PIC16F723AT-I/SO Equivalent & Substitute Parts

Part Overview

The PIC16F723AT-I/SO is an 8-bit microcontroller from Microchip Technology's PIC® XLP™ 16F series, designed for embedded applications requiring low power consumption and integrated connectivity features. This device operates at 20MHz with 7KB of FLASH program memory and is housed in a 28-SOIC surface mount package. The part is currently in active production status with 875 units available in stock. Substitute parts are identified when equivalent electrical specifications, memory configurations, and package formats are maintained across the product line.

Substiute Parts

PIC16F723AT-I/SO
Microchip TechnologyIn Stock: 893PIC16F723AT-I/SO Datasheet
PIC16F723AT-I/SO
Current Part
PIC16F723A-I/SO
Microchip TechnologyIn Stock: 2297PIC16F723A-I/SO Datasheet
PIC16F723A-I/SO
Direct

Key Parameters

Parameter Value
Core Processor PIC
Core Size 8-Bit
Speed 20MHz
Program Memory Size 7KB (4K x 14)
Program Memory Type FLASH
RAM Size 192 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 5.5V
Number of I/O 25
Data Converters A/D 11x8b
Connectivity I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width)

Substitute Part Grouping Explanation

Substitution of the PIC16F723AT-I/SO is determined by strict equivalence across the following critical parameters:

  • Core Architecture: PIC 8-bit processor
  • Memory Configuration: 7KB FLASH program memory (4K x 14), 192 x 8 RAM
  • Operating Frequency: 20MHz
  • Supply Voltage Range: 1.8V ~ 5.5V
  • I/O Count: 25 pins
  • Connectivity Interfaces: I2C, SPI, UART/USART
  • Peripheral Set: Brown-out Detect/Reset, POR, PWM, WDT
  • Data Conversion: A/D 11x8b
  • Package Format: 28-SOIC surface mount
  • Temperature Range: -40°C ~ 85°C

The PIC16F723A-I/SO maintains identical electrical and functional specifications while differing only in packaging format (Tube vs. Tape & Reel) and moisture sensitivity level classification.

Parameter Comparison

Parameter PIC16F723AT-I/SO PIC16F723A-I/SO
Manufacturer Microchip Technology Microchip Technology
Series PIC® XLP™ 16F PIC® XLP™ 16F
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Program Memory Size 7KB (4K x 14) 7KB (4K x 14)
Program Memory Type FLASH FLASH
RAM Size 192 x 8 192 x 8
Voltage Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Number of I/O 25 25
Data Converters A/D 11x8b A/D 11x8b
Connectivity I2C, SPI, UART/USART I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 28-SOIC (0.295", 7.50mm Width) 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package 28-SOIC 28-SOIC
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
HTSUS Code 8542.31.0001 8542.31.0001
Packaging Format Tape & Reel (TR) Tube
Moisture Sensitivity Level (MSL) 3 (168 Hours) 1 (Unlimited)

Engineering Selection Recommendations

Both the PIC16F723AT-I/SO and PIC16F723A-I/SO are active production devices from Microchip Technology with identical electrical specifications and functional capabilities. Selection between these parts is determined by packaging and logistics requirements rather than technical performance.

The PIC16F723AT-I/SO is supplied in Tape & Reel format with MSL 3 classification, suitable for high-volume automated assembly operations. The PIC16F723A-I/SO is supplied in Tube packaging with MSL 1 classification, offering unlimited shelf life without moisture sensitivity constraints.

Both devices maintain ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory requirements. The choice between these substitutes depends on procurement volume, assembly methodology, and storage conditions rather than functional or electrical differences.

Frequently Asked Questions (FAQ)

Q: Are the PIC16F723AT-I/SO and PIC16F723A-I/SO electrically identical?

A: Yes. Both devices feature identical core architecture, memory configuration, operating frequency, supply voltage range, I/O count, connectivity interfaces, and peripheral sets. They are functionally equivalent at the electrical level.

Q: What is the difference between Tape & Reel and Tube packaging?

A: Tape & Reel packaging is optimized for automated pick-and-place assembly in high-volume production environments. Tube packaging is used for lower-volume applications or manual assembly processes. Both formats contain the same device in the 28-SOIC package.

Q: Does the Moisture Sensitivity Level (MSL) difference affect device performance?

A: No. MSL classification affects storage and handling requirements, not electrical performance. MSL 3 (168 Hours) requires controlled humidity storage, while MSL 1 (Unlimited) has no moisture sensitivity constraints. Device functionality remains identical regardless of MSL classification.

Q: Can I use PIC16F723A-I/SO as a direct replacement for PIC16F723AT-I/SO in existing designs?

A: Yes, provided your assembly process and storage conditions accommodate Tube packaging. The electrical specifications, pin configuration, and functional capabilities are identical. Verify that your procurement and assembly workflows support the alternative packaging format.

Q: Are there any compliance or certification differences between these parts?

A: No. Both devices maintain identical RoHS3 compliance, REACH unaffected status, and HTSUS classification. Regulatory and environmental compliance is equivalent across both part numbers.

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