PMR780SN,115 N-Channel MOSFET Equivalent & Substitute Parts

Part Overview

The PMR780SN,115 is an N-Channel 60V 550mA surface mount MOSFET manufactured by NXP USA Inc. in the SC-75 package. This device is classified as obsolete, necessitating identification of active equivalent alternatives for new designs and production continuity. The part operates within the -55°C to 150°C temperature range and complies with RoHS3 and REACH standards. Substitute parts must maintain electrical compatibility across drain-source voltage, continuous drain current, on-resistance characteristics, and thermal performance parameters while accommodating different package form factors.

Key Parameters

Parameter	Value	Unit
Drain to Source Voltage (Vdss)	60	V
Continuous Drain Current (Id) @ 25°C	550	mA (Ta)
On-Resistance (Rds On Max) @ 300mA, 10V	920	mOhm
Gate Threshold Voltage (Vgs(th) Max) @ 250µA	3	V
Gate Charge (Qg Max) @ 10V	1.05	nC
Power Dissipation (Max)	530	mW (Tc)
Operating Temperature Range	-55 to 150	°C (TJ)
Package Type	SC-75, SOT-416	Surface Mount

Substitute Part Grouping Explanation

Substitution of the PMR780SN,115 is determined by the following critical electrical parameters:

Voltage Rating Compatibility: All substitute parts maintain the 60V Vdss rating, ensuring safe operation in circuits designed for the original component.

Current Handling: Substitute parts are grouped by continuous drain current capacity. The NX7002BKMYL provides the closest current match at 350mA, while NX7002AKW,115 and NX7002AK,215 operate at reduced current levels (170mA and 190mA respectively). Selection depends on circuit current requirements.

On-Resistance Characteristics: Rds On values vary across substitutes. The NX7002BKMYL exhibits 2.8mOhm @ 200mA, 10V, providing superior conductivity compared to the original 920mOhm specification. Lower on-resistance reduces power dissipation in high-current applications.

Gate Threshold Voltage: All substitutes maintain Vgs(th) at 2.1V @ 250µA, lower than the original 3V specification, enabling faster switching response.

Thermal Performance: Power dissipation ratings differ by package type. The NX7002BKMYL in SOT-883 offers 3.1W (Tc) thermal capability, significantly exceeding the original 530mW rating.

Package Considerations: Substitutes are available in TO-236AB, SOT-323, and SOT-883 packages. Package selection affects board layout, thermal management, and assembly compatibility.

Parameter Comparison

Parameter	PMR780SN,115	NX7002AK,215	NX7002AKW,115	NX7002BKMYL	Unit
Manufacturer	NXP USA Inc.	Nexperia USA Inc.	Nexperia USA Inc.	Nexperia USA Inc.	—
Product Status	Obsolete	Active	Active	Active	—
FET Type	N-Channel	N-Channel	N-Channel	N-Channel	—
Vdss	60	60	60	60	V
Id @ 25°C	550	190	170	350	mA (Ta)
Rds On (Max) @ 10V	920 @ 300mA	4.5 @ 100mA	4.5 @ 100mA	2.8 @ 200mA	mOhm
Vgs(th) (Max) @ 250µA	3	2.1	2.1	2.1	V
Qg (Max) @ Vgs	1.05 @ 10V	0.43 @ 4.5V	0.43 @ 4.5V	1 @ 10V	nC
Vgs (Max)	±20	±20	±20	±20	V
Ciss (Max) @ Vds	23 @ 30V	17 @ 10V	17 @ 10V	23.6 @ 10V	pF
Power Dissipation (Max)	530 (Tc)	265 (Ta), 1.33 (Tc)	220 (Ta), 1.06 (Tc)	350 (Ta), 3.1 (Tc)	mW
Operating Temperature	-55 to 150	-55 to 150	-55 to 150	-55 to 150	°C (TJ)
Package	SC-75, SOT-416	TO-236AB, SC-59, SOT-23-3	SOT-323, SC-70	SOT-883, SC-101	—
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	—
MSL	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	—

Engineering Selection Recommendations

For Applications Requiring Maximum Current Handling: The NX7002BKMYL is the preferred substitute when circuit design demands approach or exceed 350mA continuous drain current. This part maintains the closest electrical performance to the original PMR780SN,115 at 350mA rating and offers superior thermal dissipation at 3.1W (Tc). The SOT-883 package provides enhanced thermal coupling to PCB ground planes.

For Space-Constrained Designs: The NX7002AKW,115 in SOT-323 package offers the smallest footprint among active substitutes. This part is suitable for applications where continuous drain current does not exceed 170mA and board real estate is limited.

For Standard PCB Assembly Compatibility: The NX7002AK,215 in TO-236AB package provides compatibility with conventional surface mount assembly equipment and standard pick-and-place tooling. This part supports up to 190mA continuous drain current.

Compliance and Supply Continuity: All three substitute parts are manufactured by Nexperia USA Inc. and maintain active product status, ensuring long-term availability. All parts comply with RoHS3 and REACH standards with MSL rating of 1 (Unlimited), matching the original component's environmental certifications.

Thermal Considerations: Circuit designs operating near the original 530mW power dissipation limit should transition to the NX7002BKMYL to leverage its 3.1W (Tc) thermal capability, reducing junction temperature and improving reliability margins.

Frequently Asked Questions (FAQ)

Q: Can the NX7002AK,215 directly replace the PMR780SN,115 in existing PCB layouts?

A: Direct PCB replacement is not possible due to package differences. The PMR780SN,115 uses SC-75 (SOT-416) package, while the NX7002AK,215 uses TO-236AB (SOT-23-3) package. PCB layout modifications are required, including pad repositioning and trace routing adjustments.

Q: What is the primary limitation when substituting with NX7002AKW,115 or NX7002AK,215?

A: Both parts have reduced continuous drain current ratings (170mA and 190mA respectively) compared to the original 550mA specification. These substitutes are suitable only for applications where circuit current requirements do not exceed their rated limits.

Q: Why does the NX7002BKMYL have significantly lower on-resistance than the original part?

A: The NX7002BKMYL exhibits 2.8mOhm on-resistance compared to the original 920mOhm due to advanced semiconductor process technology and optimized die design. This characteristic reduces power dissipation in high-current switching applications.

Q: Are all substitute parts suitable for the same operating temperature range?

A: Yes. All substitute parts maintain the -55°C to 150°C (TJ) operating temperature range, matching the original PMR780SN,115 specification.

Q: What packaging considerations apply when selecting a substitute?

A: Package selection affects thermal performance, assembly compatibility, and board layout. The SOT-883 package (NX7002BKMYL) provides superior thermal dissipation through larger die attachment area. The TO-236AB package (NX7002AK,215) offers standard assembly compatibility. The SOT-323 package (NX7002AKW,115) minimizes board footprint for space-constrained applications.

Q: Do all substitute parts have identical gate threshold voltage characteristics?

A: No. The original PMR780SN,115 has Vgs(th) of 3V @ 250µA, while all three substitutes have Vgs(th) of 2.1V @ 250µA. The lower threshold voltage in substitutes enables faster switching response but may require gate drive circuit verification in existing designs.

Q: Which substitute part offers the best thermal performance?

A: The NX7002BKMYL provides maximum thermal capability at 3.1W (Tc), more than five times the original 530mW rating. This part is recommended for applications requiring enhanced thermal management or operating at elevated ambient temperatures.

Request Quote (Ships tomorrow)

Part Number

Quantity

Company

Contact Name

E-mail

Message