PIC24FV16KA301T-I/SO Equivalent & Substitute Parts

Part Overview

The PIC24FV16KA301T-I/SO is a 16-bit microcontroller from Microchip Technology's PIC® XLP™ 24F series, designed for embedded applications requiring low power operation. This device features 16KB of FLASH program memory, 2KB of RAM, and 512 bytes of EEPROM, operating at 32MHz with a supply voltage range of 2V to 5.5V. The part is currently in active production status and is RoHS3 compliant. Substitute parts are identified when equivalent electrical specifications and core functionality are maintained across different packaging formats or tape/reel configurations.

Substiute Parts

PIC24FV16KA301T-I/SO

Microchip TechnologyIn Stock: 1199PIC24FV16KA301T-I/SO Datasheet

Current PartRFQ

PIC24FV16KA301-I/SS

Microchip TechnologyIn Stock: 1155PIC24FV16KA301-I/SS Datasheet

MFR RecommendedRFQ

PIC24FV16KA301T-I/SS

Microchip TechnologyIn Stock: 1580PIC24FV16KA301T-I/SS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the PIC24FV16KA301T-I/SO are identified based on identical electrical and functional specifications across the following critical parameters:

• Base Product Number: PIC24FV16KA301
• Core Processor Architecture: PIC 16-Bit
• Operating Frequency: 32MHz
• Program Memory: 16KB FLASH (5.5K x 24)
• RAM: 2K x 8
• EEPROM: 512 x 8
• I/O Count: 17 pins
• Voltage Supply Range: 2V ~ 5.5V
• Data Converter: A/D 12x12b
• Connectivity Interfaces: I2C, IrDA, LINbus, SPI, UART/USART
• Peripheral Features: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Operating Temperature Range: -40°C ~ 85°C
• Product Status: Active
• Compliance: RoHS3, REACH Unaffected

Substitution differences are limited to packaging format (20-SOIC versus 20-SSOP) and supply method (tube versus tape & reel). These variations do not affect electrical performance or functional capability.

Parameter Comparison

Engineering Selection Recommendations

All three parts maintain identical electrical specifications, functional capabilities, and compliance certifications. Selection between PIC24FV16KA301T-I/SO and its substitutes is determined by packaging and supply requirements:

PIC24FV16KA301T-I/SO (20-SOIC, Tube): Use when board layout accommodates the wider 7.50mm SOIC package and tube packaging is acceptable for production volumes.

PIC24FV16KA301-I/SS (20-SSOP, Tube): Use when space constraints require the narrower 5.30mm SSOP package and tube packaging is preferred for lower-volume applications.

PIC24FV16KA301T-I/SS (20-SSOP, Tape & Reel): Use when space constraints require the narrower 5.30mm SSOP package and tape & reel supply is required for automated assembly processes.

All parts are active products with RoHS3 compliance and unlimited moisture sensitivity rating, ensuring long-term availability and environmental regulation adherence.

Frequently Asked Questions (FAQ)

Q: Can PIC24FV16KA301-I/SS or PIC24FV16KA301T-I/SS be used as direct replacements for PIC24FV16KA301T-I/SO?

A: Yes, from an electrical and functional standpoint. All three parts share identical processor architecture, memory configuration, operating frequency, voltage range, I/O count, and peripheral features. The primary differences are package format (SOIC versus SSOP) and supply method (tube versus tape & reel). PCB layout modifications are required when switching between SOIC and SSOP packages due to different pin pitch and body dimensions.

Q: What is the difference between 20-SOIC and 20-SSOP packaging?

A: The 20-SOIC package has a body width of 7.50mm, while the 20-SSOP package has a body width of 5.30mm. SSOP is a smaller footprint suitable for space-constrained applications. Both packages use surface mount technology and maintain the same pin count and electrical specifications.

Q: Does switching from tube to tape & reel packaging affect device performance?

A: No. Tube and tape & reel are supply and handling formats only. They do not affect electrical performance, functionality, or reliability. Tape & reel is typically used for high-volume automated assembly, while tube packaging is common for lower-volume or manual assembly processes.

Q: Are all three parts RoHS3 compliant?

A: Yes. PIC24FV16KA301T-I/SO, PIC24FV16KA301-I/SS, and PIC24FV16KA301T-I/SS are all RoHS3 compliant and REACH unaffected, meeting current environmental regulations.

Q: What is the moisture sensitivity level for these parts?

A: All three parts have a Moisture Sensitivity Level (MSL) of 1, which indicates unlimited shelf life without special moisture control measures.

Q: Can I use PIC24FV16KA301T-I/SS in a design originally specified for PIC24FV16KA301T-I/SO?

A: Electrical substitution is direct. However, PCB layout changes are necessary because the SSOP package (5.30mm width) differs from the SOIC package (7.50mm width). Footprint, trace routing, and component placement must be adjusted accordingly. Verify PCB design compatibility before implementation.