R5F56609GDFB#10 Equivalent & Substitute Parts

Part Overview

The R5F56609GDFB#10 is a 32-bit embedded microcontroller from Renesas Electronics Corporation's RX600 series. This RXv3 core processor operates at 120MHz and integrates 1MB of FLASH program memory, 128KB of RAM, and 32KB of EEPROM. The device features comprehensive connectivity options including CANbus, I2C, LINbus, SCI, and SPI interfaces, along with integrated peripherals such as DMA, PWM, WDT, LVD, and POR functions. Packaged in a 144-LQFP surface mount configuration with 130 I/O pins, this microcontroller is designed for industrial and embedded applications requiring robust real-time processing capabilities.

The R5F56609GDFB#10 maintains Active product status and full ROHS3 compliance. Equivalent substitute parts are identified based on identical electrical specifications, memory configurations, and packaging standards to ensure direct functional interchangeability in system designs.

Key Parameters

Parameter	Value
Manufacturer	Renesas Electronics Corporation
Series	RX600
Core Processor	RXv3
Core Size	32-Bit
Operating Frequency	120MHz
Program Memory Type	FLASH
Program Memory Size	1MB (1M x 8)
EEPROM Size	32K x 8
RAM Size	128K x 8
Supply Voltage Range	2.7V ~ 5.5V
A/D Converter	24x12-bit
D/A Converter	2x12-bit
I/O Count	130
Package Type	144-LQFP (20x20mm)
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the R5F56609GDFB#10 are identified through parametric equivalence analysis. The substitution logic is based strictly on the following critical parameters that determine functional interchangeability:

Core Electrical Specifications:

RXv3 core processor architecture
32-bit processing capability
120MHz operating frequency
1MB FLASH program memory (1M x 8 configuration)
128KB RAM (128K x 8 configuration)
32KB EEPROM (32K x 8 configuration)
2.7V to 5.5V supply voltage range
24x12-bit A/D converter and 2x12-bit D/A converter

Connectivity and Peripherals:

CANbus, EBI/EMI, I2C, LINbus, SCI, SPI interfaces
DMA, LVD, POR, PWM, WDT peripheral functions
130 I/O pins

Physical and Environmental Specifications:

144-LQFP (20x20mm) package configuration
Surface mount mounting type
-40°C to 85°C operating temperature range
ROHS3 compliance

Parts meeting all these parameters are classified as parametric equivalents and direct substitutes. Variations in packaging designations (suffix codes such as #10 and #30) and moisture sensitivity level classifications do not affect electrical or functional equivalence.

Parameter Comparison

Parameter	R5F56609GDFB#10	R5F56609GDFB#30	R5F56609HDFB#10
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Series	RX600	RX600	RX600
Core Processor	RXv3	RXv3	RXv3
Core Size	32-Bit	32-Bit	32-Bit
Operating Frequency	120MHz	120MHz	120MHz
Program Memory Type	FLASH	FLASH	FLASH
Program Memory Size	1MB (1M x 8)	1MB (1M x 8)	1MB (1M x 8)
EEPROM Size	32K x 8	32K x 8	32K x 8
RAM Size	128K x 8	128K x 8	128K x 8
Supply Voltage Range	2.7V ~ 5.5V	2.7V ~ 5.5V	2.7V ~ 5.5V
A/D Converter	24x12-bit	24x12-bit	24x12-bit
D/A Converter	2x12-bit	2x12-bit	2x12-bit
Connectivity	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
I/O Count	130	130	130
Package Type	144-LQFP (20x20mm)	144-LQFP (20x20mm)	144-LQFP (20x20mm)
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three microcontroller variants—R5F56609GDFB#10, R5F56609GDFB#30, and R5F56609HDFB#10—maintain Active product status from Renesas Electronics Corporation and satisfy ROHS3 compliance requirements. These parts are electrically and functionally equivalent across all specified parameters.

Selection between these parts is determined by supply chain availability and packaging designation requirements:

R5F56609GDFB#10: Primary part number with 746 units in current inventory stock.

R5F56609GDFB#30: Parametric equivalent with higher inventory availability (1220 units). Includes documented Moisture Sensitivity Level (MSL) rating of 3 (168 Hours) and REACH Unaffected status.

R5F56609HDFB#10: Parametric equivalent with highest inventory availability (1396 units). Includes documented Moisture Sensitivity Level (MSL) rating of 3 (168 Hours) and REACH Unaffected status. DiGi-Electronics programmability status is Not Verified.

For applications requiring documented moisture sensitivity specifications or REACH compliance verification, R5F56609GDFB#30 and R5F56609HDFB#10 provide explicit certification data. All three parts are suitable for direct substitution in system designs without modification to PCB layouts, firmware, or electrical interfaces.

Frequently Asked Questions (FAQ)

Q: Can R5F56609GDFB#30 be used as a direct replacement for R5F56609GDFB#10?

A: Yes. Both parts are parametric equivalents with identical electrical specifications, memory configurations, operating frequency, connectivity interfaces, and peripheral functions. The suffix designation (#10 vs. #30) indicates packaging or supply chain classification but does not affect functional performance or compatibility.

Q: What is the difference between R5F56609HDFB#10 and R5F56609GDFB#10?

A: Both parts are parametric equivalents with identical core specifications. The difference in the part number designation (H vs. G in the fifth character) reflects manufacturing or product line classification. All electrical parameters, memory sizes, operating frequency, and peripheral functions are identical. The parts are directly interchangeable.

Q: Are there any package or pinout differences between these substitute parts?

A: No. All three parts use the identical 144-LQFP (20x20mm) surface mount package with 130 I/O pins. PCB footprints, pin assignments, and mechanical dimensions are identical. No PCB redesign is required when substituting between these parts.

Q: Do these parts have different operating temperature ranges?

A: No. All three parts operate across the identical temperature range of -40°C to 85°C (TA). Thermal performance and environmental specifications are equivalent.

Q: What is the significance of the Moisture Sensitivity Level (MSL) rating?

A: MSL 3 (168 Hours) indicates the maximum time the component can be exposed to ambient conditions of 30°C and 85% relative humidity before soldering. R5F56609GDFB#30 and R5F56609HDFB#10 provide explicit MSL documentation. This specification is relevant for supply chain handling and storage procedures but does not affect electrical performance or functional equivalence.

Q: Can firmware developed for R5F56609GDFB#10 run on R5F56609GDFB#30 or R5F56609HDFB#10?

A: Yes. All three parts use the identical RXv3 core processor architecture, instruction set, and memory organization. Firmware compiled for one part executes identically on the others without modification.

Q: Are all three parts ROHS3 compliant?

A: Yes. R5F56609GDFB#10, R5F56609GDFB#30, and R5F56609HDFB#10 all maintain ROHS3 compliance status, meeting environmental and hazardous substance restrictions.

Q: What connectivity interfaces are supported by these microcontrollers?

A: All three parts support CANbus, EBI/EMI, I2C, LINbus, SCI, and SPI interfaces. Peripheral functions include DMA, LVD, POR, PWM, and WDT. These specifications are identical across all substitute parts.

Q: Is there a preferred part number for new designs?

A: Selection should be based on supply chain availability and specific compliance documentation requirements. All three parts are functionally equivalent. R5F56609GDFB#30 and R5F56609HDFB#10 offer higher inventory availability and explicit MSL and REACH compliance documentation.

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