footprint of the R7F100GLN3CFA#AA0 provides a larger surface area for heat dissipation compared to the 10x10mm footprint of the R7F100GLN3CFB#BA0. For applications with significant thermal loads, the larger package may offer marginal thermal advantages, though both packages are designed for the same operating temperature range.

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