Equivalent & Substitute Parts for R5F100LDGFB#10

Part Overview

The R5F100LDGFB#10 is a 16-bit RL78/G13 microcontroller manufactured by Renesas Electronics Corporation, featuring 48KB FLASH memory, 3KB RAM, and 4KB EEPROM. This embedded microcontroller operates at 32MHz with integrated connectivity options including CSI, I2C, LINbus, and UART/USART interfaces. The device is housed in a 64-LFQFP (10x10) surface mount package and maintains active product status with full RoHS3 compliance. Equivalent substitute parts are identified based on matching core electrical specifications, memory configurations, and functional capabilities while accommodating variations in packaging formats and tape reel configurations.

Substiute Parts

R5F100LDGFB#10
Renesas Electronics CorporationIn Stock: 1010R5F100LDGFB#10 Datasheet
R5F100LDGFB#10
Current Part
R5F100LDGFA#10
Renesas Electronics CorporationIn Stock: 2220R5F100LDGFA#10 Datasheet
R5F100LDGFA#10
Parametric Equivalent
R5F100LDGFA#30
Renesas Electronics CorporationIn Stock: 1895R5F100LDGFA#30 Datasheet
R5F100LDGFA#30
Parametric Equivalent
R5F100LDGFB#30
Renesas Electronics CorporationIn Stock: 1547R5F100LDGFB#30 Datasheet
R5F100LDGFB#30
Parametric Equivalent

Key Parameters

Parameter Specification
Manufacturer Renesas Electronics Corporation
Series RL78/G13
Core Processor RL78
Core Size 16-Bit
Speed 32MHz
Program Memory Size 48KB (48K x 8)
Program Memory Type FLASH
EEPROM Size 4K x 8
RAM Size 3K x 8
Voltage Supply (Vcc/Vdd) 2.4V ~ 5.5V
Number of I/O 48
Data Converters A/D 12x8/10b
Connectivity CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA)
Mounting Type Surface Mount
RoHS Status RoHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitute parts for the R5F100LDGFB#10 are identified based on electrical and functional equivalence within the RL78/G13 microcontroller family. All substitute parts maintain identical specifications across the following critical parameters:

  • Core processor architecture (RL78)
  • Core size (16-Bit)
  • Operating frequency (32MHz)
  • Program memory capacity (48KB FLASH)
  • EEPROM capacity (4K x 8)
  • RAM capacity (3K x 8)
  • Supply voltage range (2.4V ~ 5.5V)
  • I/O count (48 pins)
  • Data converter configuration (A/D 12x8/10b)
  • Connectivity interfaces (CSI, I2C, LINbus, UART/USART)
  • Peripheral set (DMA, LVD, POR, PWM, WDT)
  • Operating temperature range (-40°C ~ 105°C)
  • Compliance certifications (RoHS3, REACH Unaffected)

Variations between the main part and substitutes are limited to packaging format (64-LFQFP 10x10 versus 64-LQFP 12x12) and tape reel configuration designations (#10, #30). These packaging variations do not affect electrical functionality or performance characteristics.

Parameter Comparison

Parameter R5F100LDGFB#10 R5F100LDGFA#10 R5F100LDGFA#30 R5F100LDGFB#30
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Series RL78/G13 RL78/G13 RL78/G13 RL78/G13
Core Processor RL78 RL78 RL78 RL78
Core Size 16-Bit 16-Bit 16-Bit 16-Bit
Speed 32MHz 32MHz 32MHz 32MHz
Program Memory Size 48KB (48K x 8) 48KB (48K x 8) 48KB (48K x 8) 48KB (48K x 8)
Program Memory Type FLASH FLASH FLASH FLASH
EEPROM Size 4K x 8 4K x 8 4K x 8 4K x 8
RAM Size 3K x 8 3K x 8 3K x 8 3K x 8
Voltage Supply (Vcc/Vdd) 2.4V ~ 5.5V 2.4V ~ 5.5V 2.4V ~ 5.5V 2.4V ~ 5.5V
Number of I/O 48 48 48 48
Data Converters A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b A/D 12x8/10b
Connectivity CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART CSI, I2C, LINbus, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA) -40°C ~ 105°C (TA)
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Supplier Device Package 64-LFQFP (10x10) 64-LQFP (12x12) 64-LQFP (12x12) 64-LFQFP (10x10)
RoHS Status RoHS3 Compliant RoHS3 Compliant RoHS3 Compliant RoHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours) 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected REACH Unaffected
Product Status Active Active Active Active

Engineering Selection Recommendations

All substitute parts listed maintain active product status with Renesas Electronics Corporation and carry identical RoHS3 compliance and REACH unaffected certifications. Selection between R5F100LDGFB#10 and its substitutes is determined by printed circuit board layout requirements and packaging constraints.

R5F100LDGFB#10 and R5F100LDGFB#30 are functionally equivalent, both utilizing the 64-LFQFP (10x10) package format. The primary distinction is the tape reel configuration (#10 versus #30), which affects supply chain and procurement parameters but not electrical performance.

R5F100LDGFA#10 and R5F100LDGFA#30 employ the 64-LQFP (12x12) package format, which differs in physical dimensions from the LFQFP variant. PCB footprint design and component placement must accommodate the larger package dimensions. Both LQFP variants maintain identical electrical specifications and functional capabilities.

Selection of LFQFP (10x10) or LQFP (12x12) packaging is determined by available board space and design constraints. No electrical or functional differences exist between these package variants for this microcontroller series.

Frequently Asked Questions (FAQ)

Q: Are R5F100LDGFB#10 and R5F100LDGFA#10 electrically interchangeable?

A: Yes. Both parts share identical electrical specifications, memory configurations, operating frequency, supply voltage range, and peripheral sets. The primary difference is the package format: R5F100LDGFB#10 uses 64-LFQFP (10x10) while R5F100LDGFA#10 uses 64-LQFP (12x12). PCB footprint design must accommodate the selected package variant.

Q: What is the difference between #10 and #30 designations?

A: The #10 and #30 suffixes indicate different tape reel configurations for surface mount component packaging. These designations affect supply chain logistics and component handling but do not alter electrical performance or functional characteristics.

Q: Can I substitute R5F100LDGFB#10 with R5F100LDGFA#30?

A: Electrical substitution is valid. However, the 64-LQFP (12x12) package used in R5F100LDGFA#30 has different physical dimensions than the 64-LFQFP (10x10) package of R5F100LDGFB#10. PCB layout and footprint design must be modified to accommodate the larger package size.

Q: Do all substitute parts maintain the same compliance certifications?

A: Yes. All parts listed carry RoHS3 compliance and REACH unaffected status. Moisture sensitivity level is identical across all variants at MSL 3 (168 Hours).

Q: Are there memory differences between the main part and substitutes?

A: No. All parts feature identical memory configurations: 48KB FLASH program memory, 4KB EEPROM, and 3KB RAM.

Q: What connectivity interfaces are available on all substitute parts?

A: All substitute parts include CSI, I2C, LINbus, and UART/USART connectivity interfaces with identical peripheral support including DMA, LVD, POR, PWM, and WDT.

Q: Is the operating temperature range the same for all variants?

A: Yes. All parts operate across the identical temperature range of -40°C to 105°C (TA).

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