R5F100MFGFB#V0 Equivalent & Substitute Parts

Part Overview

The R5F100MFGFB#V0 is a 16-bit RL78/G13 microcontroller manufactured by Renesas Electronics Corporation, featuring 96KB FLASH memory, 8KB EEPROM, and 8KB RAM in an 80-LFQFP (12x12) package. This part is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and production continuity. The RL78/G13 series provides integrated connectivity options including CSI, I2C, LINbus, and UART/USART interfaces, with comprehensive peripheral support for embedded applications requiring 16-bit processing at 32MHz.

Substiute Parts

R5F100MFGFB#V0
Renesas Electronics CorporationIn Stock: 1001R5F100MFGFB#V0 Datasheet
R5F100MFGFB#V0
Current Part
R5F100MFGFB#30
Renesas Electronics CorporationIn Stock: 1645R5F100MFGFB#30 Datasheet
R5F100MFGFB#30
Direct
R5F100MFGFA#10
Renesas Electronics CorporationIn Stock: 1688R5F100MFGFA#10 Datasheet
R5F100MFGFA#10
Parametric Equivalent
R5F100MFGFA#30
Renesas Electronics CorporationIn Stock: 1491R5F100MFGFA#30 Datasheet
R5F100MFGFA#30
Parametric Equivalent
R5F100MFGFB#10
Renesas Electronics CorporationIn Stock: 900R5F100MFGFB#10 Datasheet
R5F100MFGFB#10
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Renesas Electronics Corporation
Series RL78/G13
Core Processor RL78
Core Size 16-Bit
Speed 32MHz
Program Memory Size 96KB (96K x 8)
Program Memory Type FLASH
EEPROM Size 8K x 8
RAM Size 8K x 8
Voltage Supply (Vcc/Vdd) 2.4V ~ 5.5V
Number of I/O 64
Data Converters A/D 17x8/10b
Connectivity CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
Package / Case 80-LQFP
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the R5F100MFGFB#V0 is determined by strict equivalence across the following critical parameters:

Core Electrical & Functional Parameters (Must Match):

  • Series: RL78/G13
  • Core Processor: RL78
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Program Memory Size: 96KB (96K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 8K x 8
  • RAM Size: 8K x 8
  • Voltage Supply Range: 2.4V ~ 5.5V
  • Number of I/O: 64
  • Data Converters: A/D 17x8/10b
  • Connectivity: CSI, I2C, LINbus, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 80-LQFP
  • RoHS Status: ROHS3 Compliant

Allowable Variations:

  • Packaging format (Tray vs. other formats)
  • Supplier Device Package dimensions (80-LFQFP 12x12 vs. 80-LQFP 14x14)
  • Product status (Obsolete to Active transition)
  • Moisture Sensitivity Level (MSL) and REACH compliance certifications

All identified substitute parts maintain identical electrical specifications and functional capabilities while differing only in packaging configuration and product lifecycle status.

Parameter Comparison

Parameter R5F100MFGFB#V0 R5F100MFGFB#30 R5F100MFGFB#10 R5F100MFGFA#30 R5F100MFGFA#10
Manufacturer Renesas Electronics Renesas Electronics Renesas Electronics Renesas Electronics Renesas Electronics
Series RL78/G13 RL78/G13 RL78/G13 RL78/G13 RL78/G13
Core Processor RL78 RL78 RL78 RL78 RL78
Core Size 16-Bit 16-Bit 16-Bit 16-Bit 16-Bit
Speed 32MHz 32MHz 32MHz 32MHz 32MHz
Program Memory Size 96KB 96KB 96KB 96KB 96KB
EEPROM Size 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8
RAM Size 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8
Voltage Supply 2.4V ~ 5.5V 2.4V ~ 5.5V 2.4V ~ 5.5V 2.4V ~ 5.5V 2.4V ~ 5.5V
Number of I/O 64 64 64 64 64
Data Converters A/D 17x8/10b A/D 17x8/10b A/D 17x8/10b A/D 17x8/10b A/D 17x8/10b
Connectivity CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C -40°C ~ 105°C -40°C ~ 105°C -40°C ~ 105°C -40°C ~ 105°C
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount Surface Mount
Package / Case 80-LQFP 80-LQFP 80-LQFP 80-LQFP 80-LQFP
Supplier Device Package 80-LFQFP (12x12) 80-LFQFP (12x12) 80-LFQFP (12x12) 80-LQFP (14x14) 80-LQFP (14x14)
Product Status Obsolete Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
MSL Not specified 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
REACH Status Not specified REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

Primary Recommendation: R5F100MFGFB#30

The R5F100MFGFB#30 is the direct functional equivalent with identical electrical specifications and package dimensions (80-LFQFP 12x12). This part maintains active product status with full compliance documentation including MSL 3 (168 Hours) and REACH Unaffected certification. Selection of this part eliminates any PCB layout modifications while ensuring long-term supply availability.

Secondary Recommendation: R5F100MFGFB#10

The R5F100MFGFB#10 provides identical electrical and package specifications to the primary recommendation, differing only in packaging format (Tray). This part is suitable for applications where packaging format does not impact assembly or logistics requirements. Active product status and full compliance certifications apply.

Alternative Recommendations: R5F100MFGFA#30 and R5F100MFGFA#10

The R5F100MFGFA series variants maintain all electrical specifications and core functionality but feature different physical package dimensions (80-LQFP 14x14 vs. 80-LFQFP 12x12). These parts are suitable only for designs where PCB footprint modifications are acceptable. Both variants carry active product status with MSL 3 and REACH Unaffected certifications.

Product Status Consideration:

The original R5F100MFGFB#V0 is classified as obsolete. All identified substitutes carry active product status, ensuring continued manufacturing support, availability, and compliance with current regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can R5F100MFGFA#30 or R5F100MFGFA#10 be used as direct drop-in replacements?

A: These parts are electrically equivalent but feature different package dimensions (80-LQFP 14x14 vs. 80-LFQFP 12x12). PCB footprint modifications are required. R5F100MFGFB#30 or R5F100MFGFB#10 are true drop-in replacements with identical package dimensions.

Q: What is the difference between R5F100MFGFB#30 and R5F100MFGFB#10?

A: Both parts are electrically and functionally identical with the same package dimensions. The difference is packaging format: #30 is supplied in Tray format, while #10 is also supplied in Tray format. Selection depends on assembly and logistics requirements.

Q: Why is the original R5F100MFGFB#V0 marked as obsolete?

A: Product obsolescence is a standard lifecycle designation. All substitute parts carry active status, ensuring continued support and compliance with current manufacturing standards.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All identified substitute parts maintain ROHS3 compliance, matching the original part's environmental certification status.

Q: Do the substitute parts have the same electrical performance specifications?

A: Yes. All substitute parts maintain identical core processor architecture (RL78), clock speed (32MHz), memory configuration (96KB FLASH, 8KB EEPROM, 8KB RAM), I/O count (64), connectivity options (CSI, I2C, LINbus, UART/USART), and peripheral set (DMA, LVD, POR, PWM, WDT). Operating temperature range (-40°C ~ 105°C) and voltage supply range (2.4V ~ 5.5V) are identical.

Q: What is Moisture Sensitivity Level (MSL) and why does it matter?

A: MSL indicates the maximum time a component can be exposed to moisture at specified temperature and humidity conditions before soldering. MSL 3 (168 Hours) applies to all active substitute parts. The original obsolete part does not specify MSL. Compliance with MSL requirements is essential for manufacturing process control and reliability.

Q: Are there any connectivity or peripheral differences between substitute parts?

A: No. All substitute parts provide identical connectivity interfaces (CSI, I2C, LINbus, UART/USART) and peripheral support (DMA, LVD, POR, PWM, WDT). Firmware and application code compatibility is maintained across all substitutes.

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