R5F56604GDFP#10 Equivalent & Substitute Parts

Part Overview

The R5F56604GDFP#10 is a 32-bit RXv3 microcontroller from Renesas Electronics Corporation's RX600 series, designed for embedded applications requiring high-performance processing with integrated connectivity and data conversion capabilities. This device features 512KB FLASH program memory, 128KB RAM, and 32KB EEPROM, operating at 120MHz with a comprehensive peripheral set including CANbus, I2C, LINbus, SCI, and SPI interfaces. The part is actively produced and widely deployed in industrial control, automotive, and communication systems. Identifying equivalent substitute parts ensures design flexibility, supply chain continuity, and procurement optimization while maintaining full functional compatibility.

Key Parameters

Parameter	Value
Manufacturer	Renesas Electronics Corporation
Series	RX600
Core Processor	RXv3
Core Size	32-Bit
Operating Speed	120MHz
Program Memory Type	FLASH
Program Memory Size	512KB (512K x 8)
EEPROM Size	32K x 8
RAM Size	128K x 8
Supply Voltage Range	2.7V ~ 5.5V
I/O Count	88
Package Type	100-LQFP (14x14)
Mounting Type	Surface Mount
Operating Temperature	-40°C ~ 85°C
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the R5F56604GDFP#10 are identified based on strict parametric equivalence within the RX600 microcontroller family. The substitution criteria are defined by the following parameters:

Core Substitution Parameters:

Identical RXv3 core processor architecture
Matching 32-bit core size
Identical 120MHz operating frequency
Identical 512KB FLASH program memory capacity
Identical 128KB RAM and 32KB EEPROM configuration
Identical 88 I/O pin count
Identical 100-LQFP (14x14) package footprint
Matching supply voltage range (2.7V ~ 5.5V)
Identical peripheral set: CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Identical data converter specifications: A/D 24x12b, D/A 2x12b
Identical operating temperature range (-40°C ~ 85°C)
Active product status with continuous manufacturing

The identified substitute parts R5F56604GDFP#30 and R5F56604HDFP#30 meet all core substitution parameters, differing only in packaging tray designation and moisture sensitivity level specifications, which do not affect functional or electrical compatibility in equivalent circuit applications.

Parameter Comparison

Parameter	R5F56604GDFP#10	R5F56604GDFP#30	R5F56604HDFP#30
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Series	RX600	RX600	RX600
Core Processor	RXv3	RXv3	RXv3
Core Size	32-Bit	32-Bit	32-Bit
Operating Speed	120MHz	120MHz	120MHz
Program Memory Size	512KB (512K x 8)	512KB (512K x 8)	512KB (512K x 8)
Program Memory Type	FLASH	FLASH	FLASH
EEPROM Size	32K x 8	32K x 8	32K x 8
RAM Size	128K x 8	128K x 8	128K x 8
Supply Voltage Range	2.7V ~ 5.5V	2.7V ~ 5.5V	2.7V ~ 5.5V
I/O Count	88	88	88
Connectivity	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI	CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT	DMA, LVD, POR, PWM, WDT
Data Converters	A/D 24x12b; D/A 2x12b	A/D 24x12b; D/A 2x12b	A/D 24x12b; D/A 2x12b
Oscillator Type	External, Internal	External, Internal	External, Internal
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	100-LQFP (14x14)	100-LQFP (14x14)	100-LQFP (14x14)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three microcontroller variants—R5F56604GDFP#10, R5F56604GDFP#30, and R5F56604HDFP#30—are active products manufactured by Renesas Electronics Corporation and maintain full parametric equivalence for embedded system applications. Selection among these parts is based on supply availability, packaging tray designation, and moisture sensitivity level requirements specific to manufacturing and storage conditions.

R5F56604GDFP#10 is suitable for applications where standard moisture sensitivity handling (MSL 3, 168 hours) is acceptable and tray packaging designation #10 aligns with procurement specifications.

R5F56604GDFP#30 provides identical electrical and functional characteristics with tray packaging designation #30, offering alternative supply chain sourcing while maintaining ROHS3 compliance and active product status.

R5F56604HDFP#30 represents a functionally equivalent alternative with identical core specifications, differing only in the device code letter (H versus G) and tray designation, while maintaining ROHS3 compliance and active manufacturing status.

All three parts are suitable for direct substitution in 100-LQFP surface mount applications requiring RX600 series microcontroller functionality, provided that PCB footprint and thermal management designs accommodate the 14x14mm package geometry.

Frequently Asked Questions (FAQ)

Q: Can R5F56604GDFP#30 be used as a direct replacement for R5F56604GDFP#10 in production designs?

A: Yes. Both parts are parametrically equivalent across all electrical, functional, and mechanical specifications. The difference in tray designation (#10 versus #30) reflects packaging batch identification and does not affect device performance, pinout, or electrical characteristics. PCB layout and firmware remain unchanged.

Q: What is the significance of the device code letter difference between R5F56604GDFP#30 and R5F56604HDFP#30?

A: The device code letter (G versus H) is a Renesas manufacturing designation that does not indicate functional differences for the specified parameters. Both variants maintain identical core processor, memory configuration, operating frequency, peripheral set, and package footprint. The letter designation reflects internal manufacturing or qualification batches.

Q: Are all three parts ROHS3 compliant?

A: Yes. R5F56604GDFP#10, R5F56604GDFP#30, and R5F56604HDFP#30 are all ROHS3 compliant, meeting environmental and hazardous substance restrictions for electronic components.

Q: Do the substitute parts require different PCB footprints?

A: No. All three parts use the identical 100-LQFP (14x14mm) package with 100 pins in a 14x14mm body. PCB footprint, land pattern, and via placement remain unchanged across all variants.

Q: What is the moisture sensitivity level (MSL) difference, and does it affect circuit design?

A: R5F56604GDFP#10 does not specify MSL in the provided data. R5F56604GDFP#30 and R5F56604HDFP#30 both specify MSL 3 (168 hours), which defines storage and handling conditions prior to soldering. MSL does not affect electrical performance, circuit design, or post-assembly operation. It impacts manufacturing logistics and component storage protocols.

Q: Can firmware developed for R5F56604GDFP#10 run on R5F56604GDFP#30 or R5F56604HDFP#30 without modification?

A: Yes. All three parts use the identical RXv3 core processor, instruction set, memory architecture, and peripheral configuration. Firmware compiled for one variant executes identically on all three parts without code modification or recompilation.

Q: Are there any supply voltage or operating temperature differences among the three parts?

A: No. All three parts operate across the identical supply voltage range (2.7V ~ 5.5V) and temperature range (-40°C ~ 85°C). Electrical operating specifications are fully equivalent.

Q: Which substitute part should be selected for new designs?

A: Selection is based on current supply availability and procurement requirements. All three parts are active products with equivalent functionality. Consult current inventory status and lead time data from authorized distributors to determine optimal part selection for new design qualification.

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