R5F212C7SNFP#V2 Equivalent & Substitute Parts

Part Overview

The R5F212C7SNFP#V2 is a 16-bit microcontroller from Renesas Electronics Corporation's R8C/2x/2C series, designed for embedded applications requiring moderate processing capability and integrated connectivity. This device features 48KB of FLASH program memory, operates at 20MHz, and supports multiple communication protocols including I2C, LINbus, SIO, SSU, and UART/USART. The part is currently in active production status with 1117 units available in stock. Equivalent and substitute parts are identified when design requirements change, inventory constraints occur, or when alternative performance specifications become necessary within the embedded microcontroller category.

Key Parameters

Parameter	Value
Manufacturer	Renesas Electronics Corporation
Series	R8C/2x/2C
Core Processor	R8C
Core Size	16-Bit
Operating Speed	20MHz
Program Memory	48KB FLASH
RAM Size	2.5K x 8
Supply Voltage	2.2V ~ 5.5V
Package Type	80-LQFP (12x12)
I/O Count	71
Operating Temperature	-20°C ~ 85°C
Product Status	Active
RoHS Compliance	ROHS3 Compliant

Substitute Part Grouping Explanation

The R5F111PEAFB#30 is identified as a substitute part based on the following substitution criteria:

Both devices are 16-bit microcontrollers manufactured by Renesas Electronics Corporation with active product status and ROHS3 compliance. Substitution is valid when the application requirements permit the following parameter variations:

Core Architecture: Transition from R8C core to RL78 core (both 16-bit architectures)
Operating Speed: Increase from 20MHz to 24MHz
Program Memory: Increase from 48KB to 64KB FLASH
RAM Capacity: Increase from 2.5K x 8 to 8K x 8
Supply Voltage Range: Narrower range (1.6V ~ 3.6V vs. 2.2V ~ 5.5V)
Package Format: Change from 80-LQFP to 100-LFQFP with different pin count (73 I/O vs. 71 I/O)
Operating Temperature: Extended lower limit (-40°C vs. -20°C)
Data Converters: Different A/D configuration (13x8/12b vs. 20x10b)
Additional Memory: Includes 8K x 8 EEPROM (not present in main part)

Parameter Comparison

Parameter	R5F212C7SNFP#V2	R5F111PEAFB#30
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation
Core Size	16-Bit	16-Bit
Operating Speed	20MHz	24MHz
Program Memory Type	FLASH	FLASH
Program Memory Size	48KB (48K x 8)	64KB (64K x 8)
RAM Size	2.5K x 8	8K x 8
Supply Voltage	2.2V ~ 5.5V	1.6V ~ 3.6V
Package Type	80-LQFP (12x12)	100-LFQFP (14x14)
I/O Count	71	73
Operating Temperature	-20°C ~ 85°C	-40°C ~ 85°C
Product Status	Active	Active
RoHS Compliance	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)	3 (168 Hours)
REACH Status	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

Selection between R5F212C7SNFP#V2 and R5F111PEAFB#30 is determined by application-specific requirements and design constraints:

R5F212C7SNFP#V2 is appropriate for applications requiring the R8C core architecture, lower pin count (80-LQFP), extended supply voltage range (2.2V ~ 5.5V), and the specific A/D converter configuration (20x10b). This device maintains active product status and ROHS3 compliance.

R5F111PEAFB#30 is appropriate for applications that can accommodate the RL78 core architecture, higher pin count (100-LFQFP), increased memory resources (64KB FLASH, 8K x 8 RAM, 8K x 8 EEPROM), higher operating speed (24MHz), and extended low-temperature operation (-40°C). This device also maintains active product status and ROHS3 compliance.

Both parts are manufactured by Renesas Electronics Corporation and meet identical compliance standards (ROHS3, REACH Unaffected, MSL 3). The choice depends on whether the application design can accommodate package size changes, voltage range constraints, and core architecture differences.

Frequently Asked Questions (FAQ)

Q: Can R5F111PEAFB#30 directly replace R5F212C7SNFP#V2 without design modifications?

A: Direct replacement is not possible without design modifications. The substitute part uses a different package format (100-LFQFP vs. 80-LQFP), different core architecture (RL78 vs. R8C), and different pin assignments. PCB layout and firmware must be evaluated for compatibility.

Q: What are the key differences in memory configuration?

A: R5F212C7SNFP#V2 provides 48KB FLASH and 2.5K x 8 RAM. R5F111PEAFB#30 provides 64KB FLASH, 8K x 8 RAM, and includes 8K x 8 EEPROM. The substitute offers significantly more program and working memory.

Q: Are there supply voltage compatibility concerns?

A: Yes. R5F212C7SNFP#V2 operates from 2.2V ~ 5.5V, while R5F111PEAFB#30 operates from 1.6V ~ 3.6V. Applications requiring 5V operation cannot use the substitute part without voltage regulation modifications.

Q: How do the package dimensions affect PCB design?

A: R5F212C7SNFP#V2 uses 80-LQFP (12x12mm), while R5F111PEAFB#30 uses 100-LFQFP (14x14mm). The substitute requires a larger footprint and different pin routing. Complete PCB redesign is necessary.

Q: Are both parts suitable for the same temperature range applications?

A: R5F212C7SNFP#V2 operates from -20°C ~ 85°C. R5F111PEAFB#30 operates from -40°C ~ 85°C. The substitute supports extended low-temperature operation, making it suitable for wider temperature range applications.

Q: Do both parts have identical connectivity options?

A: No. R5F212C7SNFP#V2 supports I2C, LINbus, SIO, SSU, and UART/USART. R5F111PEAFB#30 supports CSI, I2C, LINbus, and UART/USART. Connectivity differences must be evaluated for application requirements.

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