PL586-55DC Equivalent & Substitute Parts

Part Overview

The PL586-55DC is a Clock Buffer/Driver IC manufactured by Microchip Technology, designed as a 1:1 160 MHz die-form clock buffer with LVPECL output. This component is classified as obsolete, which necessitates identification of functionally equivalent alternatives for ongoing design support and procurement planning. The part operates within a supply voltage range of 2.97V to 3.63V and is suitable for applications requiring high-speed clock distribution in surface mount configurations.

Substiute Parts

PL586-55DC

Microchip TechnologyIn Stock: 1122PL586-55DC Datasheet

Current PartRFQ

PL683000XC

Microchip TechnologyIn Stock: 1022PL683000XC Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PL586-55DC is determined by the following critical parameters:

• Manufacturer: Microchip Technology (maintained for design continuity and technical support)
• Category: Clock/Timing (functional classification)
• Type: Buffer/Driver (circuit topology)
• Ratio - Input:Output: 1:1 (signal distribution architecture)
• Frequency - Max: 160 MHz (operational bandwidth requirement)
• Output Type: LVPECL (signal standard compatibility)
• Voltage - Supply: 2.97V ~ 3.63V (power supply compatibility)
• RoHS Status: ROHS3 Compliant (regulatory compliance)

The substitute part PL683000XC is classified as an active product from Microchip Technology within the Clock/Timing category. While the substitute operates as a clock buffer IC, it is packaged in 32LQFP format rather than die form, representing a transition from bare die to packaged component solutions.

Parameter Comparison

Engineering Selection Recommendations

The PL683000XC is designated as the manufacturer-recommended substitute for the obsolete PL586-55DC. Both components maintain ROHS3 compliance and identical export classification (EAR99), ensuring regulatory consistency in design transitions.

The primary distinction between these components is the packaging format: the original part is supplied as a bare die, while the substitute is provided in 32LQFP package form. This transition requires evaluation of board-level integration requirements, as die-form components typically demand specialized handling and assembly processes, whereas packaged components integrate directly into standard surface mount assembly workflows.

The moisture sensitivity level increases from MSL 1 (unlimited shelf life) to MSL 3 (168-hour storage window), which impacts storage and handling protocols during procurement and assembly operations.

Frequently Asked Questions (FAQ)

Q: Can PL683000XC directly replace PL586-55DC in existing designs?

A: Functional equivalence is established through matching manufacturer, category, and clock buffer classification. However, the packaging transition from die to 32LQFP requires board redesign and assembly process modification. Direct socket replacement is not possible.

Q: What are the implications of the MSL rating change from 1 to 3?

A: MSL 1 allows unlimited shelf storage without baking requirements. MSL 3 requires component usage within 168 hours of package opening, necessitating controlled storage conditions and inventory management procedures aligned with assembly schedules.

Q: Are both parts RoHS compliant?

A: Yes, both PL586-55DC and PL683000XC are ROHS3 compliant, maintaining regulatory alignment for applications subject to RoHS directives.

Q: What is the significance of the active product status for PL683000XC?

A: Active product status indicates ongoing manufacturer support, availability through distribution channels, and continued technical documentation updates. This contrasts with the obsolete status of PL586-55DC, which has reached end-of-life.

Q: Are there supply voltage or frequency differences between these parts?

A: The provided specifications do not include detailed electrical parameters for PL683000XC beyond the clock buffer classification. Verification of supply voltage range and maximum frequency specifications against the original part requirements is necessary during design transition planning.