R5F56609FDFP#10 Equivalent & Substitute Parts

Part Overview

The R5F56609FDFP#10 is a 32-bit RXv3 microcontroller from Renesas Electronics Corporation's RX600 series, designed for embedded applications requiring high-performance processing with integrated connectivity and data conversion capabilities. This device features 1MB of FLASH program memory, 128KB of RAM, and 32KB of EEPROM, operating at 120MHz with a supply voltage range of 2.7V to 5.5V. The part is housed in a 100-pin LQFP package and is ROHS3 compliant. Substitute parts are necessary when the primary part number becomes unavailable due to inventory constraints, supply chain disruptions, or packaging variations while maintaining identical electrical and mechanical specifications.

Substiute Parts

R5F56609FDFP#10

Renesas Electronics CorporationIn Stock: 984R5F56609FDFP#10 Datasheet

Current PartRFQ

R5F56609EDFP#30

Renesas Electronics CorporationIn Stock: 1434R5F56609EDFP#30 Datasheet

Parametric EquivalentRFQ

R5F56609FDFP#30

Renesas Electronics CorporationIn Stock: 1293R5F56609FDFP#30 Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the R5F56609FDFP#10 are determined by strict equivalence across all critical electrical and mechanical parameters. The substitution logic is based on the following key parameters that must remain identical:

Electrical Parameters:

• Core Processor: RXv3
• Core Size: 32-Bit
• Speed: 120MHz
• Program Memory: 1MB FLASH
• RAM: 128K x 8
• EEPROM: 32K x 8
• Voltage Supply: 2.7V ~ 5.5V
• Data Converters: A/D 24x12b, D/A 2x12b
• Connectivity: CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number of I/O: 90

Mechanical Parameters:

• Package / Case: 100-LQFP (14x14)
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C

Compliance Parameters:

• Series: RX600
• Product Status: Active
• RoHS Status: ROHS3 Compliant

The identified substitute parts maintain complete parametric equivalence with the main part number, differing only in packaging designation (tray packaging) and moisture sensitivity level specifications, which do not affect functional or electrical compatibility.

Parameter Comparison

Engineering Selection Recommendations

The R5F56609EDFP#30 and R5F56609FDFP#30 are direct parametric equivalents to the R5F56609FDFP#10. All three parts maintain identical electrical specifications, memory configurations, peripheral sets, and package dimensions. Selection between these parts is based on availability and inventory status rather than functional differences.

Selection Criteria:

1. Product Status: All three parts maintain Active status with Renesas Electronics Corporation, ensuring continued support and availability.

2. Compliance: All parts are ROHS3 compliant and carry identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, meeting regulatory requirements for equivalent deployment.

3. Packaging Designation: The suffix variations (#10, #30, #30) indicate packaging lot designations and moisture sensitivity level specifications. These designations do not affect electrical performance or mechanical compatibility in standard operating environments.

4. Inventory Availability: Current stock levels are R5F56609FDFP#10 (967 Pcs), R5F56609EDFP#30 (1395 Pcs), and R5F56609FDFP#30 (1254 Pcs). Selection should prioritize availability based on project timeline requirements.

5. Moisture Sensitivity Level (MSL): The substitute parts R5F56609EDFP#30 and R5F56609FDFP#30 specify MSL 3 (168 Hours). This specification does not impact functional equivalence and applies only to storage and handling conditions prior to assembly.

Frequently Asked Questions (FAQ)

Q1: Are R5F56609EDFP#30 and R5F56609FDFP#30 electrically identical to R5F56609FDFP#10?

A: Yes. All three parts share identical electrical specifications including processor architecture (RXv3), clock speed (120MHz), memory configuration (1MB FLASH, 128KB RAM, 32KB EEPROM), I/O count (90 pins), voltage supply range (2.7V to 5.5V), and peripheral sets (CANbus, SPI, I2C, SCI, LINbus, EBI/EMI, DMA, PWM, WDT, LVD, POR).

Q2: Can these parts be used interchangeably on the same PCB?

A: Yes. All three parts use identical 100-LQFP (14x14) surface mount packages with matching pin configurations, footprints, and electrical characteristics. No PCB redesign or layout modification is required for substitution.

Q3: What do the suffix designations (#10, #30) indicate?

A: The suffix designations represent packaging lot codes and moisture sensitivity level specifications assigned by Renesas Electronics Corporation. These designations do not affect functional performance or electrical compatibility.

Q4: Are there any temperature or voltage operating differences between these parts?

A: No. All three parts operate across the identical temperature range (-40°C to 85°C) and voltage supply range (2.7V to 5.5V). Operating characteristics are equivalent across all environmental conditions within these specifications.

Q5: Do the substitute parts have different RoHS compliance status?

A: No. All three parts maintain ROHS3 compliance status, meeting identical environmental and regulatory requirements for lead-free manufacturing and hazardous substance restrictions.

Q6: What is the significance of the MSL 3 (168 Hours) specification on the substitute parts?

A: MSL 3 (168 Hours) indicates the maximum time the component can be exposed to 30°C/85% relative humidity conditions before solder reflow assembly. This specification applies only to storage and handling prior to PCB assembly and does not affect post-assembly performance or reliability.

Q7: Are there any supply chain or long-term availability differences between these part numbers?

A: All three parts are manufactured by Renesas Electronics Corporation and maintain Active product status. Availability is subject to standard supply chain conditions. Current inventory levels show R5F56609EDFP#30 with the highest stock (1395 Pcs), followed by R5F56609FDFP#30 (1254 Pcs) and R5F56609FDFP#10 (967 Pcs).

Q8: Can firmware or software developed for R5F56609FDFP#10 run on the substitute parts without modification?

A: Yes. Identical processor architecture (RXv3), memory configuration, and peripheral sets ensure complete software compatibility. No firmware modifications are required for substitution.

Q9: Are there any certifications or compliance documents that differ between these parts?

A: No. All three parts share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, indicating equivalent export control and tariff treatment.

Q10: What factors should determine which substitute part to select?

A: Selection should be based on current inventory availability, project timeline requirements, and any specific moisture sensitivity level requirements for your assembly process. All three parts are functionally and electrically equivalent for standard operating environments.