PIC24F04KA200T-I/ST Equivalent & Substitute Parts

Part Overview

The PIC24F04KA200T-I/ST is a 16-bit microcontroller from Microchip Technology's PIC® XLP™ 24F series, designed for embedded applications requiring low power consumption and integrated connectivity. This device operates at 32MHz with 4KB of FLASH program memory and is housed in a 14-TSSOP surface mount package. The part is currently in active production status with verified programmability through DiGi-Electronics. Substitute parts are identified when packaging or distribution format differs while maintaining identical electrical and mechanical specifications.

Substiute Parts

PIC24F04KA200T-I/ST
Microchip TechnologyIn Stock: 1573PIC24F04KA200T-I/ST Datasheet
PIC24F04KA200T-I/ST
Current Part
PIC24F04KA200-I/ST
Microchip TechnologyIn Stock: 1730PIC24F04KA200-I/ST Datasheet
PIC24F04KA200-I/ST
Direct

Key Parameters

Parameter Value
Manufacturer Microchip Technology
Core Processor PIC
Core Size 16-Bit
Speed 32MHz
Program Memory Size 4KB (1.375K x 24)
Program Memory Type FLASH
RAM Size 512 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V
Number of I/O 12
Data Converters A/D 7x10b
Connectivity I2C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 14-TSSOP (0.173", 4.40mm Width)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the PIC24F04KA200T-I/ST is determined by strict equivalence across all electrical and mechanical parameters. The primary differentiator between the main part and identified substitutes is the distribution packaging format, not the component specifications themselves.

The key parameters that must remain identical for valid substitution are:

  • Base Product Number: PIC24F04KA200
  • Core Processor: PIC
  • Core Size: 16-Bit
  • Speed: 32MHz
  • Program Memory: 4KB FLASH (1.375K x 24)
  • RAM: 512 x 8
  • Voltage Supply: 1.8V ~ 3.6V
  • Number of I/O: 12
  • Data Converters: A/D 7x10b
  • Connectivity: I2C, IrDA, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
  • RoHS Status: ROHS3 Compliant
  • Moisture Sensitivity Level: 1 (Unlimited)

The PIC24F04KA200-I/ST differs only in supplier device packaging (Tube versus Tape & Reel), representing an alternative distribution format of the identical microcontroller die and specifications.

Parameter Comparison

Parameter PIC24F04KA200T-I/ST (Main) PIC24F04KA200-I/ST (Substitute)
Manufacturer Microchip Technology Microchip Technology
Base Product Number PIC24F04KA200 PIC24F04KA200
Series PIC® XLP™ 24F PIC® XLP™ 24F
Core Processor PIC PIC
Core Size 16-Bit 16-Bit
Speed 32MHz 32MHz
Program Memory Size 4KB (1.375K x 24) 4KB (1.375K x 24)
Program Memory Type FLASH FLASH
RAM Size 512 x 8 512 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 3.6V 1.8V ~ 3.6V
Number of I/O 12 12
Data Converters A/D 7x10b A/D 7x10b
Connectivity I2C, IrDA, SPI, UART/USART I2C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, HLVD, POR, PWM, WDT Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 14-TSSOP (0.173", 4.40mm Width) 14-TSSOP (0.173", 4.40mm Width)
Supplier Device Package 14-TSSOP 14-TSSOP
Packaging Format Tape & Reel (TR) Tube
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

Both the PIC24F04KA200T-I/ST and PIC24F04KA200-I/ST are active production devices from Microchip Technology with identical electrical specifications and mechanical form factors. Selection between these parts is determined by procurement and assembly requirements rather than functional capability.

The PIC24F04KA200T-I/ST in Tape & Reel packaging is suitable for high-volume automated assembly operations where continuous reel feeding into pick-and-place equipment is standard. The PIC24F04KA200-I/ST in Tube packaging is appropriate for lower-volume applications, manual assembly processes, or situations where reel storage and handling infrastructure is not available.

Both parts maintain ROHS3 compliance, unlimited moisture sensitivity rating (MSL 1), and identical regulatory classifications (ECCN 3A991A2, HTSUS 8542.31.0001). The choice between packaging formats does not affect component performance, reliability, or compliance status.

Frequently Asked Questions (FAQ)

Q: Are PIC24F04KA200T-I/ST and PIC24F04KA200-I/ST electrically identical?

A: Yes. Both parts contain the identical microcontroller die with 16-bit architecture, 32MHz operation, 4KB FLASH memory, 512 x 8 RAM, and all specified peripherals. The only difference is the distribution packaging format (Tape & Reel versus Tube).

Q: Can I substitute PIC24F04KA200-I/ST for PIC24F04KA200T-I/ST in my PCB assembly?

A: Yes, from an electrical and mechanical standpoint. The 14-TSSOP package dimensions and pinout are identical. However, assembly process compatibility depends on your equipment. Tape & Reel format requires reel-compatible pick-and-place machinery, while Tube format is suitable for manual or alternative feeding systems.

Q: Do these parts have different lead times or availability?

A: Availability may vary based on current inventory and distribution channels. The main part shows 1495 units in stock, while the substitute shows 1620 units. Consult your supplier for current lead times specific to each packaging format.

Q: Are there any compliance or certification differences?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and carry identical ECCN and HTSUS classifications. Moisture sensitivity level (MSL 1 - Unlimited) is the same for both.

Q: What is the significance of the "T" in PIC24F04KA200T-I/ST?

A: The "T" designates Tape & Reel packaging format. The absence of "T" in PIC24F04KA200-I/ST indicates Tube packaging. Both are valid distribution methods for the identical component.

Q: Can I mix these parts in the same production batch?

A: From a functional perspective, yes. However, mixing packaging formats in a single assembly run may complicate logistics and inventory management. Standardizing on one format per production batch is recommended for operational efficiency.

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