PIC24FV08KM102-E/SS Equivalent & Substitute Parts

Part Overview

The PIC24FV08KM102-E/SS is a 16-bit microcontroller from Microchip Technology's PIC® XLP™ 24F series, designed for embedded applications requiring low power operation. This device features 8KB of FLASH program memory, 1KB of RAM, and 512 bytes of EEPROM, operating at 32MHz with a supply voltage range of 2V to 5V. The part is classified as obsolete, making identification of suitable substitute components essential for ongoing design support and production continuity.

Key Parameters

Parameter	Value
Core Processor	PIC
Core Size	16-Bit
Speed	32MHz
Program Memory Size	8KB (2.75K x 24)
Program Memory Type	FLASH
RAM Size	1K x 8
EEPROM Size	512 x 8
Voltage Supply (Vcc/Vdd)	2V ~ 5V
Number of I/O	23
Connectivity	I2C, IrDA, LINbus, SPI, UART/USART
Data Converters	A/D 19x10b/12b
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package Type	28-SSOP
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the PIC24FV08KM102-E/SS is determined by strict equivalence across the following critical parameters:

Core Functional Parameters (Must Match):

Core Processor: PIC
Core Size: 16-Bit
Speed: 32MHz
Program Memory Size: 8KB (2.75K x 24)
Program Memory Type: FLASH
RAM Size: 1K x 8
EEPROM Size: 512 x 8
Voltage Supply Range: 2V ~ 5V
Number of I/O: 23
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Data Converters: A/D 19x10b/12b

Allowable Variations:

Package Type: Different surface mount packages (SSOP, SOIC) are acceptable provided the pin count and functionality remain identical
Operating Temperature Range: Variations within industrial or extended ranges are acceptable if the application requirements are met
Product Status: Active status substitutes are preferred for obsolete parts

The PIC24FV08KM102-I/SO qualifies as a direct substitute based on identical core functionality and electrical specifications, with the primary difference being the package type (28-SOIC versus 28-SSOP).

Parameter Comparison

Parameter	PIC24FV08KM102-E/SS (Main)	PIC24FV08KM102-I/SO (Substitute)
Manufacturer	Microchip Technology	Microchip Technology
Series	PIC® XLP™ 24F	PIC® XLP™ 24F
Core Processor	PIC	PIC
Core Size	16-Bit	16-Bit
Speed	32MHz	32MHz
Program Memory Size	8KB (2.75K x 24)	8KB (2.75K x 24)
Program Memory Type	FLASH	FLASH
RAM Size	1K x 8	1K x 8
EEPROM Size	512 x 8	512 x 8
Voltage Supply (Vcc/Vdd)	2V ~ 5V	2V ~ 5V
Number of I/O	23	23
Connectivity	I2C, IrDA, LINbus, SPI, UART/USART	I2C, IrDA, LINbus, SPI, UART/USART
Data Converters	A/D 19x10b/12b	A/D 19x10b/12b
Mounting Type	Surface Mount	Surface Mount
Package Type	28-SSOP (0.209", 5.30mm Width)	28-SOIC (0.295", 7.50mm Width)
Operating Temperature	-40°C ~ 125°C (TA)	-40°C ~ 85°C (TA)
Product Status	Obsolete	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	1 (Unlimited)	1 (Unlimited)
REACH Status	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

The PIC24FV08KM102-I/SO is a qualified substitute for the obsolete PIC24FV08KM102-E/SS based on identical core electrical and functional specifications. Both devices are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements.

Primary Consideration: The substitute part transitions from obsolete to active product status, ensuring long-term availability and supply chain continuity.

Package Transition: The change from 28-SSOP to 28-SOIC packaging requires PCB layout modification. Both packages maintain 28-pin configuration with identical pin functionality. The 28-SOIC package has a larger body width (7.50mm versus 5.30mm), necessitating footprint redesign but not affecting electrical performance.

Temperature Range Difference: The main part operates to 125°C while the substitute operates to 85°C. Applications requiring operation above 85°C ambient temperature cannot use this substitute without thermal management reassessment.

Frequently Asked Questions (FAQ)

Q: Can the PIC24FV08KM102-I/SO directly replace the PIC24FV08KM102-E/SS without code changes?

A: Yes. Both devices share identical core processor architecture, memory configuration, and peripheral set. Firmware compiled for the main part executes without modification on the substitute.

Q: What is the primary difference between these two parts?

A: The main difference is packaging. The PIC24FV08KM102-E/SS uses 28-SSOP (smaller outline), while the PIC24FV08KM102-I/SO uses 28-SOIC (larger outline). Both are 28-pin surface mount packages with identical pin assignments and electrical characteristics.

Q: Does the package change affect PCB design?

A: Yes. The 28-SOIC package is physically larger than 28-SSOP. PCB footprints must be redesigned to accommodate the different package dimensions. Pin spacing and functionality remain identical.

Q: Is the substitute part still in production?

A: Yes. The PIC24FV08KM102-I/SO has active product status, ensuring availability for new designs and production orders.

Q: What about the operating temperature difference?

A: The main part operates from -40°C to 125°C, while the substitute operates from -40°C to 85°C. If your application requires operation above 85°C ambient temperature, the substitute is not suitable without additional thermal management measures.

Q: Are both parts RoHS compliant?

A: Yes. Both the PIC24FV08KM102-E/SS and PIC24FV08KM102-I/SO are ROHS3 compliant and REACH unaffected.

Q: Can I use the substitute in existing designs without redesign?

A: Electrically and functionally, yes. However, PCB layout must be modified to accommodate the different package footprint. No firmware changes are required.

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