PL585-88DC Equivalent & Substitute Parts

Part Overview

The PL585-88DC is an IC clock buffer die manufactured by Microchip Technology, designed for 800MHz clock distribution applications. This component operates as a single-circuit clock buffer with PLL functionality, accepting crystal input and delivering LVPECL output with a 1:2 input-to-output ratio.

The PL585-88DC is classified as obsolete. Locating equivalent or substitute components is necessary for new designs, production continuity, or system upgrades where die-level packaging is not feasible or where active product alternatives are preferred.

Substiute Parts

PL585-88DC

Microchip TechnologyIn Stock: 870PL585-88DC Datasheet

Current PartRFQ

PL683000XC

Microchip TechnologyIn Stock: 1022PL683000XC Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PL585-88DC is based on the following critical parameters:

• Manufacturer continuity: Microchip Technology maintains the primary source for equivalent clock buffer solutions
• Functional equivalence: Input type (Crystal), output type (LVPECL), and frequency capability (800MHz maximum)
• Circuit configuration: Single-circuit PLL-based clock buffer with divider capability
• Supply voltage compatibility: Operating range 2.97V ~ 3.63V
• Compliance standards: RoHS3 compliance and EAR99 export classification

The PL683000XC is identified as the manufacturer-recommended substitute. This part maintains functional equivalence through identical input/output signal types, frequency capability, and supply voltage specifications. The primary distinction is packaging: the PL683000XC is supplied in 32LQFP surface-mount form factor rather than die form, and carries active product status with ongoing manufacturer support.

Parameter Comparison

Engineering Selection Recommendations

The PL683000XC is designated as the manufacturer-recommended substitute for the obsolete PL585-88DC. Both components are manufactured by Microchip Technology and maintain ROHS3 compliance and EAR99 export classification.

The primary consideration for component selection is packaging form factor. The PL585-88DC is supplied as a die, requiring hybrid integration or direct die-attach assembly methods. The PL683000XC is supplied in 32LQFP surface-mount packaging, enabling standard PCB assembly processes and reducing integration complexity.

The PL683000XC carries active product status, ensuring ongoing manufacturer availability and technical support. The PL585-88DC is obsolete and subject to inventory depletion.

Moisture sensitivity differs between the two parts: the PL585-88DC specifies MSL 1 (unlimited shelf life), while the PL683000XC specifies MSL 3 (168-hour floor life after moisture exposure). This distinction affects storage, handling, and assembly procedures.

Frequently Asked Questions (FAQ)

Q: Can the PL683000XC directly replace the PL585-88DC in existing designs?

A: Functional replacement is possible if the design accommodates 32LQFP surface-mount packaging. Die-level designs require redesign to integrate a packaged component. Verify that PCB layout, assembly process, and thermal management are compatible with the 32LQFP form factor.

Q: What is the primary difference between these two parts?

A: The PL585-88DC is supplied as a bare die for hybrid or direct die-attach applications. The PL683000XC is supplied in 32LQFP surface-mount packaging for standard PCB assembly. The PL683000XC is an active product; the PL585-88DC is obsolete.

Q: Are there compliance or certification differences?

A: Both parts are ROHS3 compliant and classified as EAR99 for export purposes. Moisture sensitivity levels differ: PL585-88DC is MSL 1 (unlimited), while PL683000XC is MSL 3 (168-hour floor life). Verify moisture handling procedures for the PL683000XC during assembly.

Q: Why is the PL585-88DC obsolete?

A: Microchip Technology has transitioned this product line to packaged form factors. The PL683000XC represents the active equivalent in the manufacturer's current product portfolio.

Q: What parameters determine substitution eligibility?

A: Substitution is based on input type (Crystal), output type (LVPECL), maximum frequency (800MHz), supply voltage range (2.97V ~ 3.63V), and single-circuit PLL configuration with divider capability. Packaging form factor is a design consideration but does not affect functional equivalence.