R5F572TFGDFP#10 Equivalent & Substitute Parts

Part Overview

The R5F572TFGDFP#10 is a 32-bit single-core microcontroller from Renesas Electronics Corporation's RX72T series, featuring the RXv3 processor architecture. This embedded IC operates at 200MHz with 512KB FLASH program memory, 128KB RAM, and 32KB EEPROM, packaged in a 100-LFQFP (14x14mm) surface-mount configuration. The device integrates comprehensive connectivity options including CANbus, Ethernet, USB OTG, SPI, I2C, and QSPI interfaces, along with essential peripherals such as DMA, PWM, watchdog timer, and analog-to-digital converters. The part is actively produced and ROHS3 compliant. Substitute parts are identified to address inventory availability, supply chain continuity, and equivalent functional requirements in embedded system designs.

Substiute Parts

R5F572TFGDFP#10

Renesas Electronics CorporationIn Stock: 1020R5F572TFGDFP#10 Datasheet

Current PartRFQ

R5F572TFCDFP#30

Renesas Electronics CorporationIn Stock: 1275R5F572TFCDFP#30 Datasheet

Parametric EquivalentRFQ

R5F572TFGDFP#30

Renesas Electronics CorporationIn Stock: 1357R5F572TFGDFP#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the R5F572TFGDFP#10 are identified based on strict parametric equivalence within the RX72T microcontroller family. The substitution criteria are defined by the following key parameters:

Core Substitution Parameters:

• Processor Architecture: RXv3 core
• Series Classification: RX72T
• Processing Speed: 200MHz
• Program Memory Capacity: 512KB FLASH
• RAM Capacity: 128KB
• EEPROM Capacity: 32KB
• I/O Pin Count: 69
• Package Configuration: 100-LFQFP (14x14mm)
• Supply Voltage Range: 2.7V ~ 5.5V
• Connectivity Suite: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
• Peripheral Set: DMA, LVD, POR, PWM, WDT
• Data Converter Specifications: A/D 24x12b, D/A 2x12b
• Operating Temperature Range: -40°C ~ 85°C
• Compliance Standards: ROHS3, REACH Unaffected

All identified substitute parts maintain identical electrical specifications, memory configurations, peripheral functionality, and physical packaging. Differences exist only in packaging tape reel designations (indicated by the suffix #10, #30) and internal device binning codes (TFGDFP versus TFCDFP), which do not affect functional compatibility or performance characteristics.

Parameter Comparison

Engineering Selection Recommendations

All three parts—R5F572TFGDFP#10, R5F572TFCDFP#30, and R5F572TFGDFP#30—are functionally equivalent microcontroller units suitable for direct substitution in embedded system applications. Selection between these parts is determined by supply chain availability and packaging format requirements rather than electrical or functional differences.

Compliance and Regulatory Status: All substitute parts maintain identical compliance certifications: ROHS3 compliance, REACH unaffected status, and equivalent ECCN and HTSUS classifications. Moisture sensitivity level (MSL 3, 168 hours) is consistent across all variants, ensuring equivalent handling and storage requirements.

Product Status: All parts are classified as Active products from Renesas Electronics Corporation, indicating ongoing manufacturing support and availability through authorized distribution channels.

Packaging Considerations: The suffix designations (#10 and #30) indicate different tape reel packaging formats. The #10 designation represents one packaging configuration, while #30 represents an alternative reel format. Both formats contain identical die and are electrically interchangeable. Selection between packaging formats depends on manufacturing equipment compatibility and inventory management practices.

Device Binning: The TFGDFP and TFCDFP designations represent different internal device binning classifications from Renesas. Both binning codes produce functionally equivalent parts meeting the same electrical specifications and performance characteristics.

Frequently Asked Questions (FAQ)

Q: Are R5F572TFGDFP#10, R5F572TFCDFP#30, and R5F572TFGDFP#30 electrically interchangeable?

A: Yes. All three parts are electrically and functionally identical. They share identical processor architecture (RXv3), clock speed (200MHz), memory configuration (512KB FLASH, 128KB RAM, 32KB EEPROM), I/O count (69 pins), connectivity interfaces, and peripheral functionality. Differences exist only in packaging tape reel format and internal device binning, which do not affect circuit performance or compatibility.

Q: What do the suffix numbers (#10 and #30) indicate?

A: The suffix numbers designate different tape reel packaging formats used for automated assembly equipment. #10 and #30 represent distinct reel configurations. The choice between formats depends on your manufacturing equipment specifications and supply chain preferences. Both formats contain identical microcontroller dies.

Q: What is the difference between TFGDFP and TFCDFP device codes?

A: TFGDFP and TFCDFP are internal Renesas device binning classifications. Both codes produce parts with identical electrical specifications, memory sizes, clock speeds, and peripheral functionality. The binning distinction does not affect performance or compatibility in circuit applications.

Q: Can I substitute R5F572TFGDFP#10 with R5F572TFGDFP#30 or R5F572TFCDFP#30 in production?

A: Yes. All three parts are direct substitutes. PCB layout, firmware, and circuit design require no modifications. The parts are pin-compatible, electrically equivalent, and functionally identical. Substitution is limited only by packaging format compatibility with your assembly equipment.

Q: Are there any differences in operating temperature range or voltage specifications?

A: No. All three parts operate across the identical temperature range (-40°C to 85°C) and voltage supply range (2.7V to 5.5V). Thermal and electrical performance characteristics are equivalent.

Q: Do all three parts have the same compliance certifications?

A: Yes. All parts are ROHS3 compliant, REACH unaffected, and carry identical ECCN and HTSUS classifications. Moisture sensitivity level (MSL 3, 168 hours) is consistent across all variants.

Q: Which part should I select if all are available?

A: Selection is based on supply chain availability, packaging format compatibility with your manufacturing equipment, and inventory management practices. From an engineering perspective, all three parts are equivalent and interchangeable.

Q: Are there any firmware or software compatibility issues between these parts?

A: No. All parts use the identical RXv3 processor core and instruction set. Firmware compiled for one part executes identically on all three variants without modification.

Q: What is the moisture sensitivity level, and does it differ between parts?

A: All three parts have MSL 3 rating with a 168-hour floor life. Moisture sensitivity handling and storage requirements are identical across all variants.