R5F56604BDFB#10 Equivalent & Substitute Parts

Part Overview

The R5F56604BDFB#10 is a 32-bit embedded microcontroller from Renesas Electronics Corporation's RX600 series. This RXv3 core processor operates at 120MHz and integrates 512KB of FLASH program memory, 128KB of RAM, and 32KB of EEPROM. The device features comprehensive connectivity options including CANbus, I2C, LINbus, SCI, and SPI interfaces, along with integrated peripherals such as DMA, PWM, WDT, LVD, and POR functions. Packaged in a 144-LQFP surface mount configuration with 133 I/O pins, this microcontroller is designed for industrial and embedded applications requiring robust communication and control capabilities.

The R5F56604BDFB#10 maintains Active product status and full ROHS3 compliance. Substitute parts are identified based on identical electrical specifications, memory configurations, and packaging standards to ensure direct functional replacement in existing designs.

Substiute Parts

R5F56604BDFB#10
Renesas Electronics CorporationIn Stock: 760R5F56604BDFB#10 Datasheet
R5F56604BDFB#10
Current Part
R5F56604ADFB#30
Renesas Electronics CorporationIn Stock: 1108R5F56604ADFB#30 Datasheet
R5F56604ADFB#30
Parametric Equivalent
R5F56604BDFB#30
Renesas Electronics CorporationIn Stock: 1033R5F56604BDFB#30 Datasheet
R5F56604BDFB#30
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RX600
Core Processor RXv3
Core Size 32-Bit
Operating Frequency 120MHz
Program Memory Type FLASH
Program Memory Size 512KB (512K x 8)
RAM Size 128K x 8
EEPROM Size 32K x 8
Supply Voltage Range 2.7V ~ 5.5V
Number of I/O Pins 133
Package Type 144-LQFP (20x20)
Mounting Type Surface Mount
Operating Temperature Range -40°C ~ 85°C
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the R5F56604BDFB#10 are identified through parametric equivalence across all critical electrical and mechanical specifications. The substitution logic is based on the following determinative parameters:

Core Architecture & Performance: RXv3 core processor, 32-bit architecture, 120MHz operating frequency

Memory Configuration: 512KB FLASH program memory, 128KB RAM, 32KB EEPROM

Electrical Characteristics: 2.7V to 5.5V supply voltage range, identical data converter specifications (24x12-bit A/D, 2x12-bit D/A)

Connectivity & Peripherals: CANbus, EBI/EMI, I2C, LINbus, SCI, SPI interfaces; DMA, LVD, POR, PWM, WDT peripherals; 133 I/O pins

Package & Form Factor: 144-LQFP surface mount package (20x20mm), identical pin count and layout

Compliance & Status: Active product status, ROHS3 compliance, identical ECCN and HTSUS classifications

Parts meeting all these parameters are classified as parametric equivalents and direct functional substitutes.

Parameter Comparison

Parameter R5F56604BDFB#10 R5F56604ADFB#30 R5F56604BDFB#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Series RX600 RX600 RX600
Core Processor RXv3 RXv3 RXv3
Core Size 32-Bit 32-Bit 32-Bit
Operating Frequency 120MHz 120MHz 120MHz
Program Memory Size 512KB (512K x 8) 512KB (512K x 8) 512KB (512K x 8)
RAM Size 128K x 8 128K x 8 128K x 8
EEPROM Size 32K x 8 32K x 8 32K x 8
Supply Voltage Range 2.7V ~ 5.5V 2.7V ~ 5.5V 2.7V ~ 5.5V
A/D Converter 24x12-bit 24x12-bit 24x12-bit
D/A Converter 2x12-bit 2x12-bit 2x12-bit
Number of I/O 133 133 133
Connectivity CANbus, EBI/EMI, I2C, LINbus, SCI, SPI CANbus, EBI/EMI, I2C, LINbus, SCI, SPI CANbus, EBI/EMI, I2C, LINbus, SCI, SPI
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Package Type 144-LQFP (20x20) 144-LQFP (20x20) 144-LQFP (20x20)
Mounting Type Surface Mount Surface Mount Surface Mount
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active
ECCN 3A991A2 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The R5F56604ADFB#30 and R5F56604BDFB#30 are direct parametric equivalents to the R5F56604BDFB#10. All three parts maintain identical electrical specifications, memory configurations, peripheral sets, and package standards. Selection among these parts is based on availability and supply chain requirements rather than functional differences.

All substitute parts maintain Active product status and ROHS3 compliance, ensuring regulatory alignment with the original part. The identical ECCN and HTSUS classifications confirm consistent export and tariff treatment across all three part numbers.

The 144-LQFP surface mount package is consistent across all variants, enabling direct PCB layout compatibility without design modifications. Pin count, I/O configuration, and signal assignments remain unchanged.

Frequently Asked Questions (FAQ)

Q: Are R5F56604ADFB#30 and R5F56604BDFB#30 direct replacements for R5F56604BDFB#10?

A: Yes. All three parts are parametric equivalents with identical core processor architecture, memory sizes, operating frequency, supply voltage range, I/O count, connectivity options, and peripheral configurations. The 144-LQFP package and pin assignments are identical, enabling direct substitution without design changes.

Q: What determines substitutability for RX600 series microcontrollers?

A: Substitutability is determined by matching the RXv3 core processor, 32-bit architecture, 120MHz frequency, 512KB FLASH/128KB RAM/32KB EEPROM configuration, 2.7V-5.5V supply range, 133 I/O pins, identical connectivity interfaces (CANbus, I2C, LINbus, SCI, SPI), and 144-LQFP package specification. Deviations in any of these parameters indicate non-equivalent parts.

Q: Do the substitute parts have the same package dimensions and pin layout?

A: Yes. All three parts use the 144-LQFP (20x20mm) surface mount package with identical pin assignments and I/O configuration. PCB footprints and layout designs are fully compatible.

Q: Are there differences in compliance or certifications between these parts?

A: No. All three parts maintain ROHS3 compliance, identical ECCN classification (3A991A2), and identical HTSUS code (8542.31.0001). Regulatory and export requirements are equivalent.

Q: What is the difference between the part number suffixes (#10, #30)?

A: The suffix designations reflect packaging and supply chain variants. The parametric specifications and functional performance remain identical. Selection is based on inventory availability and supplier logistics.

Q: Can these parts be used interchangeably in production?

A: Yes. The identical electrical specifications, memory configurations, peripheral sets, and package standards enable interchangeable use in production environments. No firmware modifications or PCB redesign is required.

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