R5F5671CDDFM#10 Equivalent & Substitute Parts

Part Overview

The R5F5671CDDFM#10 is a 32-bit single-core microcontroller from Renesas Electronics Corporation's RX671 series, featuring the RXv3 processor architecture. This embedded IC operates at 120MHz with 1.5MB of FLASH program memory, 384KB of RAM, and 8KB of EEPROM, packaged in a 64-LQFP surface mount configuration. The device integrates multiple connectivity interfaces including I2C, LINbus, QSPI, SCI, SPI, and USB, along with peripheral functions such as capacitive touch sensing, DMA, low-voltage detection, power-on reset, PWM, and watchdog timer capabilities. With an active product status and ROHS3 compliance, this microcontroller serves industrial and embedded applications requiring robust 32-bit processing with extensive I/O and memory resources. Equivalent substitute parts are identified based on identical electrical specifications, memory configurations, and mechanical packaging to ensure direct functional replacement in system designs.

Substiute Parts

R5F5671CDDFM#10

Renesas Electronics CorporationIn Stock: 708R5F5671CDDFM#10 Datasheet

Current PartRFQ

R5F5671CDDFM#30

Renesas Electronics CorporationIn Stock: 1296R5F5671CDDFM#30 Datasheet

Parametric EquivalentRFQ

R5F5671CHDFM#30

Renesas Electronics CorporationIn Stock: 1265R5F5671CHDFM#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the R5F5671CDDFM#10 are identified through strict parametric equivalence across all critical electrical and mechanical specifications. The substitution logic is based on the following key parameters that must remain identical:

Core Architecture & Performance: RXv3 processor, 32-bit single-core configuration, 120MHz clock speed Memory Configuration: 1.5MB FLASH program memory, 384KB RAM, 8KB EEPROM Connectivity & Peripherals: I2C, LINbus, QSPI, SCI, SPI, USB interfaces; Capacitive Touch, DMA, LVD, POR, PWM, WDT functions Electrical Characteristics: 2.7V to 3.6V supply voltage range, 10x12-bit A/D converters, 44 I/O pins Physical Package: 64-LQFP (10x10) surface mount configuration Compliance & Status: Active product status, ROHS3 compliance, identical ECCN and HTSUS classifications

The identified substitute parts maintain complete functional and electrical equivalence, differing only in packaging tape reel specifications (suffix designations #10 and #30) and moisture sensitivity level documentation where applicable.

Parameter Comparison

Engineering Selection Recommendations

All three microcontroller variants—R5F5671CDDFM#10, R5F5671CDDFM#30, and R5F5671CHDFM#30—are functionally equivalent for embedded system applications requiring RX671 series processing capabilities. Selection between these parts is determined by supply chain availability, packaging reel specifications, and moisture sensitivity level requirements rather than electrical or functional differences.

R5F5671CDDFM#10 serves as the primary reference part with 672 units in current inventory. This variant is suitable for standard production environments and applications where packaging tape reel configuration #10 meets procurement specifications.

R5F5671CDDFM#30 provides an alternative with higher inventory availability (1246 units) and documented moisture sensitivity level of 3 (168 hours). This variant is appropriate for applications requiring extended shelf life management and moisture-controlled storage protocols.

R5F5671CHDFM#30 offers equivalent functionality with 1174 units in stock and identical moisture sensitivity level documentation. This variant is interchangeable with R5F5671CDDFM#30 for applications where packaging reel specification #30 is required.

All three parts maintain active product status, ROHS3 compliance, and identical export control classifications (ECCN 3A991A2, HTSUS 8542.31.0001), ensuring regulatory consistency across design implementations. Selection should prioritize inventory availability and specific packaging requirements rather than technical performance criteria.

Frequently Asked Questions (FAQ)

Q: Are R5F5671CDDFM#10, R5F5671CDDFM#30, and R5F5671CHDFM#30 directly interchangeable in PCB designs?

A: Yes. All three parts share identical electrical specifications, memory configurations, I/O pin counts, and 64-LQFP (10x10) package dimensions. PCB layouts, schematic designs, and firmware implementations require no modification when substituting between these variants. Differences exist only in packaging tape reel specifications and moisture sensitivity level documentation.

Q: What does the suffix designation (#10 vs. #30) indicate?

A: The suffix designates the packaging tape reel configuration used by the manufacturer for component delivery. Both #10 and #30 specifications deliver the same microcontroller die and functionality; the difference relates to tape reel dimensions and component spacing for automated assembly equipment compatibility.

Q: Are there any compliance or regulatory differences between these three parts?

A: No. All three variants maintain identical ROHS3 compliance status, ECCN classification (3A991A2), and HTSUS code (8542.31.0001). Regulatory requirements and export control considerations are equivalent across all three part numbers.

Q: What is the significance of the Moisture Sensitivity Level (MSL) specification?

A: Moisture Sensitivity Level 3 (168 hours) indicates the maximum time the component can remain outside controlled humidity storage before requiring baking to remove absorbed moisture. R5F5671CDDFM#30 and R5F5671CHDFM#30 explicitly document this specification. For applications with extended lead times or variable storage conditions, this parameter influences inventory management and assembly floor procedures.

Q: Can I substitute R5F5671CDDFM#10 with R5F5671CHDFM#30 in an existing production design?

A: Yes. Both parts are functionally and electrically identical. The substitution requires only verification that the packaging reel specification (#30) is compatible with your assembly equipment and procurement workflow. No design changes, firmware modifications, or electrical validation are necessary.

Q: Which variant should I select for new design implementations?

A: Selection should be based on current inventory availability and packaging reel requirements for your manufacturing process. All three variants are active products with equivalent technical specifications. Consult your supply chain and assembly equipment specifications to determine the appropriate packaging configuration.