R5F564MFHDLC#21 Equivalent & Substitute Parts

Part Overview

The R5F564MFHDLC#21 is a 32-bit single-core microcontroller from Renesas Electronics Corporation's RX600 series, operating at 120MHz with 2MB FLASH memory. This embedded IC is designed for applications requiring robust connectivity options including CANbus, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, and USB interfaces. The device is currently in active production status with full RoHS3 compliance and REACH unaffected certification. Identifying equivalent substitute parts is essential for supply chain continuity, inventory optimization, and design flexibility when the primary part becomes unavailable or when alternative sourcing is required.

Substiute Parts

R5F564MFHDLC#21
Renesas Electronics CorporationIn Stock: 1185R5F564MFHDLC#21 Datasheet
R5F564MFHDLC#21
Current Part
R5F564MFGDLC#21
Renesas Electronics CorporationIn Stock: 1351R5F564MFGDLC#21 Datasheet
R5F564MFGDLC#21
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RX600
Core Processor RXv2
Core Size 32-Bit Single-Core
Speed 120MHz
Program Memory Size 2MB (2M x 8)
Program Memory Type FLASH
EEPROM Size 64K x 8
RAM Size 552K x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V
Number of I/O 127
Package / Case 177-TFLGA (8x8)
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the R5F564MFHDLC#21 is determined by strict equivalence across the following critical parameters:

  • Processor Architecture: RXv2 core with identical instruction set compatibility
  • Memory Configuration: 2MB FLASH, 64K EEPROM, and 552K RAM must match exactly
  • Clock Speed: 120MHz operation required for timing-dependent applications
  • I/O Count: 127 I/O pins for pinout compatibility
  • Package Specification: 177-TFLGA (8x8) surface mount package for PCB layout compatibility
  • Voltage Range: 2.7V ~ 3.6V supply voltage specification
  • Connectivity Interfaces: CANbus, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB peripheral support
  • Compliance Standards: RoHS3 compliance and REACH unaffected status for regulatory alignment

Parts meeting all these parameters are classified as parametric equivalents and direct substitutes.

Parameter Comparison

Parameter R5F564MFHDLC#21 R5F564MFGDLC#21
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Series RX600 RX600
Core Processor RXv2 RXv2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 120MHz 120MHz
Program Memory Size 2MB (2M x 8) 2MB (2M x 8)
Program Memory Type FLASH FLASH
EEPROM Size 64K x 8 64K x 8
RAM Size 552K x 8 552K x 8
Voltage Supply (Vcc/Vdd) 2.7V ~ 3.6V 2.7V ~ 3.6V
Number of I/O 127 127
Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Package / Case 177-TFLGA (8x8) 177-TFLGA (8x8)
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
Product Status Active Active

Engineering Selection Recommendations

The R5F564MFGDLC#21 is a direct parametric equivalent to the R5F564MFHDLC#21. Both parts are manufactured by Renesas Electronics Corporation and share identical electrical, mechanical, and functional specifications across all critical parameters. Selection between these parts is based on availability and supply chain considerations rather than technical differentiation.

Both parts maintain active production status, ensuring long-term availability and supply reliability. Both comply with RoHS3 regulations and carry REACH unaffected certification, meeting current environmental and regulatory requirements for industrial and commercial applications. The identical MSL rating of 3 (168 Hours) ensures equivalent moisture sensitivity handling during storage and assembly processes.

Frequently Asked Questions (FAQ)

Q: Can R5F564MFGDLC#21 be used as a direct replacement for R5F564MFHDLC#21?

A: Yes. Both parts are parametric equivalents with identical processor architecture, memory configuration, clock speed, I/O count, package specification, voltage range, and peripheral interfaces. No design modifications are required for substitution.

Q: Are there any differences in pinout between these parts?

A: No. Both parts use the 177-TFLGA (8x8) surface mount package with 127 I/O pins in identical configuration. PCB layouts and connector assignments remain unchanged.

Q: Do both parts support the same connectivity interfaces?

A: Yes. Both parts support CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SCI, SPI, SSI, UART/USART, and USB interfaces with identical peripheral support including DMA, LVD, POR, PWM, and WDT.

Q: What is the difference between these part numbers?

A: The part numbers differ only in the suffix designation (MFHDLC vs. MFGDLC). This designation reflects internal Renesas manufacturing or packaging variation but does not affect electrical or functional performance.

Q: Are both parts RoHS3 compliant?

A: Yes. Both R5F564MFHDLC#21 and R5F564MFGDLC#21 are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.

Q: What is the MSL rating for these parts?

A: Both parts carry MSL rating 3 with a 168-hour moisture sensitivity window. Identical handling and storage protocols apply to both parts.

Q: Can firmware developed for one part be used on the other?

A: Yes. Both parts use the identical RXv2 processor architecture with 2MB FLASH memory. Firmware compiled for one part is compatible with the other without modification.

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