R5F572TFCDFP#10 Equivalent & Substitute Parts

Part Overview

The R5F572TFCDFP#10 is a 32-bit single-core microcontroller from Renesas Electronics Corporation's RX72T series, featuring the RXv3 processor architecture. This embedded IC operates at 200MHz with 512KB FLASH program memory, 128KB RAM, and 32KB EEPROM, packaged in a 100-LFQFP (14x14mm) surface-mount configuration. The device integrates comprehensive connectivity options including CANbus, Ethernet, USB OTG, SPI, I2C, and QSPI interfaces, along with essential peripherals such as DMA, PWM, watchdog timer, and analog-to-digital converters. The part maintains Active product status with ROHS3 compliance and operates across the industrial temperature range of -40°C to 85°C. Substitute parts are identified to address inventory availability, procurement lead times, or packaging variations while maintaining full electrical and mechanical compatibility.

Substiute Parts

R5F572TFCDFP#10

Renesas Electronics CorporationIn Stock: 803R5F572TFCDFP#10 Datasheet

Current PartRFQ

R5F572TFCDFP#30

Renesas Electronics CorporationIn Stock: 1275R5F572TFCDFP#30 Datasheet

Parametric EquivalentRFQ

R5F572TFGDFP#30

Renesas Electronics CorporationIn Stock: 1357R5F572TFGDFP#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the R5F572TFCDFP#10 is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute parts R5F572TFCDFP#30 and R5F572TFGDFP#30 are classified as parametric equivalents based on the following criteria:

Core Electrical Parameters (Must Match Exactly):

• Processor architecture: RXv3 core
• Processing speed: 200MHz
• Program memory capacity: 512KB FLASH
• RAM capacity: 128KB
• EEPROM capacity: 32KB
• Supply voltage range: 2.7V ~ 5.5V
• I/O count: 69 pins
• Data converter specifications: A/D 24x12b; D/A 2x12b
• Connectivity interfaces: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, USB OTG
• Peripheral set: DMA, LVD, POR, PWM, WDT

Mechanical Parameters (Must Match Exactly):

• Package type: 100-LQFP
• Physical dimensions: 100-LFQFP (14x14mm)
• Mounting type: Surface Mount
• Operating temperature range: -40°C ~ 85°C

Compliance & Environmental Parameters (Must Match Exactly):

• RoHS status: ROHS3 Compliant
• Moisture Sensitivity Level: 3 (168 Hours)
• REACH status: REACH Unaffected
• Product status: Active

The substitutes differ only in packaging designation suffix (#30 versus #10), which reflects tray packaging variations and does not affect electrical or mechanical functionality.

Parameter Comparison

Engineering Selection Recommendations

All three microcontroller variants—R5F572TFCDFP#10, R5F572TFCDFP#30, and R5F572TFGDFP#30—are classified as Active products from Renesas Electronics Corporation and maintain identical electrical, mechanical, and compliance specifications. Selection between these parts is based on procurement factors rather than functional differences.

Compliance & Regulatory Status: All substitute parts maintain ROHS3 compliance and REACH Unaffected status, ensuring compatibility with current environmental and regulatory requirements. Moisture Sensitivity Level 3 (168 Hours) is consistent across all variants, requiring standard handling and storage protocols.

Inventory & Availability: The R5F572TFCDFP#30 variant has 1232 units in stock, while the R5F572TFGDFP#30 variant has 1334 units in stock, compared to 784 units of the R5F572TFCDFP#10. Selection may be driven by immediate availability requirements or supply chain optimization.

Packaging Designation: The suffix variation (#10 versus #30) indicates different tray packaging configurations. This distinction does not affect circuit-level performance, pin configuration, or electrical characteristics. Component selection should be based on procurement lead times, inventory levels, and packaging logistics requirements.

Frequently Asked Questions (FAQ)

Q: Are R5F572TFCDFP#30 and R5F572TFGDFP#30 direct replacements for R5F572TFCDFP#10?

A: Yes. All three parts are parametric equivalents with identical electrical specifications, memory configurations, I/O counts, connectivity interfaces, and operating characteristics. The suffix variation reflects packaging tray designation only and does not affect functionality or pin compatibility.

Q: What does the packaging suffix (#10 versus #30) indicate?

A: The suffix designates the tray packaging configuration used by Renesas Electronics Corporation for distribution. This is a logistics designation and does not impact electrical performance, pin layout, or circuit compatibility.

Q: Can these parts be used interchangeably in PCB designs?

A: Yes. All three variants use the 100-LFQFP (14x14mm) package with identical pin assignments, voltage requirements (2.7V ~ 5.5V), and operating temperature range (-40°C ~ 85°C). PCB layouts and schematics require no modification when substituting between these parts.

Q: Are there any differences in memory capacity or processing speed?

A: No. All variants feature 512KB FLASH program memory, 128KB RAM, 32KB EEPROM, and operate at 200MHz. Memory organization and access characteristics are identical.

Q: Do all variants support the same connectivity interfaces?

A: Yes. CANbus, Ethernet, USB OTG, SPI, I2C, QSPI, and all other listed interfaces are present on all three part numbers with identical specifications.

Q: What is the Moisture Sensitivity Level, and does it differ between variants?

A: All parts have MSL 3 (168 Hours), indicating standard moisture sensitivity requiring controlled storage conditions. No variation exists between the three variants.

Q: Are there compliance or certification differences?

A: No. All three parts maintain ROHS3 compliance, REACH Unaffected status, and identical ECCN and HTSUS classifications. Regulatory and environmental compliance is uniform across all variants.

Q: Which variant should be selected for new designs?

A: Selection should be based on current inventory availability and procurement lead times. From a technical standpoint, all three parts are equivalent and suitable for new designs. The R5F572TFGDFP#30 and R5F572TFCDFP#30 variants currently have higher inventory levels.

Q: Is the RXv3 core architecture identical across all three parts?

A: Yes. All variants use the RXv3 32-bit single-core processor architecture with identical instruction set, performance characteristics, and peripheral integration.