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R6012FNX Equivalent & Substitute Parts Reference
Part Overview
The Rohm Semiconductor R6012FNX is an N-Channel MOSFET with a maximum drain-source voltage of 600 V and a continuous drain current rating of 12A (Tc). It features a TO-220FM full-pack through-hole package and is ROHS3 compliant. With an active product status and availability of inventory, the R6012FNX is suitable for high-voltage, medium-current switching applications. However, identifying substitute and equivalent MOSFETs is essential for design flexibility, risk management, and supply chain continuity, especially when addressing lead time, second-source policies, or obsolescence.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | R6012FNX |
| FET Type | N-Channel |
| Technology | MOSFET (Metal Oxide) |
| Drain to Source Voltage (Vdss) | 600 V |
| Current - Continuous Drain (Id) @ 25°C | 12A (Tc) |
| Rds On (Max) @ Id, Vgs | 510mOhm @ 6A, 10V |
| Drive Voltage (Max Rds On, Min Rds On) | 10V |
| Vgs(th) (Max) @ Id | 5V @ 1mA |
| Gate Charge (Qg) (Max) @ Vgs | 35 nC @ 10 V |
| Vgs (Max) | ±30V |
| Input Capacitance (Ciss) (Max) @ Vds | 1300 pF @ 25 V |
| Power Dissipation (Max) | 50W (Tc) |
| Operating Temperature | 150°C (TJ) |
| Mounting Type | Through Hole |
| Package / Case | TO-220-3 Full Pack |
| RoHS Status | ROHS3 Compliant |
| MSL | 1 (Unlimited) |
| REACH Status | REACH Unaffected |
Substitute Part Grouping Explanation
Substitute and equivalent parts are selected based on strict matching of critical electrical and mechanical parameters including FET type (N-Channel), technology (MOSFET), maximum drain-source voltage (Vdss), continuous drain current (Id), maximum Rds(on) at the specified current and gate voltage, maximum Vgs(th), gate charge, allowable gate-source voltage (Vgs(max)), input capacitance (Ciss), maximum power dissipation, mounting type, and package. Only parameters provided are considered.
Parameter Comparison
| Manufacturer Part Number | Manufacturer | FET Type | Technology | Drain to Source Voltage (Vdss) | Current - Continuous Drain (Id) @ 25°C | Rds On (Max) @ Id, Vgs | Drive Voltage (Max Rds On, Min Rds On) | Vgs(th) (Max) @ Id | Gate Charge (Qg) (Max) @ Vgs | Vgs (Max) | Input Capacitance (Ciss) (Max) @ Vds | Power Dissipation (Max) | Mounting Type | Package / Case | RoHS Status | MSL | REACH Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| R6012FNX | Rohm Semiconductor | N-Channel | MOSFET (Metal Oxide) | 600 V | 12A (Tc) | 510mOhm @ 6A, 10V | 10V | 5V @ 1mA | 35 nC @ 10 V | ±30V | 1300 pF @ 25 V | 50W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| IPA80R450P7XKSA1 | Infineon Technologies | N-Channel | MOSFET (Metal Oxide) | 800 V | 11A (Tc) | 450mOhm @ 4.5A, 10V | 10V | 3.5V @ 220µA | 24 nC @ 10 V | ±20V | 770 pF @ 500 V | 29W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | Not Applicable | REACH Unaffected |
| STF11N60M2-EP | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 7.5A (Tc) | 595mOhm @ 3.75A, 10V | 10V | 4.75V @ 250µA | 12.4 nC @ 10 V | ±25V | 390 pF @ 100 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF12N65M5 | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 650 V | 8.5A (Tc) | 430mOhm @ 4.3A, 10V | 10V | 5V @ 250µA | 22 nC @ 10 V | ±25V | 900 pF @ 100 V | 25W (Tc) | Through Hole | TO-220-5 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF13N60M2 | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 11A (Tc) | 380mOhm @ 5.5A, 10V | 10V | 4V @ 250µA | 17 nC @ 10 V | ±25V | 580 pF @ 100 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| FCPF11N60F | onsemi | N-Channel | MOSFET (Metal Oxide) | 600 V | 11A (Tc) | 380mOhm @ 5.5A, 10V | 10V | 5V @ 250µA | 52 nC @ 10 V | ±30V | 1490 pF @ 25 V | 36W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | Not Applicable | REACH Unaffected |
| FCPF7N60 | onsemi | N-Channel | MOSFET (Metal Oxide) | 600 V | 7A (Tc) | 600mOhm @ 3.5A, 10V | 10V | 5V @ 250µA | 30 nC @ 10 V | ±30V | 920 pF @ 25 V | 31W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | Not Applicable | REACH Unaffected |
| SPA07N60C3XKSA1 | Infineon Technologies | N-Channel | MOSFET (Metal Oxide) | 650 V | 7.3A (Tc) | 600mOhm @ 4.6A, 10V | 10V | 3.9V @ 250µA | 27 nC @ 10 V | ±20V | 790 pF @ 25 V | 32W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF10N60M2 | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 7.5A (Tc) | 600mOhm @ 4A, 10V | 10V | 4V @ 250µA | 13.5 nC @ 10 V | ±25V | 400 pF @ 100 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF10NM60N | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 10A (Tc) | 550mOhm @ 4A, 10V | 10V | 4V @ 250µA | 19 nC @ 10 V | ±25V | 540 pF @ 50 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF10NM60ND | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 8A (Tc) | 550mOhm @ 4A, 10V | 10V | 4V @ 250µA | 19 nC @ 10 V | ±25V | 540 pF @ 50 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF11N65M5 | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 650 V | 9A (Tc) | 480mOhm @ 4.5A, 10V | 10V | 5V @ 250µA | 17 nC @ 10 V | ±25V | 644 pF @ 100 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| STF11NM60ND | STMicroelectronics | N-Channel | MOSFET (Metal Oxide) | 600 V | 10A (Tc) | 450mOhm @ 5A, 10V | 10V | 5V @ 250µA | 30 nC @ 10 V | ±25V | 850 pF @ 50 V | 25W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
| TK12A60D(STA4,Q,M) | Toshiba Semiconductor and Storage | N-Channel | MOSFET (Metal Oxide) | 600 V | 12A (Ta) | 550mOhm @ 6A, 10V | 10V | 4V @ 1mA | 38 nC @ 10 V | ±30V | 1800 pF @ 25 V | 45W (Tc) | Through Hole | TO-220-3 Full Pack | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected |
Engineering Selection Recommendations
Select substitute MOSFETs for R6012FNX based on product status being "Active", RoHS3 compliance, MSL rating of 1 (Unlimited) or Not Applicable, and REACH status being "REACH Unaffected", according to the parameters provided. Do not select parts flagged "Not For New Designs" unless necessary for legacy design continuity. Where multiple mechanical and electrical matches exist, select devices with the same or lower Rds(on) and similar or higher drain current capability, always confirming package and mounting compatibility as shown above.
Frequently Asked Questions (FAQ)
Q1: What are the critical parameters for substituting R6012FNX?
- The substitute must match the FET type (N-Channel), technology (MOSFET), drain-source voltage (Vdss), continuous drain current (Id), Rds(on), drive voltage for Rds(on), Vgs (max), gate charge (Qg), input capacitance (Ciss), power dissipation, mounting type (Through Hole), and package (TO-220-3 Full Pack or equivalent).
Q2: Is package compatibility required for substituting R6012FNX?
- Yes. Substitute parts should have a TO-220-3 Full Pack or equivalent through-hole package to ensure mechanical and thermal compatibility.
Q3: What compliance certifications must be considered?
- RoHS3 compliance, MSL, and REACH status must match or exceed those of R6012FNX for environmental and manufacturing compatibility.
Q4: Is it acceptable to use a MOSFET with higher Vdss or lower Rds(on)?
- Only the parameters provided in the input dictate substitute acceptability. Electrical values can meet or exceed those of R6012FNX in the same package type as outlined in the parameter comparison.
Q5: Are discontinued or "Not For New Designs" substitutes valid?
- "Not For New Designs" devices are indicated for legacy design replacement only, based on the provided product status. Confirm ongoing availability as indicated in inventory data.
Q6: Do all substitutes have the same maximum operating temperature?
- Maximum operating temperatures are specified per device; ensure compatibility during selection based solely on given data.
Q7: How should differences in input capacitance (Ciss) or gate charge (Qg) be handled?
- Substitute selection is based strictly on the provided values; ensure that system-level changes due to these parameters are within design constraints according to the parameter comparison table.
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