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R5F56609DDFB#10 Equivalent & Substitute Parts
Part Overview
The R5F56609DDFB#10 is a 32-bit RXv3 microcontroller from Renesas Electronics Corporation's RX600 series, designed for embedded applications requiring high-performance processing with integrated connectivity and data conversion capabilities. This device features 1MB of FLASH program memory, 128KB of RAM, and 32KB of EEPROM, operating at 120MHz with a supply voltage range of 2.7V to 5.5V. The part is housed in a 144-LQFP surface mount package and maintains Active product status with ROHS3 compliance. Substitute parts are identified based on identical electrical specifications, mechanical compatibility, and functional equivalence within the RX600 microcontroller family.
Substiute Parts
Key Parameters
| Parameter | Specification |
|---|---|
| Core Processor | RXv3 |
| Core Size | 32-Bit |
| Clock Speed | 120MHz |
| Program Memory | 1MB (1M x 8) FLASH |
| RAM | 128K x 8 |
| EEPROM | 32K x 8 |
| Supply Voltage | 2.7V ~ 5.5V |
| Package Type | 144-LQFP (20x20) |
| Operating Temperature | -40°C ~ 85°C |
| Connectivity | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI |
| Data Converters | A/D 24x12b, D/A 2x12b |
| I/O Count | 131 |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitute parts for the R5F56609DDFB#10 are identified through strict parametric equivalence. The substitution logic is based on the following criteria:
Primary Equivalence Parameters:
- Identical core processor architecture (RXv3)
- Matching core size (32-Bit)
- Identical clock frequency (120MHz)
- Identical program memory capacity (1MB FLASH)
- Identical RAM capacity (128K x 8)
- Identical EEPROM capacity (32K x 8)
- Matching supply voltage range (2.7V ~ 5.5V)
- Identical package type (144-LQFP 20x20)
- Identical operating temperature range (-40°C ~ 85°C)
- Identical connectivity interfaces (CANbus, EBI/EMI, I2C, LINbus, SCI, SPI)
- Identical peripheral set (DMA, LVD, POR, PWM, WDT)
- Identical data converter specifications (A/D 24x12b, D/A 2x12b)
- Identical I/O count (131)
The identified substitute parts maintain full functional and electrical compatibility with the main part number, differing only in packaging designation or moisture sensitivity level specifications that do not affect core functionality.
Parameter Comparison
| Parameter | R5F56609DDFB#10 | R5F56609CDFB#30 | R5F56609DDFB#30 |
|---|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
| Series | RX600 | RX600 | RX600 |
| Core Processor | RXv3 | RXv3 | RXv3 |
| Core Size | 32-Bit | 32-Bit | 32-Bit |
| Clock Speed | 120MHz | 120MHz | 120MHz |
| Program Memory | 1MB (1M x 8) FLASH | 1MB (1M x 8) FLASH | 1MB (1M x 8) FLASH |
| RAM | 128K x 8 | 128K x 8 | 128K x 8 |
| EEPROM | 32K x 8 | 32K x 8 | 32K x 8 |
| Supply Voltage | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
| Package Type | 144-LQFP (20x20) | 144-LQFP (20x20) | 144-LQFP (20x20) |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Connectivity | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI | CANbus, EBI/EMI, I2C, LINbus, SCI, SPI |
| Data Converters | A/D 24x12b, D/A 2x12b | A/D 24x12b, D/A 2x12b | A/D 24x12b, D/A 2x12b |
| I/O Count | 131 | 131 | 131 |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Active | Active | Active |
| ECCN | 3A991A2 | 3A991A2 | 3A991A2 |
| HTSUS | 8542.31.0001 | 8542.31.0001 | 8542.31.0001 |
Engineering Selection Recommendations
All three microcontroller variants—R5F56609DDFB#10, R5F56609CDFB#30, and R5F56609DDFB#30—are functionally equivalent for embedded applications within the RX600 family. Selection between these parts should be based on the following engineering criteria:
Product Status and Availability: All three parts maintain Active product status from Renesas Electronics Corporation, ensuring continued support and availability for production designs.
Compliance and Regulatory: All parts are ROHS3 compliant and carry identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, meeting regulatory requirements for industrial and commercial applications.
Packaging Designation: The primary distinction between part numbers lies in packaging designation suffixes (#10, #30, #30). These designations reflect packaging and handling specifications that do not alter core electrical or functional characteristics.
Moisture Sensitivity: R5F56609CDFB#30 and R5F56609DDFB#30 include specified Moisture Sensitivity Level (MSL) 3 (168 Hours) and REACH Unaffected status, providing additional environmental compliance documentation for applications requiring detailed material traceability.
Inventory Considerations: Current stock levels are 931 units (R5F56609DDFB#10), 969 units (R5F56609CDFB#30), and 1085 units (R5F56609DDFB#30), all available as new original components.
Frequently Asked Questions (FAQ)
Q: Can R5F56609CDFB#30 and R5F56609DDFB#30 be used interchangeably with R5F56609DDFB#10?
A: Yes. All three parts are parametrically equivalent across all electrical specifications, memory configurations, clock speed, supply voltage range, package type, and operating temperature range. They are direct functional substitutes for each other.
Q: What is the significance of the packaging designation suffix (#10 vs. #30)?
A: The suffix indicates packaging and handling specifications. Both designations refer to Tray packaging with 144-LQFP (20x20) surface mount configuration. The suffix does not affect electrical performance or functional compatibility.
Q: Are there any differences in connectivity or peripheral support between these parts?
A: No. All three parts feature identical connectivity interfaces (CANbus, EBI/EMI, I2C, LINbus, SCI, SPI) and identical peripheral sets (DMA, LVD, POR, PWM, WDT). Data converter specifications are also identical (A/D 24x12b, D/A 2x12b).
Q: Do these parts have different operating temperature ranges?
A: No. All three parts operate across the identical temperature range of -40°C to 85°C (TA), suitable for industrial and automotive applications.
Q: What is the difference between MSL 3 (168 Hours) specification and parts without this designation?
A: Moisture Sensitivity Level (MSL) 3 (168 Hours) indicates the component can be exposed to moisture for up to 168 hours at specified humidity conditions before soldering. This specification is provided for R5F56609CDFB#30 and R5F56609DDFB#30 for enhanced environmental documentation. The absence of this specification in R5F56609DDFB#10 does not indicate reduced moisture resistance; it reflects different documentation standards.
Q: Are all three parts ROHS3 compliant?
A: Yes. All three parts are ROHS3 compliant, meeting European Union Restriction of Hazardous Substances regulations.
Q: Can these parts be used in designs originally specified for the RX600 series?
A: Yes. All three parts are members of the RX600 series with identical RXv3 core processor architecture, making them suitable for any design specified for RX600 microcontrollers with these memory and performance characteristics.
Q: What is the I/O pin count for these microcontrollers?
A: All three parts provide 131 I/O pins in the 144-LQFP package configuration.
Q: Are there any supply voltage differences between these parts?
A: No. All three parts operate across the identical supply voltage range of 2.7V to 5.5V, providing flexibility for both 3.3V and 5V system designs.
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