Renesas Electronics R5F572TFGDFB#10 Equivalent & Substitute Parts

Part Overview

The Renesas Electronics R5F572TFGDFB#10 is a 32-bit single-core microcontroller from the RX72T series, operating at 200MHz with 512KB FLASH memory. This embedded IC is designed for applications requiring CANbus, Ethernet, USB OTG, and multiple serial communication interfaces. The part is currently in active production status with 885 units available in stock.

Identifying equivalent and substitute parts is necessary when addressing supply chain constraints, inventory availability, or specific procurement requirements while maintaining identical electrical and mechanical specifications.

Substiute Parts

R5F572TFGDFB#10
Renesas Electronics CorporationIn Stock: 992R5F572TFGDFB#10 Datasheet
R5F572TFGDFB#10
Current Part
R5F572TFCDFB#30
Renesas Electronics CorporationIn Stock: 1060R5F572TFCDFB#30 Datasheet
R5F572TFCDFB#30
Parametric Equivalent
R5F572TFGDFB#30
Renesas Electronics CorporationIn Stock: 1078R5F572TFGDFB#30 Datasheet
R5F572TFGDFB#30
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RX72T
Core Processor RXv3
Core Size 32-Bit Single-Core
Speed 200MHz
Program Memory Size 512KB (512K x 8)
Program Memory Type FLASH
EEPROM Size 32K x 8
RAM Size 128K x 8
Number of I/O 110
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V
Data Converters A/D 30x12b; D/A 2x12b
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 144-LQFP
Supplier Device Package 144-LFQFP (20x20)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the R5F572TFGDFB#10 are identified based on strict parametric equivalence within the RX72T microcontroller series. The substitution logic is determined by the following critical parameters:

Core Substitution Criteria:

  • Identical series designation (RX72T)
  • Identical core processor architecture (RXv3)
  • Identical core size (32-Bit Single-Core)
  • Identical operating frequency (200MHz)
  • Identical program memory capacity (512KB FLASH)
  • Identical EEPROM size (32K x 8)
  • Identical RAM size (128K x 8)
  • Identical I/O count (110)
  • Identical voltage supply range (2.7V ~ 5.5V)
  • Identical data converter specifications (A/D 30x12b; D/A 2x12b)
  • Identical operating temperature range (-40°C ~ 85°C)
  • Identical package type (144-LQFP / 144-LFQFP 20x20)
  • Identical connectivity interfaces (CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG)
  • Identical peripheral set (DMA, LVD, POR, PWM, WDT)

Parts meeting all these criteria are classified as parametric equivalents and direct substitutes. Variations in part numbering suffixes (such as #10 versus #30) represent packaging or tape reel configurations that do not affect electrical or mechanical compatibility.

Parameter Comparison

Parameter R5F572TFGDFB#10 R5F572TFCDFB#30 R5F572TFGDFB#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Series RX72T RX72T RX72T
Core Processor RXv3 RXv3 RXv3
Core Size 32-Bit Single-Core 32-Bit Single-Core 32-Bit Single-Core
Speed 200MHz 200MHz 200MHz
Program Memory Size 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH FLASH
EEPROM Size 32K x 8 32K x 8 32K x 8
RAM Size 128K x 8 128K x 8 128K x 8
Number of I/O 110 110 110
Voltage Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 30x12b; D/A 2x12b A/D 30x12b; D/A 2x12b A/D 30x12b; D/A 2x12b
Oscillator Type Internal Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case 144-LQFP 144-LQFP 144-LQFP
Supplier Device Package 144-LFQFP (20x20) 144-LFQFP (20x20) 144-LFQFP (20x20)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected
ECCN 3A991A2 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

All three parts—R5F572TFGDFB#10, R5F572TFCDFB#30, and R5F572TFGDFB#30—are active production components from Renesas Electronics Corporation and are fully equivalent for direct substitution in circuit designs.

Compliance and Certification Status: All substitute parts maintain identical compliance certifications:

  • ROHS3 Compliant
  • REACH Unaffected
  • Identical ECCN and HTSUS classifications

Selection Basis: Component selection should be based on:

  1. Current inventory availability (R5F572TFGDFB#10: 885 units; R5F572TFCDFB#30: 1013 units; R5F572TFGDFB#30: 976 units)
  2. Packaging configuration requirements (tray packaging available for all variants)
  3. Procurement lead time and supply chain considerations
  4. Active product status confirmation (all parts are active)

No electrical or mechanical redesign is required when substituting between these parts. Pin configuration, signal integrity, thermal characteristics, and functional performance remain identical across all three variants.

Frequently Asked Questions (FAQ)

Q: Can R5F572TFCDFB#30 be used as a direct replacement for R5F572TFGDFB#10?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, memory configurations, I/O counts, operating temperature ranges, and package dimensions. The suffix variation (#10 versus #30) indicates packaging or tape reel configuration differences that do not affect circuit compatibility.

Q: Are there any pin configuration differences between these substitute parts?

A: No. All three parts use the identical 144-LQFP package with 144-LFQFP (20x20) supplier device package specifications. Pin assignments, signal routing, and PCB layout requirements are identical.

Q: Do the substitute parts support the same connectivity interfaces?

A: Yes. All parts provide identical connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, and USB OTG. Peripheral support is also identical, including DMA, LVD, POR, PWM, and WDT.

Q: What is the significance of the part number suffix (#10 versus #30)?

A: The suffix indicates packaging configuration or tape reel specifications. Both configurations contain the identical microcontroller die and provide the same electrical and functional performance. Selection between them depends on procurement and assembly process requirements.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All three parts are ROHS3 Compliant with identical REACH status (REACH Unaffected) and export classifications (ECCN 3A991A2, HTSUS 8542.31.0001).

Q: What is the moisture sensitivity level for these parts?

A: All parts have Moisture Sensitivity Level (MSL) 3 with a 168-hour floor life. Identical handling and storage requirements apply to all variants.

Q: Can these parts be used interchangeably in production?

A: Yes. From an engineering perspective, these parts are fully interchangeable. No firmware modifications, PCB redesign, or functional testing variations are required when substituting between R5F572TFGDFB#10, R5F572TFCDFB#30, and R5F572TFGDFB#30.

Q: Are there any performance differences in processing speed or memory access?

A: No. All parts operate at identical 200MHz clock speed with identical 512KB FLASH, 128KB RAM, and 32KB EEPROM configurations. Data converter specifications (A/D 30x12b; D/A 2x12b) and I/O count (110) are identical across all variants.

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