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PIC16LC715-04/SS Equivalent & Substitute Parts
Part Overview
The PIC16LC715-04/SS is an 8-bit microcontroller from Microchip Technology's PIC® 16C series, featuring 4.6KB OTP program memory, 128 x 8 bytes of RAM, and 13 I/O pins in a 20-SSOP surface mount package. This device is actively produced and widely used in embedded applications requiring low-power operation across the 2.5V to 5.5V supply range.
Substitute parts become necessary when OTP (One-Time Programmable) memory limitations require reprogrammable alternatives, when extended operating temperature ranges are needed, or when higher processing speeds are required for application upgrades while maintaining pin-compatible form factors.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Core Size | 8-Bit |
| Program Memory Type | OTP |
| Program Memory Size | 4.6KB (2K x 14) |
| RAM Size | 128 x 8 |
| Number of I/O | 13 |
| Package Type | 20-SSOP |
| Voltage Supply Range | 2.5V ~ 5.5V |
| Data Converters | A/D 4x8b |
| Mounting Type | Surface Mount |
Substitute Part Grouping Explanation
The PIC16F716-I/SS qualifies as a direct substitute based on the following alignment of critical parameters:
Matching Parameters:
- Core architecture: 8-Bit PIC processor
- Program memory capacity: 4.6KB (2K x 14)
- RAM capacity: 128 x 8 bytes
- I/O pin count: 13 pins
- Package: 20-SSOP (0.209", 5.30mm Width)
- Data converter specification: A/D 4x8b
- Supply voltage range: Overlapping (2V ~ 5.5V vs. 2.5V ~ 5.5V)
- Mounting type: Surface Mount
- Compliance: ROHS3, REACH Unaffected, EAR99
Key Difference: The primary distinction is program memory type: the substitute uses FLASH memory instead of OTP, enabling field reprogramming and in-circuit updates. The substitute also operates at higher speed (20MHz vs. 4MHz) and supports an extended operating temperature range (-40°C ~ 85°C vs. 0°C ~ 70°C).
Parameter Comparison
| Parameter | PIC16LC715-04/SS | PIC16F716-I/SS |
|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology |
| Series | PIC® 16C | PIC® 16F |
| Core Size | 8-Bit | 8-Bit |
| Speed | 4MHz | 20MHz |
| Program Memory Type | OTP | FLASH |
| Program Memory Size | 4.6KB (2K x 14) | 4.6KB (2K x 14) |
| RAM Size | 128 x 8 | 128 x 8 |
| Number of I/O | 13 | 13 |
| Voltage Supply (Vcc/Vdd) | 2.5V ~ 5.5V | 2V ~ 5.5V |
| Data Converters | A/D 4x8b | A/D 4x8b |
| Peripherals | Brown-out Detect/Reset, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT |
| Operating Temperature | 0°C ~ 70°C | -40°C ~ 85°C |
| Package / Case | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP (0.209", 5.30mm Width) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Product Status | Active | Active |
Engineering Selection Recommendations
Both the PIC16LC715-04/SS and PIC16F716-I/SS are active products with full ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current production environments.
Selection between these devices depends on application requirements:
Select PIC16LC715-04/SS when:
- OTP memory is acceptable for production-only programming scenarios
- Operating temperature range of 0°C to 70°C meets application requirements
- 4MHz processing speed is sufficient for the intended application
- Cost optimization for high-volume, fixed-firmware deployments is prioritized
Select PIC16F716-I/SS when:
- Field reprogramming or in-circuit firmware updates are required
- Extended temperature operation (-40°C to 85°C) is necessary for industrial or automotive environments
- Higher processing speed (20MHz) provides performance headroom for application scaling
- Development flexibility and prototype iteration are priorities
Both devices maintain identical pin counts, package dimensions, I/O configuration, and memory capacity, ensuring direct PCB-level compatibility when thermal and speed requirements are satisfied.
Frequently Asked Questions (FAQ)
Q: Are these devices pin-compatible? A: Yes. Both devices use the 20-SSOP package with identical 0.209" width and 5.30mm dimensions. Pin count and I/O configuration are identical (13 I/O pins), enabling direct socket substitution on PCBs designed for either device.
Q: What is the primary functional difference between OTP and FLASH memory? A: OTP (One-Time Programmable) memory can be programmed once during manufacturing and cannot be erased or reprogrammed. FLASH memory can be erased and reprogrammed multiple times, enabling field updates and development iteration without replacing the component.
Q: Can the PIC16F716-I/SS replace the PIC16LC715-04/SS in existing designs? A: Yes, provided the application can tolerate the extended operating temperature range (-40°C to 85°C) and higher speed capability (20MHz). The substitute offers backward compatibility with identical memory capacity, I/O count, and package form factor. Firmware compatibility depends on application code; no architectural changes are required.
Q: What is the significance of the temperature range difference? A: The PIC16LC715-04/SS operates from 0°C to 70°C, suitable for consumer and standard industrial environments. The PIC16F716-I/SS extends to -40°C to 85°C, meeting automotive, aerospace, and extreme environment specifications. Applications requiring operation below 0°C or above 70°C must use the substitute.
Q: Are there supply voltage compatibility concerns? A: Both devices operate within overlapping voltage ranges. The PIC16LC715-04/SS requires 2.5V minimum; the PIC16F716-I/SS operates from 2V minimum. For applications using supply voltages between 2V and 2.5V, the substitute provides broader compatibility.
Q: Does the speed difference (4MHz vs. 20MHz) affect firmware compatibility? A: Firmware written for the 4MHz device will execute on the 20MHz substitute without modification. The higher speed provides performance headroom but does not require code changes. Timing-dependent code may require adjustment if the application relies on specific instruction cycle counts.
Q: What compliance certifications apply to both devices? A: Both devices are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronics manufacturing and distribution.
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