PI7C9X2G304SLBQFDEX Equivalent & Substitute Parts

Part Overview

The PI7C9X2G304SLBQFDEX is a specialized interface IC manufactured by Diodes Incorporated, functioning as a 3-Port/4-Lane Packet Switch with PCI Express interface capability. This component is housed in a 128-LQFP package (14x14mm) and is classified as an active product with full RoHS3 compliance. The device is designed for packet switching applications requiring PCI Express connectivity in surface-mount configurations.

Substitute parts become necessary when the primary component experiences supply constraints, extended lead times, or when design flexibility permits functional equivalents that meet the same electrical and mechanical requirements.

Substiute Parts

PI7C9X2G304SLBQFDEX
Diodes IncorporatedIn Stock: 5228PI7C9X2G304SLBQFDEX Datasheet
PI7C9X2G304SLBQFDEX
Current Part
XIO2001IPNP
Texas InstrumentsIn Stock: 1394XIO2001IPNP Datasheet
XIO2001IPNP
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number PI7C9X2G304SLBQFDEX
Manufacturer Diodes Incorporated
Category Interface
Package / Case 128-LQFP (14x14)
Mounting Type Surface Mount
Interface Type PCI Express
Product Status Active
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)
Packaging Type Tape & Reel (TR)

Substitute Part Grouping Explanation

Substitution eligibility for the PI7C9X2G304SLBQFDEX is determined by the following critical parameters:

  • Package Compatibility: 128-pin LQFP or equivalent 128-pin QFP variant with 14x14mm footprint
  • Interface Standard: PCI Express support
  • Mounting Technology: Surface mount capability
  • Regulatory Compliance: RoHS3 compliance and REACH unaffected status
  • Moisture Sensitivity: MSL 3 rating (168 hours maximum)
  • Product Status: Active manufacturing status

The XIO2001IPNP from Texas Instruments qualifies as a substitute based on matching package pin count (128-pin), equivalent footprint dimensions (14x14mm), identical interface standard (PCI Express), surface-mount technology, and equivalent compliance certifications.

Parameter Comparison

Parameter PI7C9X2G304SLBQFDEX (Main) XIO2001IPNP (Substitute)
Manufacturer Diodes Incorporated Texas Instruments
Category Interface Interface
Package Type 128-LQFP 128-HTQFP Exposed Pad
Package Dimensions 14x14mm 14x14mm
Pin Count 128 128
Mounting Type Surface Mount Surface Mount
Interface Standard PCI Express PCI Express
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN Classification EAR99 EAR99
HTSUS Code 8542.39.0001 8542.39.0001

Engineering Selection Recommendations

Both the PI7C9X2G304SLBQFDEX and XIO2001IPNP maintain active product status with equivalent regulatory compliance profiles. Selection between these components should be based on:

  • Supply Availability: Current inventory levels and lead time requirements
  • Packaging Format: The main part is supplied in Tape & Reel format, while the substitute is supplied in Tray format; verify your assembly process compatibility
  • Voltage Supply Requirements: The XIO2001IPNP specifies dual voltage rails (1.35V ~ 1.65V and 3V ~ 3.6V), whereas the main part does not specify supply voltage in the provided data; confirm your design voltage requirements
  • Thermal Management: The XIO2001IPNP includes an exposed pad feature; evaluate thermal performance requirements for your application
  • Certification Alignment: Both components meet ROHS3, REACH, and EAR99 requirements

Frequently Asked Questions (FAQ)

Q: Can the XIO2001IPNP be used as a direct replacement for the PI7C9X2G304SLBQFDEX?

A: Both components share identical pin counts (128), package footprints (14x14mm), interface standards (PCI Express), and compliance certifications. However, functional equivalence requires verification of pinout assignment and signal compatibility at the application level, as these are different manufacturer designs.

Q: What is the difference between 128-LQFP and 128-HTQFP packaging?

A: Both are 128-pin quad flat pack variants with 14x14mm footprints suitable for surface mounting. The HTQFP variant includes an exposed thermal pad for enhanced heat dissipation. The footprint and land pattern compatibility should be verified with your PCB design tools.

Q: Does the packaging format (Tape & Reel vs. Tray) affect compatibility?

A: Packaging format affects handling, storage, and assembly process compatibility but does not affect electrical or mechanical performance. Verify your assembly equipment can process the substitute packaging format.

Q: Are there voltage supply differences between these parts?

A: The XIO2001IPNP specifies dual supply voltages (1.35V ~ 1.65V and 3V ~ 3.6V). The main part does not specify supply voltage in the provided documentation. Confirm your design voltage requirements before selection.

Q: Do both parts meet the same moisture sensitivity requirements?

A: Yes, both components are rated MSL 3 (168 hours maximum), indicating identical moisture handling and storage requirements.

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