PLZ13C-G3/H Zener Diode Equivalent & Substitute Parts

Part Overview

The PLZ13C-G3/H is a 13 V, 500 mW Zener diode manufactured by Vishay General Semiconductor - Diodes Division in the DO-219AC (microSMF) surface mount package. This component is classified as an active product and is RoHS3 compliant. Substitute parts are identified when equivalent electrical and mechanical parameters are required for design flexibility, inventory management, or supply chain continuity while maintaining functional compatibility within the specified parameter tolerances.

Substiute Parts

PLZ13C-G3/H
Vishay General Semiconductor - Diodes DivisionIn Stock: 1256PLZ13C-G3/H Datasheet
PLZ13C-G3/H
Current Part
PLZ13A-G3/H
Vishay General Semiconductor - Diodes DivisionIn Stock: 1053PLZ13A-G3/H Datasheet
PLZ13A-G3/H
Parametric Equivalent
PLZ13B-G3/H
Vishay General Semiconductor - Diodes DivisionIn Stock: 23215PLZ13B-G3/H Datasheet
PLZ13B-G3/H
Parametric Equivalent
PLZ13C-HG3_A/H
Vishay General Semiconductor - Diodes DivisionIn Stock: 1818PLZ13C-HG3_A/H Datasheet
PLZ13C-HG3_A/H
Parametric Equivalent

Key Parameters

Parameter Value Unit
Voltage - Zener (Nominal) 13 V
Tolerance ±3 %
Power - Maximum 500 mW
Impedance (Maximum) 14 Ohms
Current - Reverse Leakage @ 10 V 200 nA
Voltage - Forward (Maximum) @ 10 mA 900 mV
Operating Temperature 150 °C
Package / Case DO-219AC (microSMF)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of Zener diodes within the PLZ13 series is determined by electrical parameter equivalence across the following criteria:

Primary Substitution Parameters:

  • Zener voltage nominal value: 13 V
  • Tolerance specification: ±3%
  • Maximum power dissipation: 500 mW
  • Package type: DO-219AC (microSMF)
  • Mounting configuration: Surface Mount
  • Maximum impedance: 14 Ohms
  • Reverse leakage current: 200 nA @ 10 V
  • Operating temperature rating: 150°C

Secondary Considerations:

  • Forward voltage specification (Vf @ 10 mA): 900 mV or 800 mV
  • Packaging format: Cut Tape (CT), Tape & Reel (TR), or Digi-Reel®
  • Automotive qualification (AEC-Q101) where applicable

All substitute parts maintain identical core electrical specifications and package geometry, ensuring direct functional replacement in circuit applications. Packaging format differences do not affect electrical performance and are selected based on procurement and assembly requirements.

Parameter Comparison

Parameter PLZ13C-G3/H PLZ13A-G3/H PLZ13B-G3/H PLZ13C-HG3_A/H
Voltage - Zener (Nom) 13 V 13 V 13 V 13 V
Tolerance ±3% ±3% ±3% ±3%
Power - Max 500 mW 500 mW 500 mW 500 mW
Impedance (Max) 14 Ohms 14 Ohms 14 Ohms 14 Ohms
Current - Reverse Leakage @ 10 V 200 nA 200 nA 200 nA 200 nA
Voltage - Forward (Max) @ 10 mA 900 mV 900 mV 800 mV 900 mV
Operating Temperature 150°C 150°C 150°C 150°C
Package / Case DO-219AC DO-219AC DO-219AC DO-219AC
Mounting Type Surface Mount Surface Mount Surface Mount Surface Mount
Packaging Format Cut Tape (CT) Tape & Reel (TR) Tape & Reel (TR) Cut Tape (CT) & Digi-Reel®
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Automotive Qualification Standard Standard Standard AEC-Q101

Engineering Selection Recommendations

PLZ13A-G3/H: Functionally equivalent to PLZ13C-G3/H with identical electrical specifications. Supplied in Tape & Reel (TR) format for automated assembly processes. Suitable for high-volume production environments requiring continuous reel packaging.

PLZ13B-G3/H: Functionally equivalent with forward voltage specification of 800 mV @ 10 mA, compared to 900 mV for the main part. All other electrical parameters remain identical. Supplied in Tape & Reel (TR) format. Highest inventory availability (23,135 pcs) among substitute options.

PLZ13C-HG3_A/H: Functionally equivalent to PLZ13C-G3/H with additional AEC-Q101 automotive qualification. Supplied in Cut Tape (CT) and Digi-Reel® formats. Suitable for automotive applications requiring formal qualification documentation. Identical electrical specifications to the main part.

All substitute parts are active products with RoHS3 compliance, REACH unaffected status, and unlimited moisture sensitivity level (MSL 1). Selection between substitutes is based on packaging format requirements, inventory availability, and automotive qualification needs rather than electrical performance differences.

Frequently Asked Questions (FAQ)

Q: Can PLZ13A-G3/H replace PLZ13C-G3/H in existing designs?

A: Yes. Both parts share identical zener voltage (13 V), tolerance (±3%), power rating (500 mW), impedance (14 Ohms), reverse leakage current (200 nA @ 10 V), and operating temperature (150°C). The primary difference is packaging format: PLZ13A-G3/H is supplied in Tape & Reel (TR) while PLZ13C-G3/H is supplied in Cut Tape (CT). Electrical performance is equivalent.

Q: What is the difference between PLZ13B-G3/H and PLZ13C-G3/H?

A: The forward voltage specification differs: PLZ13B-G3/H specifies 800 mV @ 10 mA while PLZ13C-G3/H specifies 900 mV @ 10 mA. All other electrical parameters are identical. Both are supplied in Tape & Reel (TR) format. The lower forward voltage of PLZ13B-G3/H may be advantageous in applications sensitive to forward voltage characteristics.

Q: Is PLZ13C-HG3_A/H suitable for automotive applications?

A: Yes. PLZ13C-HG3_A/H carries AEC-Q101 automotive qualification, making it suitable for automotive-grade applications. It maintains identical electrical specifications to PLZ13C-G3/H and is supplied in Cut Tape (CT) and Digi-Reel® formats.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All parts in this substitution group (PLZ13C-G3/H, PLZ13A-G3/H, PLZ13B-G3/H, and PLZ13C-HG3_A/H) are RoHS3 compliant and REACH unaffected.

Q: What packaging formats are available for these Zener diodes?

A: PLZ13C-G3/H and PLZ13C-HG3_A/H are supplied in Cut Tape (CT) format. PLZ13A-G3/H and PLZ13B-G3/H are supplied in Tape & Reel (TR) format. PLZ13C-HG3_A/H is also available in Digi-Reel® format. Selection depends on assembly process requirements and volume specifications.

Q: Can these parts be used interchangeably in PCB assembly?

A: Yes, provided the PCB design accommodates the selected packaging format. All parts use the same DO-219AC (microSMF) surface mount package and have identical pin configurations. Tape & Reel (TR) format is standard for automated pick-and-place assembly, while Cut Tape (CT) is suitable for manual or lower-volume assembly processes.

Q: What is the moisture sensitivity level (MSL) for these parts?

A: All parts in this group have MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. These components do not require special moisture control during storage or handling.

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