R5F104LEDFB#X0 Equivalent & Substitute Parts

Part Overview

The R5F104LEDFB#X0 is a 16-bit RL78/G14 microcontroller manufactured by Renesas Electronics Corporation, featuring 64KB FLASH memory, 5.5KB RAM, and 4KB EEPROM. This device integrates 48 I/O pins, operates at 32MHz, and supports multiple connectivity protocols including CSI, I2C, LINbus, and UART/USART. The part is currently classified as obsolete, making equivalent substitutes necessary for ongoing design support and production continuity.

Substiute Parts

R5F104LEDFB#X0
Renesas Electronics CorporationIn Stock: 826R5F104LEDFB#X0 Datasheet
R5F104LEDFB#X0
Current Part
R5F104LEDFB#50
Renesas Electronics CorporationIn Stock: 1108R5F104LEDFB#50 Datasheet
R5F104LEDFB#50
Direct
R5F104LEAFA#50
Renesas Electronics CorporationIn Stock: 2003R5F104LEAFA#50 Datasheet
R5F104LEAFA#50
Parametric Equivalent
R5F104LEAFB#50
Renesas Electronics CorporationIn Stock: 946R5F104LEAFB#50 Datasheet
R5F104LEAFB#50
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RL78/G14
Core Processor RL78
Core Size 16-Bit
Speed 32MHz
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 5.5K x 8
Number of I/O 48
Voltage Supply (Vcc/Vdd) 1.6V ~ 5.5V
Data Converters A/D 12x8/10b
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the R5F104LEDFB#X0 is determined by strict equivalence across the following critical parameters:

  • Core processor architecture (RL78)
  • Memory configuration (64KB FLASH, 4KB EEPROM, 5.5KB RAM)
  • Operating frequency (32MHz)
  • I/O count (48 pins)
  • Voltage supply range (1.6V ~ 5.5V)
  • Package type (64-LQFP)
  • Connectivity and peripheral support (CSI, I2C, LINbus, UART/USART, DMA, LVD, POR, PWM, WDT)
  • Environmental compliance (RoHS3, MSL 3)

Substitutes are classified into two categories: direct manufacturer equivalents (differing only in packaging designation or tape & reel configuration) and parametric equivalents (matching all electrical and functional specifications with minor physical package variations).

Parameter Comparison

Parameter R5F104LEDFB#X0 R5F104LEDFB#50 R5F104LEAFA#50 R5F104LEAFB#50
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Series RL78/G14 RL78/G14 RL78/G14 RL78/G14
Core Processor RL78 RL78 RL78 RL78
Core Size 16-Bit 16-Bit 16-Bit 16-Bit
Speed 32MHz 32MHz 32MHz 32MHz
Program Memory Size 64KB (64K x 8) 64KB (64K x 8) 64KB (64K x 8) 64KB (64K x 8)
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 5.5K x 8 5.5K x 8 5.5K x 8 5.5K x 8
Number of I/O 48 48 48 48
Voltage Supply (Vcc/Vdd) 1.6V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V
Data Converters A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-LQFP 64-LQFP 64-LQFP 64-LQFP
Supplier Device Package 64-LFQFP (10x10) 64-LFQFP (10x10) 64-LQFP (12x12) 64-LFQFP (10x10)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
Product Status Obsolete Active Active Active

Engineering Selection Recommendations

All three substitute parts (R5F104LEDFB#50, R5F104LEAFA#50, R5F104LEAFB#50) are functionally equivalent to the R5F104LEDFB#X0 across all electrical and operational parameters. The primary distinction lies in product status and packaging configuration.

R5F104LEDFB#50 is the direct equivalent, differing only in tape & reel packaging designation. This part maintains active product status with Renesas Electronics Corporation and is recommended as the primary replacement for the obsolete R5F104LEDFB#X0.

R5F104LEAFA#50 and R5F104LEAFB#50 are parametric equivalents with identical electrical specifications. R5F104LEAFA#50 features a 12x12mm package footprint, while R5F104LEAFB#50 maintains the 10x10mm footprint. Both are supplied in tape & reel configuration and carry active product status. Selection between these variants depends on PCB layout constraints and available board space.

All substitute parts comply with RoHS3 requirements and maintain MSL 3 classification, ensuring compatibility with standard manufacturing and storage protocols.

Frequently Asked Questions (FAQ)

Q: Can R5F104LEDFB#50 be used as a direct replacement for R5F104LEDFB#X0?

A: Yes. R5F104LEDFB#50 is electrically and functionally identical to R5F104LEDFB#X0. The difference is packaging designation and active product status. Both share the same 64-LFQFP (10x10) footprint and all electrical specifications.

Q: What is the difference between R5F104LEAFA#50 and R5F104LEAFB#50?

A: Both parts are parametrically equivalent with identical electrical specifications. The primary difference is the physical package footprint: R5F104LEAFA#50 uses a 12x12mm package, while R5F104LEAFB#50 uses a 10x10mm package. PCB layout requirements determine which variant is appropriate.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts (R5F104LEDFB#50, R5F104LEAFA#50, R5F104LEAFB#50) are RoHS3 compliant with MSL 3 classification, matching the environmental compliance of the original R5F104LEDFB#X0.

Q: Why is R5F104LEDFB#X0 classified as obsolete?

A: The R5F104LEDFB#X0 has reached end-of-life status with Renesas Electronics Corporation. Active equivalents are available to support ongoing design requirements and production continuity.

Q: Do all substitute parts support the same connectivity protocols?

A: Yes. All substitute parts support identical connectivity: CSI, I2C, LINbus, and UART/USART, along with the same peripheral set (DMA, LVD, POR, PWM, WDT).

Q: What is the significance of the tape & reel (TR) packaging designation?

A: Tape & reel packaging indicates the parts are supplied on continuous carrier tape suitable for automated pick-and-place assembly. This is standard for high-volume production environments and does not affect electrical or functional performance.

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