PL686-35DC Equivalent & Substitute Parts

Part Overview

The PL686-35DC is a Clock Buffer/Driver IC manufactured by Microchip Technology, designed as a 1:1 170 MHz die-level component. This part accepts crystal input and provides LVPECL output, operating within a 2.97V to 3.63V supply range. The PL686-35DC is classified as obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.

Substiute Parts

PL686-35DC

Microchip TechnologyIn Stock: 749PL686-35DC Datasheet

Current PartRFQ

PL583000XC

Microchip TechnologyIn Stock: 1256PL583000XC Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PL686-35DC is determined by the following critical parameters:

• Manufacturer: Microchip Technology (primary source for compatible timing solutions)
• Category: Clock/Timing integrated circuits
• Functional Type: Buffer/Driver with fanout capability
• Input/Output Characteristics: Crystal input with LVPECL or compatible output
• Frequency Range: Maximum operating frequency of 170 MHz or higher
• Supply Voltage: 2.97V to 3.63V compatibility
• Compliance: ROHS3 compliance and EAR99 classification
• Packaging: Surface mount configurations suitable for die-level or packaged implementations

The PL583000XC represents an active alternative from Microchip Technology's clock buffer product line, offering fanout buffer functionality within the same electrical and compliance framework.

Parameter Comparison

Engineering Selection Recommendations

The PL583000XC is an active product from Microchip Technology and represents a current-generation alternative to the obsolete PL686-35DC. Both components share identical ROHS3 compliance status, EAR99 export classification, and HTSUS commodity coding, ensuring regulatory and compliance alignment.

The primary distinction lies in product status: the PL686-35DC is obsolete, while the PL583000XC maintains active manufacturing status with confirmed inventory availability. The PL583000XC is packaged in 32LQFP format, contrasting with the die-level packaging of the PL686-35DC. The moisture sensitivity level differs, with the PL583000XC rated at MSL 3 (168 hours) compared to MSL 1 (unlimited) for the original part.

Selection of the PL583000XC is appropriate for applications requiring active product support, current manufacturing availability, and compliance with modern supply chain requirements.

Frequently Asked Questions (FAQ)

Q: Can the PL583000XC directly replace the PL686-35DC in existing designs?

A: The PL583000XC differs in package format (32LQFP versus die) and moisture sensitivity rating. Direct PCB-level substitution requires evaluation of physical footprint compatibility and handling procedures. Both components maintain identical compliance classifications and manufacturer origin.

Q: What is the significance of the product status difference?

A: The PL686-35DC is classified as obsolete, indicating discontinued manufacturing and limited long-term availability. The PL583000XC maintains active status with ongoing production and supply chain support from Microchip Technology.

Q: How do the moisture sensitivity levels affect component handling?

A: The PL686-35DC carries MSL 1 (unlimited shelf life without moisture control), while the PL583000XC carries MSL 3 (168-hour maximum floor life after moisture exposure). The PL583000XC requires stricter moisture management protocols during storage and assembly operations.

Q: Are both components compliant with current regulatory requirements?

A: Both the PL686-35DC and PL583000XC are ROHS3 compliant and classified under EAR99 export control. Both share identical HTSUS commodity classification (8542.39.0001), ensuring regulatory alignment for procurement and international distribution.

Q: What packaging considerations apply to these components?

A: The PL686-35DC is supplied as a die, requiring specialized handling and integration into hybrid or multi-chip module assemblies. The PL583000XC is packaged in 32LQFP format, suitable for standard surface mount assembly processes and conventional PCB integration.