PIC16F722T-I/ML Equivalent & Substitute Parts

Part Overview

The PIC16F722T-I/ML is an 8-bit microcontroller from Microchip Technology's PIC® XLP™ 16F series, designed for embedded applications requiring low power consumption and integrated connectivity. This device features 4.6KB of FLASH program memory, 128 bytes of RAM, and operates at speeds up to 20MHz across a wide supply voltage range of 1.8V to 5.5V. The part is currently in active production status and is RoHS3 compliant. Identifying equivalent and substitute parts is essential for supply chain continuity, inventory optimization, and design flexibility when the primary part number becomes unavailable or when alternative packaging formats are required.

Substiute Parts

PIC16F722T-I/ML
Microchip TechnologyIn Stock: 3039PIC16F722T-I/ML Datasheet
PIC16F722T-I/ML
Current Part
PIC16F722-I/ML
Microchip TechnologyIn Stock: 2042PIC16F722-I/ML Datasheet
PIC16F722-I/ML
Direct

Key Parameters

Parameter Value
Core Processor PIC
Core Size 8-Bit
Speed 20MHz
Program Memory Size 4.6KB (2K x 14)
Program Memory Type FLASH
RAM Size 128 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V
Data Converters A/D 11x8b
Number of I/O 25
Connectivity I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Mounting Type Surface Mount
Package / Case 28-VQFN Exposed Pad
Operating Temperature -40°C ~ 85°C (TA)

Substitute Part Grouping Explanation

Substitution eligibility for the PIC16F722T-I/ML is determined by strict equivalence across the following critical parameters:

  • Core Architecture: PIC 8-bit processor
  • Memory Configuration: 4.6KB FLASH program memory, 128 x 8 RAM
  • Operating Frequency: 20MHz maximum
  • Supply Voltage Range: 1.8V ~ 5.5V
  • Package Type: 28-VQFN with exposed pad
  • Peripheral Set: I2C, SPI, UART/USART connectivity; Brown-out Detect/Reset, POR, PWM, WDT
  • I/O Count: 25 pins
  • Data Conversion: A/D 11x8b

The identified substitute part PIC16F722-I/ML shares identical electrical specifications and functional capabilities with the main part number. The primary difference lies in the packaging format: the main part is supplied in Tape & Reel (TR) format, while the substitute is supplied in Tube format. Both parts are manufactured by Microchip Technology, carry the same base product number (PIC16F722), and maintain identical performance characteristics across all operating conditions.

Parameter Comparison

Parameter PIC16F722T-I/ML (Main) PIC16F722-I/ML (Substitute)
Manufacturer Microchip Technology Microchip Technology
Series PIC® XLP™ 16F PIC® XLP™ 16F
Core Processor PIC PIC
Core Size 8-Bit 8-Bit
Speed 20MHz 20MHz
Program Memory Size 4.6KB (2K x 14) 4.6KB (2K x 14)
Program Memory Type FLASH FLASH
RAM Size 128 x 8 128 x 8
Voltage - Supply (Vcc/Vdd) 1.8V ~ 5.5V 1.8V ~ 5.5V
Data Converters A/D 11x8b A/D 11x8b
Number of I/O 25 25
Connectivity I2C, SPI, UART/USART I2C, SPI, UART/USART
Peripherals Brown-out Detect/Reset, POR, PWM, WDT Brown-out Detect/Reset, POR, PWM, WDT
Mounting Type Surface Mount Surface Mount
Package / Case 28-VQFN Exposed Pad 28-VQFN Exposed Pad
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Packaging Format Tape & Reel (TR) Tube
Inventory Status 3000 Pcs New Original In Stock 1980 Pcs New Original In Stock

Engineering Selection Recommendations

Both the PIC16F722T-I/ML and PIC16F722-I/ML are active production parts manufactured by Microchip Technology with identical electrical and functional specifications. Selection between these parts should be based on packaging requirements and supply chain considerations:

  • PIC16F722T-I/ML is appropriate for high-volume automated assembly operations requiring Tape & Reel packaging format.
  • PIC16F722-I/ML is suitable for lower-volume applications, manual assembly processes, or situations where Tube packaging is preferred.

Both parts maintain full compliance with RoHS3 and REACH regulations, carry MSL Level 1 (unlimited moisture sensitivity), and are classified under ECCN EAR99 with HTSUS code 8542.31.0001. The choice between these parts does not impact circuit design, firmware compatibility, or functional performance.

Frequently Asked Questions (FAQ)

Q: Are PIC16F722T-I/ML and PIC16F722-I/ML electrically identical?

A: Yes. Both parts share identical core specifications including processor architecture, memory configuration, operating frequency, supply voltage range, I/O count, connectivity options, and peripheral features. They are functionally interchangeable in circuit design.

Q: What is the difference between Tape & Reel and Tube packaging?

A: Tape & Reel (TR) packaging is used for high-volume automated pick-and-place assembly, where components are wound on a continuous tape. Tube packaging is used for lower-volume applications and manual assembly processes. The packaging format does not affect component performance or electrical characteristics.

Q: Can I use PIC16F722-I/ML as a direct replacement for PIC16F722T-I/ML in my design?

A: Yes, provided your assembly process can accommodate Tube packaging instead of Tape & Reel. No circuit modifications or firmware changes are required.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts carry identical RoHS3 compliance, REACH status, MSL rating, and export classification codes.

Q: What is the significance of the "T" in PIC16F722T-I/ML?

A: The "T" designates the Tape & Reel packaging format. The base part number PIC16F722 with suffix -I/ML indicates the temperature range (-40°C to 85°C) and package type (28-QFN). The packaging format is the only variable between these two part numbers.

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