PL123-02NGI-R Equivalent & Substitute Parts

Part Overview

The PL123-02NGI-R is a Clock Fanout Buffer (Distribution) IC manufactured by Microchip Technology, designed for clock signal distribution applications requiring 1:2 fanout capability at frequencies up to 200 MHz. This component operates with LVCMOS input and output logic levels, making it suitable for standard digital clock distribution in consumer and industrial applications. The part is currently in active production status with robust inventory availability (3592 pcs in stock), ensuring supply chain reliability for new designs and production requirements.

Substiute Parts

PL123-02NGI-R

Microchip TechnologyIn Stock: 3673PL123-02NGI-R Datasheet

Current PartRFQ

PL123-02NGI-R

Microchip TechnologyIn Stock: 3673PL123-02NGI-R Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the PL123-02NGI-R is determined by strict equivalence across the following critical parameters:

• Fanout Configuration: 1:2 input-to-output ratio (single input, dual outputs)
• Maximum Frequency: 200 MHz or higher
• Logic Levels: LVCMOS input and LVCMOS output (no differential variants)
• Supply Voltage Range: 1.62V ~ 3.63V compatibility
• Operating Temperature: -40°C ~ 85°C minimum coverage
• Package Type: 6-UFDFN Exposed Pad (6-DFN 2x1.3 footprint)
• Mounting: Surface Mount only
• Compliance: ROHS3 Compliant, REACH Unaffected

Only components meeting all of these parameters simultaneously qualify as direct substitutes. Deviations in any single parameter disqualify a part from substitution consideration.

Parameter Comparison

Engineering Selection Recommendations

The PL123-02NGI-R is recommended for applications requiring reliable clock distribution with the following considerations:

Product Status & Availability: The part maintains active production status with substantial inventory (3592 pcs), ensuring consistent supply for both prototype and volume production phases.

Compliance & Regulatory: Full ROHS3 compliance and REACH Unaffected status satisfy environmental and regulatory requirements for consumer electronics, industrial equipment, and automotive-grade applications where applicable.

Thermal & Electrical Performance: The -40°C ~ 85°C operating range and 1.62V ~ 3.63V supply voltage envelope accommodate standard industrial and commercial temperature profiles. The 200 MHz maximum frequency supports contemporary digital clock distribution requirements in microprocessor, FPGA, and high-speed digital systems.

Package Considerations: The 6-UFDFN Exposed Pad package (2x1.3 mm footprint) provides compact board integration with thermal management capability through the exposed pad, suitable for space-constrained applications.

Frequently Asked Questions (FAQ)

Q: What defines a valid substitute for the PL123-02NGI-R?

A: A valid substitute must match all critical parameters: 1:2 fanout ratio, 200 MHz or higher maximum frequency, LVCMOS input/output logic levels, 1.62V ~ 3.63V supply voltage range, -40°C ~ 85°C operating temperature, 6-UFDFN Exposed Pad package, surface mount mounting type, and ROHS3 compliance. Deviation in any single parameter disqualifies substitution.

Q: Can parts with higher frequency ratings substitute for the PL123-02NGI-R?

A: Yes, provided all other parameters remain equivalent. A fanout buffer rated for 250 MHz or 300 MHz maximum frequency is electrically compatible and functionally interchangeable, as higher frequency capability does not compromise lower-frequency operation.

Q: Are differential output variants compatible substitutes?

A: No. The PL123-02NGI-R specifies LVCMOS output logic. Differential output variants (LVDS, CML) are not compatible substitutes due to fundamentally different signal characteristics and circuit requirements.

Q: Does package size affect substitution eligibility?

A: Yes. The 6-UFDFN Exposed Pad (2x1.3 mm) package is a specific requirement. Larger packages (8-SOIC, 14-TSSOP) or different footprints (BGA, QFP) are not substitutes, as they require PCB redesign and cannot be directly interchanged.

Q: Is the PL123-02NGI-R suitable for automotive applications?

A: The part meets industrial-grade temperature specifications (-40°C ~ 85°C) and ROHS3 compliance. Automotive qualification requires additional validation per AEC-Q200 standards, which is not specified in the provided parameters.

Q: What is the significance of the Exposed Pad in the 6-UFDFN package?

A: The exposed pad provides thermal dissipation and electrical grounding, improving thermal performance and signal integrity. Substitutes must retain this feature to maintain equivalent thermal and electrical characteristics.