R5F104LEAFB#10 Equivalent & Substitute Parts

Part Overview

The R5F104LEAFB#10 is a 16-bit embedded microcontroller from Renesas Electronics Corporation, part of the RL78/G14 series. This device integrates a 32MHz RL78 core processor with 64KB FLASH program memory, 4KB EEPROM, and 5.5KB RAM in a 64-pin LFQFP surface mount package (10x10mm footprint). The microcontroller provides comprehensive connectivity options including CSI, I2C, LINbus, and UART/USART interfaces, along with integrated peripherals such as DMA, LVD, POR, PWM, and WDT functionality. The device operates across a wide supply voltage range of 1.6V to 5.5V and supports an operating temperature range of -40°C to 85°C. With an active product status and ROHS3 compliance, the R5F104LEAFB#10 serves as a reliable solution for embedded control applications. Equivalent and substitute parts are identified based on matching core electrical specifications, memory configurations, and functional capabilities while accommodating variations in physical package dimensions and thermal grade designations.

Substiute Parts

R5F104LEAFB#10
Renesas Electronics CorporationIn Stock: 996R5F104LEAFB#10 Datasheet
R5F104LEAFB#10
Current Part
R5F104LEAFA#30
Renesas Electronics CorporationIn Stock: 1657R5F104LEAFA#30 Datasheet
R5F104LEAFA#30
Parametric Equivalent
R5F104LEAFB#30
Renesas Electronics CorporationIn Stock: 102282R5F104LEAFB#30 Datasheet
R5F104LEAFB#30
Parametric Equivalent
R5F104LEAFP#10
Renesas Electronics CorporationIn Stock: 1504R5F104LEAFP#10 Datasheet
R5F104LEAFP#10
Parametric Equivalent
R5F104LEAFP#30
Renesas Electronics CorporationIn Stock: 1646R5F104LEAFP#30 Datasheet
R5F104LEAFP#30
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RL78/G14
Core Processor RL78
Core Size 16-Bit
Speed 32MHz
Program Memory Size 64KB (64K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 5.5K x 8
Voltage Supply (Vcc/Vdd) 1.6V ~ 5.5V
Data Converters A/D 12x8/10b
Number of I/O 48
Connectivity CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 64-LQFP
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the R5F104LEAFB#10 are identified based on strict electrical and functional equivalence within the RL78/G14 microcontroller family. All substitute parts maintain identical specifications for the following critical parameters:

Core Electrical Specifications:

  • 16-bit RL78 core processor architecture
  • 32MHz operating frequency
  • 64KB FLASH program memory (64K x 8)
  • 4KB EEPROM (4K x 8)
  • 5.5KB RAM (5.5K x 8)
  • 1.6V to 5.5V supply voltage range
  • 12-bit analog-to-digital converter (12x8/10b)
  • 48 I/O pins
  • Identical connectivity: CSI, I2C, LINbus, UART/USART
  • Identical peripherals: DMA, LVD, POR, PWM, WDT
  • Operating temperature range: -40°C to 85°C

Allowable Variations: Substitute parts differ only in physical package dimensions and thermal grade designations (indicated by the suffix #10 or #30). These variations do not affect electrical functionality or performance characteristics. The package dimension variations include 64-LFQFP (10x10mm), 64-LQFP (12x12mm), and 64-LQFP (14x14mm) footprints. All substitute parts maintain ROHS3 compliance, MSL Level 3 rating, and REACH Unaffected status.

Parameter Comparison

Parameter R5F104LEAFB#10 R5F104LEAFA#30 R5F104LEAFB#30 R5F104LEAFP#10 R5F104LEAFP#30
Manufacturer Renesas Electronics Renesas Electronics Renesas Electronics Renesas Electronics Renesas Electronics
Series RL78/G14 RL78/G14 RL78/G14 RL78/G14 RL78/G14
Core Processor RL78 RL78 RL78 RL78 RL78
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 32MHz 32MHz 32MHz 32MHz 32MHz
Program Memory Size 64KB (64K x 8) 64KB (64K x 8) 64KB (64K x 8) 64KB (64K x 8) 64KB (64K x 8)
Program Memory Type FLASH FLASH FLASH FLASH FLASH
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 5.5K x 8 5.5K x 8 5.5K x 8 5.5K x 8 5.5K x 8
Voltage Supply (Vcc/Vdd) 1.6V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V 1.6V ~ 5.5V
Data Converters A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b
Number of I/O 48 48 48 48 48
Connectivity CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 64-LQFP 64-LQFP 64-LQFP 64-LQFP 64-LQFP
Supplier Device Package 64-LFQFP (10x10) 64-LQFP (12x12) 64-LFQFP (10x10) 64-LQFP (14x14) 64-LQFP (14x14)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected
Product Status Active Active Active Active Active

Engineering Selection Recommendations

All identified substitute parts for the R5F104LEAFB#10 maintain full electrical and functional equivalence within the RL78/G14 microcontroller family. Selection among these alternatives is determined by physical package requirements and PCB layout constraints rather than performance characteristics.

R5F104LEAFB#30 represents the highest inventory availability (102,196 units) and shares the identical 64-LFQFP (10x10mm) package footprint as the primary part, differing only in thermal grade designation (#30 versus #10). This part provides direct form-factor compatibility with existing PCB designs.

R5F104LEAFA#30 offers a 64-LQFP (12x12mm) package footprint, suitable for applications requiring a slightly larger physical envelope while maintaining the same electrical specifications and pin count.

R5F104LEAFP#10 and R5F104LEAFP#30 provide a 64-LQFP (14x14mm) package footprint, accommodating designs with more generous PCB spacing requirements. Both variants maintain identical electrical performance.

All substitute parts carry active product status, ROHS3 compliance, MSL Level 3 rating, and REACH Unaffected designation, ensuring regulatory and environmental compliance equivalent to the primary part. Component selection should be based on PCB layout compatibility, available inventory, and thermal grade requirements specific to the application.

Frequently Asked Questions (FAQ)

Q: What is the primary difference between R5F104LEAFB#10 and its substitutes?

A: The primary differences are physical package dimensions and thermal grade designations. All parts share identical electrical specifications, memory configurations, processor architecture, and functional capabilities. The suffix (#10 or #30) indicates thermal grade, while the package code (LEAFB, LEAFA, LEAFP) specifies the physical footprint dimensions.

Q: Can R5F104LEAFB#30 be used as a direct replacement for R5F104LEAFB#10?

A: Yes. Both parts use the identical 64-LFQFP (10x10mm) package footprint and share all electrical specifications. The thermal grade designation (#30 versus #10) does not affect functional compatibility or performance characteristics.

Q: What are the package dimension differences among the substitute parts?

A: R5F104LEAFB#10 and R5F104LEAFB#30 use 64-LFQFP (10x10mm) footprint. R5F104LEAFA#30 uses 64-LQFP (12x12mm) footprint. R5F104LEAFP#10 and R5F104LEAFP#30 use 64-LQFP (14x14mm) footprint. All maintain 64-pin configuration and identical electrical specifications.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All identified substitute parts carry ROHS3 compliance certification, matching the environmental and regulatory status of the primary R5F104LEAFB#10 part.

Q: What is the moisture sensitivity level for these microcontrollers?

A: All parts maintain MSL Level 3 rating with a 168-hour floor life specification, indicating identical moisture handling and storage requirements.

Q: Can I use a larger package footprint substitute on a PCB designed for the 10x10mm package?

A: No. PCB layout and footprint compatibility must be maintained. Larger package variants (12x12mm or 14x14mm) require corresponding PCB design modifications and cannot be used as direct drop-in replacements on boards designed for the 10x10mm footprint.

Q: Are the memory specifications identical across all substitute parts?

A: Yes. All substitute parts provide 64KB FLASH program memory, 4KB EEPROM, and 5.5KB RAM with identical organization (64K x 8, 4K x 8, and 5.5K x 8 respectively).

Q: Do all substitute parts support the same connectivity interfaces?

A: Yes. All parts support CSI, I2C, LINbus, and UART/USART connectivity interfaces with identical peripheral support including DMA, LVD, POR, PWM, and WDT functionality.

Q: What is the operating temperature range for these microcontrollers?

A: All parts operate across the temperature range of -40°C to 85°C (TA), providing identical thermal performance specifications.

Q: Are there any differences in supply voltage requirements?

A: No. All substitute parts operate across the identical supply voltage range of 1.6V to 5.5V (Vcc/Vdd).

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