R5F5671EHGFM#10 Equivalent & Substitute Parts

Part Overview

The R5F5671EHGFM#10 is a 32-bit single-core microcontroller from Renesas Electronics Corporation's RX671 series, featuring the RXv3 processor architecture. This embedded IC operates at 120MHz with 2MB FLASH program memory, 384KB RAM, and 8KB EEPROM, packaged in a 64-LFQFP (10x10) surface mount configuration. The device integrates multiple connectivity interfaces including I2C, LINbus, QSPI, SCI, SPI, and USB, along with peripheral functions such as capacitive touch sensing, DMA, low-voltage detection, power-on reset, PWM, and watchdog timer. With an active product status and ROHS3 compliance, this microcontroller serves industrial and embedded applications requiring robust 32-bit processing capabilities. Equivalent substitute parts are identified based on identical electrical specifications and mechanical compatibility to support design flexibility and supply chain continuity.

Substiute Parts

R5F5671EHGFM#10

Renesas Electronics CorporationIn Stock: 939R5F5671EHGFM#10 Datasheet

Current PartRFQ

R5F5671EDGFM#30

Renesas Electronics CorporationIn Stock: 1589R5F5671EDGFM#30 Datasheet

Parametric EquivalentRFQ

R5F5671EHGFM#30

Renesas Electronics CorporationIn Stock: 1385R5F5671EHGFM#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the R5F5671EHGFM#10 are identified through parametric equivalence. The substitution logic is based on the following critical parameters that must remain identical:

Core Electrical Parameters:

• RXv3 core processor architecture
• 32-bit single-core configuration
• 120MHz operating frequency
• 2MB FLASH program memory (2M x 8)
• 384KB RAM (384K x 8)
• 8KB EEPROM (8K x 8)
• 44 I/O pins
• 2.7V to 3.6V supply voltage range
• 10x12-bit analog-to-digital converter
• Internal oscillator type
• -40°C to 105°C operating temperature range

Mechanical & Packaging Parameters:

• 64-LFQFP (10x10) package configuration
• Surface mount mounting type
• 64-LQFP case designation

Compliance Parameters:

• ROHS3 compliance status
• Active product status

The substitute parts R5F5671EDGFM#30 and R5F5671EHGFM#30 maintain identical electrical and mechanical specifications, differing only in packaging designation (tray) and moisture sensitivity level classification, which do not affect functional interchangeability in equivalent circuit applications.

Parameter Comparison

Engineering Selection Recommendations

All three microcontroller variants—R5F5671EHGFM#10, R5F5671EDGFM#30, and R5F5671EHGFM#30—are functionally equivalent for embedded applications requiring RX671 series performance. Selection between these parts is determined by supply chain availability and packaging designation requirements rather than electrical or mechanical differences.

Product Status Consideration: All substitute parts maintain active product status with Renesas Electronics Corporation, ensuring long-term availability and continued manufacturer support.

Compliance & Certification: All parts are ROHS3 compliant and carry identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, meeting regulatory requirements for industrial and commercial embedded applications.

Packaging & Moisture Sensitivity: The R5F5671EDGFM#30 and R5F5671EHGFM#30 variants include specified Moisture Sensitivity Level (MSL) 3 (168 Hours) and REACH Unaffected status, providing additional environmental handling documentation for supply chain management.

Inventory Availability: Current stock levels vary: R5F5671EHGFM#10 (841 pcs), R5F5671EDGFM#30 (1504 pcs), and R5F5671EHGFM#30 (1287 pcs), supporting procurement flexibility.

Frequently Asked Questions (FAQ)

Q: Are R5F5671EDGFM#30 and R5F5671EHGFM#30 direct substitutes for R5F5671EHGFM#10?

A: Yes. All three parts are parametrically equivalent with identical core processor architecture, clock speed, memory configuration, I/O count, voltage specifications, and operating temperature range. They are functionally interchangeable in circuit design and application firmware.

Q: What is the difference between the part number suffixes (#10, #30)?

A: The suffix designates the packaging quantity and handling specification. Both #10 and #30 variants use identical 64-LFQFP (10x10) package geometry and surface mount configuration. The difference relates to supplier packaging designation and moisture sensitivity documentation.

Q: Can I use R5F5671EDGFM#30 in place of R5F5671EHGFM#10 without PCB redesign?

A: Yes. Both parts use the 64-LQFP package with identical pin configuration, pitch, and mechanical dimensions. No PCB layout modifications are required for direct substitution.

Q: Are there any firmware compatibility issues when switching between these microcontroller variants?

A: No. All variants use the identical RXv3 core processor and instruction set. Firmware compiled for R5F5671EHGFM#10 executes without modification on R5F5671EDGFM#30 or R5F5671EHGFM#30.

Q: What is the significance of the MSL 3 (168 Hours) rating on the #30 variants?

A: Moisture Sensitivity Level 3 indicates the component can be stored in standard industrial conditions for up to 168 hours before soldering without baking. This specification applies to supply chain handling and does not affect electrical performance or long-term reliability in deployed applications.

Q: Do all three parts support the same connectivity interfaces?

A: Yes. All variants integrate I2C, LINbus, QSPI, SCI, SPI, and USB interfaces with identical peripheral functions including capacitive touch sensing, DMA, low-voltage detection, power-on reset, PWM, and watchdog timer.

Q: What is the operating voltage range for these microcontrollers?

A: All three parts operate within 2.7V to 3.6V supply voltage range, supporting both 3.3V and lower-voltage embedded system designs.

Q: Are these parts suitable for industrial temperature applications?

A: Yes. All variants support -40°C to 105°C operating temperature range, meeting industrial and automotive embedded system requirements.