PL685-28DC Equivalent & Substitute Parts

Part Overview

The PL685-28DC is a clock buffer die manufactured by Microchip Technology, designed for high-speed timing applications with a maximum frequency of 250MHz. This component features PLL functionality with crystal input and LVPECL output configuration. The part is classified as obsolete, making identification of suitable substitute components essential for ongoing system support and new design implementations.

Substiute Parts

PL685-28DC

Microchip TechnologyIn Stock: 846PL685-28DC Datasheet

Current PartRFQ

PL683000XC

Microchip TechnologyIn Stock: 1022PL683000XC Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PL685-28DC requires evaluation based on the following critical parameters:

• Frequency capability: Maximum operating frequency of 250MHz
• PLL functionality: Presence of phase-locked loop circuitry
• Input/Output configuration: Crystal input with LVPECL output
• Voltage supply range: 2.97V to 3.63V operation
• Package compatibility: Die form factor for direct integration
• Compliance standards: ROHS3 compliance and EAR99 classification

The substitute part PL683000XC is a packaged version (32LQFP) of the base PL683000 platform from Microchip Technology. While this part shares the same manufacturer and clock buffer functionality, it represents a different product form factor and integration approach compared to the die-level PL685-28DC.

Parameter Comparison

Engineering Selection Recommendations

The PL683000XC serves as an active alternative to the obsolete PL685-28DC within the Microchip Technology clock buffer product line. Both components maintain ROHS3 compliance and identical trade classification codes, supporting regulatory consistency in system designs.

The primary distinction between these components is packaging: the PL685-28DC is supplied as a die for direct integration into hybrid or custom packaging solutions, while the PL683000XC is provided in a 32-pin LQFP package for standard PCB assembly. This packaging difference necessitates evaluation of your specific integration requirements and board-level design constraints.

Selection of PL683000XC is appropriate when standard surface-mount packaging is compatible with your application requirements and when the active product status provides supply chain advantages over the obsolete PL685-28DC.

Frequently Asked Questions (FAQ)

Q: Can PL683000XC directly replace PL685-28DC in existing designs?

A: Direct replacement depends on your integration method. The PL685-28DC die format requires custom packaging or hybrid integration, while PL683000XC uses standard 32LQFP packaging. If your current design uses the die form factor, PL683000XC requires PCB redesign to accommodate the packaged component.

Q: What are the key functional differences between these parts?

A: Both components are Microchip Technology clock buffers within the same product category. The provided specifications do not include detailed functional parameters for PL683000XC that would establish specific performance differences beyond packaging format.

Q: Why is PL685-28DC classified as obsolete?

A: Microchip Technology has transitioned this die-level product to obsolete status. The PL683000 series represents the active product line for clock buffer functionality, available in standard packaging formats.

Q: Are there supply considerations when transitioning from PL685-28DC?

A: Yes. The PL685-28DC is obsolete with limited remaining inventory. The PL683000XC is an active product with current manufacturing support, providing improved long-term availability for new designs and ongoing production requirements.

Q: Do both parts meet the same compliance standards?

A: Both components are ROHS3 compliant and classified under identical ECCN and HTSUS codes, supporting equivalent regulatory compliance in system applications.