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R5F100LEDFA#30 Equivalent & Substitute Parts
Part Overview
The R5F100LEDFA#30 is a 16-bit RL78/G13 microcontroller manufactured by Renesas Electronics Corporation, featuring 64KB FLASH memory, 4KB EEPROM, and 4KB RAM in a 64-LQFP (12x12) package. This embedded microcontroller operates at 32MHz with integrated connectivity options including CSI, I2C, LINbus, and UART/USART interfaces. The device is actively produced and ROHS3 compliant, making it suitable for industrial and consumer applications requiring reliable 16-bit processing capabilities. Equivalent and substitute parts are identified based on matching core processor architecture, memory configuration, operating specifications, and package compatibility to ensure functional interchangeability in system designs.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Renesas Electronics Corporation |
| Series | RL78/G13 |
| Core Processor | RL78 |
| Core Size | 16-Bit |
| Speed | 32MHz |
| Program Memory Size | 64KB (64K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 4K x 8 |
| RAM Size | 4K x 8 |
| Voltage Supply (Vcc/Vdd) | 1.6V ~ 5.5V |
| Number of I/O | 48 |
| Data Converters | A/D 12x8/10b |
| Connectivity | CSI, I2C, LINbus, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 64-LQFP |
| RoHS Status | ROHS3 Compliant |
| MSL Rating | 3 (168 Hours) |
| Product Status | Active |
Substitute Part Grouping Explanation
Substitute parts for the R5F100LEDFA#30 are identified based on strict equivalence of the following critical parameters:
- Core Architecture: RL78/G13 series processor
- Memory Configuration: 64KB FLASH, 4KB EEPROM, 4KB RAM
- Processing Speed: 32MHz operation
- Electrical Specifications: 1.6V ~ 5.5V supply voltage range
- Peripheral Set: Identical connectivity (CSI, I2C, LINbus, UART/USART) and peripherals (DMA, LVD, POR, PWM, WDT)
- I/O Count: 48 I/O pins
- Data Conversion: A/D 12x8/10b
- Compliance: ROHS3 compliant, MSL 3 rating
Substitutes are grouped into two categories based on package configuration: 64-LQFP (12x12) and 64-LFQFP (10x10) variants. The primary difference between substitute parts lies in packaging type (Tray) and package footprint dimensions, while maintaining identical electrical and functional specifications.
Parameter Comparison
| Parameter | R5F100LEDFA#30 | R5F100LEAFA#10 | R5F100LEAFA#30 | R5F100LEAFB#10 | R5F100LEAFB#30 |
|---|---|---|---|---|---|
| Manufacturer | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Series | RL78/G13 | RL78/G13 | RL78/G13 | RL78/G13 | RL78/G13 |
| Core Processor | RL78 | RL78 | RL78 | RL78 | RL78 |
| Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
| Speed | 32MHz | 32MHz | 32MHz | 32MHz | 32MHz |
| Program Memory | 64KB FLASH | 64KB FLASH | 64KB FLASH | 64KB FLASH | 64KB FLASH |
| EEPROM Size | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
| RAM Size | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 | 4K x 8 |
| Voltage Supply | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V |
| Number of I/O | 48 | 48 | 48 | 48 | 48 |
| Data Converters | A/D 12x8/10b | A/D 12x8/10b | A/D 12x8/10b | A/D 12x8/10b | A/D 12x8/10b |
| Connectivity | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART | CSI, I2C, LINbus, UART/USART |
| Peripherals | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT | DMA, LVD, POR, PWM, WDT |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 64-LQFP (12x12) | 64-LQFP (12x12) | 64-LQFP (12x12) | 64-LFQFP (10x10) | 64-LFQFP (10x10) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Active | Active | Active | Active | Active |
Engineering Selection Recommendations
All substitute parts listed maintain active product status with ROHS3 compliance and identical MSL ratings, ensuring regulatory and environmental compatibility with the original R5F100LEDFA#30 specification.
Selection between substitute parts depends on PCB layout requirements and package footprint constraints:
64-LQFP (12x12) Package Variants: R5F100LEAFA#10 and R5F100LEAFA#30 provide direct footprint compatibility with the original R5F100LEDFA#30 device. These variants differ only in packaging type (Tray) and inventory availability.
64-LFQFP (10x10) Package Variants: R5F100LEAFB#10 and R5F100LEAFB#30 offer a smaller package footprint while maintaining identical electrical and functional specifications. Selection of these variants requires PCB redesign to accommodate the reduced package dimensions.
All substitute parts share identical core processor architecture, memory configuration, operating frequency, voltage specifications, peripheral integration, and compliance certifications, ensuring functional interchangeability within the constraints of physical package compatibility.
Frequently Asked Questions (FAQ)
Q: Can R5F100LEAFA#10 or R5F100LEAFA#30 be used as direct replacements for R5F100LEDFA#30?
A: Yes. Both R5F100LEAFA#10 and R5F100LEAFA#30 are functionally and electrically equivalent to R5F100LEDFA#30. All three devices share identical 64-LQFP (12x12) package footprints, core processor architecture, memory configuration, and operating specifications. The primary difference is packaging type (Tray vs. original packaging). No PCB modifications are required for substitution.
Q: What is the difference between R5F100LEAFB#10 and R5F100LEAFB#30 compared to the original part?
A: R5F100LEAFB#10 and R5F100LEAFB#30 are electrically and functionally equivalent to R5F100LEDFA#30 but feature a smaller 64-LFQFP (10x10) package footprint instead of the 64-LQFP (12x12) package. All electrical specifications, memory configuration, and peripheral integration remain identical. PCB layout modifications are required to accommodate the different package dimensions.
Q: Are all substitute parts ROHS3 compliant?
A: Yes. All substitute parts listed—R5F100LEAFA#10, R5F100LEAFA#30, R5F100LEAFB#10, and R5F100LEAFB#30—are ROHS3 compliant with MSL 3 (168 Hours) ratings, matching the original R5F100LEDFA#30 specification.
Q: What determines whether a part can substitute for R5F100LEDFA#30?
A: Substitution eligibility is determined by matching the following parameters: RL78/G13 series processor, 64KB FLASH memory, 4KB EEPROM, 4KB RAM, 32MHz operating frequency, 1.6V ~ 5.5V supply voltage range, 48 I/O pins, identical connectivity (CSI, I2C, LINbus, UART/USART), identical peripherals (DMA, LVD, POR, PWM, WDT), A/D 12x8/10b data conversion capability, and -40°C ~ 85°C operating temperature range. Package footprint compatibility must also be verified for PCB integration.
Q: Can I use R5F100LEAFB variants if my PCB is designed for 64-LQFP (12x12) packages?
A: No. R5F100LEAFB#10 and R5F100LEAFB#30 use 64-LFQFP (10x10) packages, which have different pin layouts and physical dimensions. Using these parts in a PCB designed for 64-LQFP (12x12) packages will result in incompatibility. PCB redesign is required to accommodate the smaller package footprint.
Q: Are there inventory differences between substitute parts?
A: Yes. Inventory availability varies: R5F100LEDFA#30 (894 Pcs), R5F100LEAFA#10 (10,300 Pcs), R5F100LEAFA#30 (10,400 Pcs), R5F100LEAFB#10 (23,320 Pcs), and R5F100LEAFB#30 (3,208 Pcs). Inventory levels should be considered when selecting substitute parts for procurement planning.
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