R5F10NLEDFB#30 Equivalent & Substitute Parts

Part Overview

The R5F10NLEDFB#30 is a 16-bit microcontroller from Renesas Electronics Corporation, part of the RL78/I1C series. This device integrates 64KB FLASH program memory, 2KB EEPROM, and 6KB RAM in a 64-pin LFQFP package. The product is discontinued at DiGi Electronics, making equivalent substitutes necessary for ongoing design requirements and production continuity. The RL78/I1C architecture supports multiple communication protocols including CSI, I2C, IrDA, LINbus, and UART/USART, with integrated LCD driver, low-voltage detection, power-on reset, PWM, and watchdog timer functionality.

Substiute Parts

R5F10NLEDFB#30
Renesas Electronics CorporationIn Stock: 112086R5F10NLEDFB#30 Datasheet
R5F10NLEDFB#30
Current Part
S9S12G64F0CLH
NXP SemiconductorsIn Stock: 1401S9S12G64F0CLH Datasheet
S9S12G64F0CLH
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Key Parameters

Parameter Value
Core Architecture 16-Bit
Operating Frequency 24MHz
Program Memory 64KB FLASH (64K x 8)
EEPROM Size 2K x 8
RAM Size 6K x 8
I/O Pins 35
Supply Voltage Range 1.7V ~ 5.5V
Package Type 64-LFQFP (10x10)
Operating Temperature -40°C ~ 85°C
RoHS Compliance ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the R5F10NLEDFB#30 is determined by the following critical parameters:

  • Core Architecture: 16-bit processor requirement
  • Program Memory Capacity: 64KB FLASH minimum
  • Package Compatibility: 64-pin LQFP form factor (10x10mm)
  • Supply Voltage Range: Overlap with 1.7V ~ 5.5V specification
  • Operating Temperature Range: -40°C ~ 85°C compatibility
  • Compliance Standards: ROHS3 and REACH compliance

The S9S12G64F0CLH from NXP Semiconductors meets these core substitution criteria. Both devices share identical program memory capacity (64KB FLASH), matching EEPROM size (2K x 8), compatible package geometry (64-LQFP 10x10), overlapping supply voltage ranges, identical operating temperature specifications, and equivalent compliance certifications.

Parameter Comparison

Parameter R5F10NLEDFB#30 (Renesas) S9S12G64F0CLH (NXP) Compatibility
Core Architecture 16-Bit RL78 16-Bit HCS12 Both 16-bit
Operating Frequency 24MHz 25MHz Compatible (NXP higher)
Program Memory 64KB FLASH 64KB FLASH Identical
EEPROM Size 2K x 8 2K x 8 Identical
RAM Size 6K x 8 4K x 8 NXP lower by 2KB
I/O Pins 35 54 NXP higher
Supply Voltage Range 1.7V ~ 5.5V 3.13V ~ 5.5V Partial overlap (3.13V ~ 5.5V)
Package Type 64-LFQFP (10x10) 64-LQFP (10x10) Compatible footprint
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) Identical

Engineering Selection Recommendations

The S9S12G64F0CLH qualifies as a functional substitute based on matching core memory specifications, package geometry, and compliance certifications. Both devices maintain ROHS3 compliance and identical MSL ratings, ensuring equivalent environmental and regulatory standing.

Key considerations for selection:

  • Supply Voltage: The NXP device operates from 3.13V minimum, eliminating compatibility for applications requiring operation below 3.13V. Designs utilizing the full 1.7V ~ 2.5V range of the Renesas part require alternative solutions.
  • RAM Capacity: The NXP substitute provides 2KB less RAM (4KB vs. 6KB). Applications with RAM-intensive algorithms must verify compatibility.
  • I/O Availability: The NXP device provides 54 I/O pins versus 35 on the Renesas part, offering expanded connectivity options.
  • Processor Architecture: Firmware migration from RL78 to HCS12 architecture requires code porting and validation.
  • Product Status: The NXP S9S12G64F0CLH maintains active product status with current inventory availability.

Frequently Asked Questions (FAQ)

Q: Can the S9S12G64F0CLH directly replace the R5F10NLEDFB#30 without PCB modifications?

A: The 64-LQFP package footprint is compatible with the 64-LFQFP package, allowing direct PCB placement. However, pin functionality differs between RL78 and HCS12 architectures, requiring firmware adaptation and validation of peripheral assignments.

Q: What is the minimum supply voltage difference between these devices?

A: The R5F10NLEDFB#30 operates from 1.7V, while the S9S12G64F0CLH requires minimum 3.13V. Applications operating below 3.13V cannot use the NXP substitute without external voltage regulation or alternative component selection.

Q: Are both devices suitable for industrial temperature applications?

A: Yes. Both devices specify identical operating temperature ranges of -40°C ~ 85°C and maintain ROHS3 compliance, supporting industrial deployment requirements.

Q: How does the RAM difference affect substitution feasibility?

A: The 2KB RAM reduction (from 6KB to 4KB) impacts applications with large data buffers or stack requirements. Designs utilizing less than 4KB RAM are unaffected; those exceeding 4KB require code optimization or alternative solutions.

Q: What compliance certifications apply to both devices?

A: Both devices are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with identical HTSUS code 8542.31.0001. Moisture sensitivity level is identical at MSL 3 (168 Hours).

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