R5F572TKCDFB#10 Equivalent & Substitute Parts

Part Overview

The R5F572TKCDFB#10 is a 32-bit single-core microcontroller from Renesas Electronics Corporation belonging to the RX72T series. This embedded IC features RXv3 core architecture operating at 200MHz with 1MB FLASH program memory, 128KB RAM, and 32KB EEPROM. The device integrates comprehensive connectivity options including CANbus, Ethernet, USB OTG, SPI, I2C, and QSPI interfaces, along with analog data conversion capabilities (30-channel 12-bit ADC and 2-channel 12-bit DAC). The 144-LFQFP surface mount package provides 110 I/O pins for industrial and embedded applications.

The R5F572TKCDFB#10 maintains Active product status with ROHS3 compliance and REACH unaffected classification. Substitute parts are identified based on identical electrical specifications, core architecture, memory configuration, and packaging standards to ensure direct functional replacement in existing designs.

Substiute Parts

R5F572TKCDFB#10

Renesas Electronics CorporationIn Stock: 1036R5F572TKCDFB#10 Datasheet

Current PartRFQ

R5F572TKCDFB#30

Renesas Electronics CorporationIn Stock: 105917R5F572TKCDFB#30 Datasheet

Parametric EquivalentRFQ

R5F572TKGDFB#30

Renesas Electronics CorporationIn Stock: 1312R5F572TKGDFB#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the R5F572TKCDFB#10 are identified through parametric equivalence analysis. The substitution logic is based on the following critical parameters that must remain identical:

Core Architecture & Performance: RXv3 core processor, 32-bit single-core configuration, and 200MHz operating frequency are non-negotiable specifications that define the computational capability and instruction set compatibility.

Memory Configuration: 1MB FLASH program memory (1M x 8), 128KB RAM (128K x 8), and 32KB EEPROM (32K x 8) must be identical to ensure software compatibility and application functionality without modification.

Electrical Specifications: Supply voltage range of 2.7V ~ 5.5V and data converter specifications (30-channel 12-bit ADC and 2-channel 12-bit DAC) must match exactly for circuit integration.

Connectivity & Peripherals: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, and USB OTG interfaces, along with DMA, LVD, POR, PWM, and WDT peripherals, must be present and identical.

Package & Environmental: 144-LQFP package in 20x20mm form factor, surface mount configuration, operating temperature range of -40°C ~ 85°C, ROHS3 compliance, and MSL 3 rating must be maintained.

The identified substitute parts R5F572TKCDFB#30 and R5F572TKGDFB#30 meet all these criteria and are direct functional equivalents.

Parameter Comparison

Engineering Selection Recommendations

All three parts—R5F572TKCDFB#10, R5F572TKCDFB#30, and R5F572TKGDFB#30—are Active status products from Renesas Electronics Corporation with identical electrical and mechanical specifications. Each part maintains ROHS3 compliance and REACH unaffected classification, meeting current environmental and regulatory requirements for embedded microcontroller applications.

Selection between these equivalent parts is based on availability and packaging lot designation. The R5F572TKCDFB#30 offers the highest inventory availability at 105,836 pieces, making it the preferred choice for high-volume production requirements. The R5F572TKGDFB#30 provides an alternative with 1,217 pieces in stock. The R5F572TKCDFB#10 is available with 983 pieces.

All three parts are suitable for direct substitution in designs requiring RX72T series microcontrollers with 200MHz operation, 1MB FLASH memory, and comprehensive industrial connectivity interfaces. No design modifications are required when substituting between these parts.

Frequently Asked Questions (FAQ)

Q: Can R5F572TKCDFB#30 be used as a direct replacement for R5F572TKCDFB#10?

A: Yes. Both parts are parametrically identical across all electrical specifications, memory configuration, core architecture, operating frequency, and package format. Direct substitution is supported without design changes.

Q: What is the difference between R5F572TKCDFB#30 and R5F572TKGDFB#30?

A: Both parts are parametrically equivalent with identical core specifications, memory, connectivity, and packaging. The difference in part number designation reflects Renesas internal lot or manufacturing batch coding. Electrical and functional performance are identical.

Q: Are all three parts compatible with the same PCB layout and firmware?

A: Yes. The 144-LFQFP (20x20) package format, pin configuration, 110 I/O count, and all electrical specifications are identical across all three parts. Existing PCB layouts and firmware require no modification.

Q: What does the MSL 3 (168 Hours) rating mean for component handling?

A: MSL 3 indicates Moisture Sensitivity Level 3, requiring storage in controlled humidity conditions. The 168-hour specification defines the maximum time the component can be exposed to ambient conditions (typically 30°C, 85% relative humidity) before requiring reflow soldering. Proper moisture control during storage and handling is required.

Q: Are these parts suitable for industrial temperature applications?

A: Yes. All three parts operate across the -40°C ~ 85°C temperature range, meeting industrial embedded system requirements. This operating temperature specification is identical across all substitute parts.

Q: What connectivity options are available on these microcontrollers?

A: All three parts include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, and USB OTG interfaces. Peripheral support includes DMA, LVD, POR, PWM, and WDT functions.

Q: Is firmware compatibility guaranteed between these parts?

A: Yes. Identical RXv3 core architecture, 200MHz clock speed, and memory configuration ensure complete firmware compatibility. Code compiled for one part executes identically on all three substitute parts.