PIC16CE623-20I/SS Equivalent & Substitute Parts

Part Overview

The PIC16CE623-20I/SS is an 8-bit microcontroller from Microchip Technology's PIC® 16C series, designed for embedded applications requiring OTP (One-Time Programmable) memory. This device features 896B of program memory, 128 x 8 EEPROM, and 96 x 8 RAM, operating at up to 20MHz with a supply voltage range of 3V to 5.5V. The part is currently active in production with verified programmability and ROHS3 compliance. Substitute parts are identified when equivalent electrical and mechanical parameters align with application requirements, particularly when OTP memory limitations necessitate migration to reprogrammable alternatives or when enhanced peripheral functionality is required.

Substiute Parts

PIC16CE623-20I/SS

Microchip TechnologyIn Stock: 870PIC16CE623-20I/SS Datasheet

Current PartRFQ

PIC16F627A-I/SS

Microchip TechnologyIn Stock: 7504PIC16F627A-I/SS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the PIC16CE623-20I/SS is determined by strict alignment of the following electrical and mechanical parameters:

• Core Architecture: PIC 8-bit processor maintaining instruction set compatibility
• Operating Frequency: 20MHz maximum speed capability
• Supply Voltage Range: 3V to 5.5V operation
• Package Format: 20-SSOP surface mount package with identical 0.209" (5.30mm) width
• Memory Architecture: 14-bit word organization for program memory
• EEPROM Capacity: Minimum 128 x 8 bytes
• I/O Pin Count: Minimum 13 I/O lines
• Operating Temperature Range: -40°C to 85°C
• Compliance Standards: ROHS3 compliance and MSL Level 1

The PIC16F627A-I/SS qualifies as a direct substitute based on these parameters, with the distinction that it employs FLASH memory instead of OTP, providing reprogrammability while maintaining all other electrical and mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

Both the PIC16CE623-20I/SS and PIC16F627A-I/SS maintain active production status with verified programmability and full ROHS3 compliance. Selection between these devices is determined by application-specific memory requirements and development methodology.

The PIC16CE623-20I/SS is appropriate for production applications where firmware is finalized and OTP programming provides cost efficiency for high-volume deployments. The OTP architecture eliminates reprogramming capability, making it suitable for locked production designs.

The PIC16F627A-I/SS is appropriate for applications requiring firmware flexibility, development iteration, or field updates. The FLASH memory architecture enables unlimited reprogramming cycles. This device provides additional program memory (1.75KB versus 896B), expanded RAM (224 x 8 versus 96 x 8), and three additional I/O pins (16 versus 13), offering enhanced functionality within the identical package footprint and electrical specifications.

Both devices maintain identical supply voltage ranges, operating temperature specifications, and package dimensions, ensuring direct mechanical and electrical compatibility in 20-SSOP surface mount applications.

Frequently Asked Questions (FAQ)

Q: Can the PIC16F627A-I/SS directly replace the PIC16CE623-20I/SS in existing PCB designs?

A: Yes. Both devices share identical 20-SSOP package dimensions (0.209" width, 5.30mm), pin count (20 pins), supply voltage range (3V to 5.5V), operating temperature range (-40°C to 85°C), and maximum operating frequency (20MHz). PCB layout and footprints are directly compatible without modification.

Q: What are the key differences between these devices?

A: The primary difference is program memory type: PIC16CE623-20I/SS uses OTP (One-Time Programmable) memory, while PIC16F627A-I/SS uses FLASH memory. The PIC16F627A-I/SS also provides larger program memory (1.75KB versus 896B), expanded RAM (224 x 8 versus 96 x 8), and three additional I/O pins (16 versus 13).

Q: Is the PIC16F627A-I/SS backward compatible with PIC16CE623-20I/SS firmware?

A: The PIC16F627A-I/SS uses the same PIC 8-bit core architecture and instruction set. Firmware written for the PIC16CE623-20I/SS will execute on the PIC16F627A-I/SS. However, applications must account for the different memory organization and additional peripheral capabilities of the PIC16F627A-I/SS.

Q: What is the significance of the 20-SSOP package specification?

A: The 20-SSOP (Shrink Small Outline Package) is a surface mount package with 20 pins, 0.209 inches (5.30mm) body width, and 0.025-inch pin spacing. This specification ensures both devices are mechanically and electrically compatible in identical PCB designs without layout modifications.

Q: Are both devices ROHS3 compliant?

A: Yes. Both the PIC16CE623-20I/SS and PIC16F627A-I/SS are ROHS3 compliant and carry MSL Level 1 (Unlimited) moisture sensitivity ratings, meeting environmental and regulatory requirements for industrial and commercial applications.

Q: When should OTP memory (PIC16CE623-20I/SS) be selected over FLASH memory (PIC16F627A-I/SS)?

A: OTP memory is selected for high-volume production applications where firmware is finalized and locked. OTP devices provide cost advantages in large-scale manufacturing when reprogramming is not required. FLASH memory is selected for development, prototyping, or applications requiring field firmware updates.