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PIC12CE673-10/P Equivalent & Substitute Parts
Part Overview
The PIC12CE673-10/P is an 8-bit microcontroller from Microchip Technology's PIC® 12C series, featuring 1.75KB OTP (One-Time Programmable) memory, designed for embedded applications requiring low-cost, compact solutions. This device is currently active in production with verified programmability through DiGi-Electronics. Finding equivalent or substitute parts becomes necessary when OTP memory limitations require reprogrammable alternatives, when higher operating temperature ranges are needed, or when inventory constraints necessitate functionally compatible options.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Core Processor | PIC |
| Core Size | 8-Bit |
| Program Memory Type | OTP |
| Program Memory Size | 1.75KB (1K x 14) |
| Number of I/O | 5 |
| Voltage Supply Range | 3V ~ 5.5V |
| Operating Temperature | 0°C ~ 70°C |
| Package Type | 8-DIP (0.300", 7.62mm) |
| Mounting Type | Through Hole |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution eligibility for the PIC12CE673-10/P is determined by the following critical parameters:
Core Architecture Compatibility: Both main and substitute parts must use the PIC core processor with 8-bit architecture to ensure instruction set compatibility and firmware portability.
Memory Configuration: Equivalent parts must maintain the same program memory size (1.75KB) and I/O count (5 pins) to preserve pin-to-pin compatibility and application scope.
Package Specification: Physical package must be 8-DIP (0.300", 7.62mm) with through-hole mounting to ensure direct socket compatibility without PCB redesign.
Voltage and Temperature Operating Ranges: Substitute parts must support the minimum voltage requirement (3V minimum) and should ideally extend the operating temperature range for broader application flexibility.
Compliance Standards: All substitute parts must maintain ROHS3 compliance and equivalent regulatory certifications (REACH Unaffected, EAR99 classification).
The primary distinction between the main part and its substitute lies in program memory type: the PIC12CE673-10/P uses OTP (One-Time Programmable) memory, while the PIC12F675-I/P uses FLASH memory, enabling multiple reprogramming cycles.
Parameter Comparison
| Parameter | PIC12CE673-10/P | PIC12F675-I/P | Compatibility Notes |
|---|---|---|---|
| Manufacturer | Microchip Technology | Microchip Technology | Same manufacturer ensures consistent quality and support |
| Series | PIC® 12C | PIC® 12F | Different series; both within PIC 12-bit architecture family |
| Core Processor | PIC | PIC | Identical core architecture |
| Core Size | 8-Bit | 8-Bit | Identical bit width |
| Speed | 10MHz | 20MHz | Substitute offers 2x processing speed |
| Program Memory Size | 1.75KB (1K x 14) | 1.75KB (1K x 14) | Identical memory capacity |
| Program Memory Type | OTP | FLASH | Key difference: FLASH allows reprogramming |
| EEPROM Size | 16 x 8 | 128 x 8 | Substitute provides 8x larger EEPROM |
| RAM Size | 128 x 8 | 64 x 8 | Main part has 2x RAM capacity |
| Number of I/O | 5 | 5 | Identical I/O pin count |
| Voltage Supply (Vcc/Vdd) | 3V ~ 5.5V | 2V ~ 5.5V | Substitute supports lower voltage operation |
| Data Converters | A/D 4x8b | A/D 4x10b | Substitute offers higher ADC resolution |
| Operating Temperature | 0°C ~ 70°C | -40°C ~ 85°C | Substitute supports extended temperature range |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) | Identical package; direct socket replacement |
| Mounting Type | Through Hole | Through Hole | Identical mounting method |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Both meet RoHS3 requirements |
| REACH Status | REACH Unaffected | REACH Unaffected | Both unaffected by REACH regulations |
| ECCN | EAR99 | EAR99 | Identical export classification |
Engineering Selection Recommendations
Primary Substitution Scenario: The PIC12F675-I/P is a direct functional substitute for the PIC12CE673-10/P when reprogrammability is required. Both devices maintain identical core architecture, I/O configuration, and physical package specifications, enabling socket-level replacement without PCB modification.
Compliance Alignment: Both parts maintain ROHS3 compliance, REACH Unaffected status, and EAR99 export classification, ensuring regulatory equivalence for applications subject to these standards.
Performance Considerations: The PIC12F675-I/P provides enhanced capabilities including 2x clock speed (20MHz vs. 10MHz), extended operating temperature range (-40°C to 85°C vs. 0°C to 70°C), lower minimum supply voltage (2V vs. 3V), and higher ADC resolution (10-bit vs. 8-bit). These enhancements make the substitute suitable for applications requiring broader environmental operation or higher precision analog conversion.
Memory Trade-offs: The PIC12F675-I/P offers 8x larger EEPROM (128 x 8 vs. 16 x 8) but provides half the RAM capacity (64 x 8 vs. 128 x 8). Applications with significant data storage requirements benefit from the larger EEPROM; those requiring larger working memory should retain the original part.
Active Product Status: Both devices maintain active production status with verified programmability, ensuring long-term availability and consistent supply chain support.
Frequently Asked Questions (FAQ)
Q: Can the PIC12F675-I/P directly replace the PIC12CE673-10/P without PCB changes?
A: Yes. Both devices use identical 8-DIP (0.300", 7.62mm) through-hole packages with matching pin configurations and I/O counts (5 pins). Direct socket replacement is possible without PCB redesign.
Q: What is the primary functional difference between these parts?
A: The PIC12CE673-10/P uses OTP (One-Time Programmable) memory, allowing a single programming cycle. The PIC12F675-I/P uses FLASH memory, enabling unlimited reprogramming cycles. This makes the substitute ideal for development, prototyping, and applications requiring firmware updates.
Q: Are there any compatibility concerns with existing firmware?
A: Both devices share the same PIC core architecture and instruction set. Firmware written for the PIC12CE673-10/P will execute on the PIC12F675-I/P. However, verify that your application does not depend on the specific RAM size (128 x 8 vs. 64 x 8) or EEPROM size (16 x 8 vs. 128 x 8) differences.
Q: Which part should I choose for new designs?
A: For new designs, the PIC12F675-I/P is recommended due to its extended operating temperature range (-40°C to 85°C), lower minimum supply voltage (2V), higher ADC resolution (10-bit), and reprogrammability. These features provide greater design flexibility and future-proofing.
Q: Do both parts meet the same regulatory requirements?
A: Yes. Both the PIC12CE673-10/P and PIC12F675-I/P are ROHS3 compliant, REACH Unaffected, and classified as EAR99 for export purposes. They meet equivalent regulatory standards for industrial and commercial applications.
Q: What is the impact of the speed difference (10MHz vs. 20MHz)?
A: The PIC12F675-I/P operates at twice the clock speed. For most applications, this provides faster instruction execution and improved real-time responsiveness. Verify that your application's timing requirements are compatible with the faster execution speed.
Q: Can I use the PIC12F675-I/P in applications requiring operation below 3V?
A: Yes. The PIC12F675-I/P supports supply voltages as low as 2V, compared to the 3V minimum of the PIC12CE673-10/P. This enables use in battery-powered applications with lower voltage constraints.
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