PI74FCT828ATS Equivalent & Substitute Parts

Part Overview

The PI74FCT828ATS is a non-inverting buffer IC manufactured by Diodes Incorporated, designed for logic signal buffering applications with 3-state output capability. This component features 1 element with 10 bits per element, operating at 4.75V to 5.25V supply voltage. The part is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.

Substiute Parts

PI74FCT828ATS

Diodes IncorporatedIn Stock: 1087PI74FCT828ATS Datasheet

Current PartRFQ

SN74ALS29827DW

Texas InstrumentsIn Stock: 974SN74ALS29827DW Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the PI74FCT828ATS is determined by the following critical parameters:

• Logic Type: Buffer, Non-Inverting (functional equivalence requirement)
• Number of Elements: 1 (functional equivalence requirement)
• Number of Bits per Element: 10 (functional equivalence requirement)
• Output Type: 3-State (functional equivalence requirement)
• Voltage - Supply: 4.75V ~ 5.25V (electrical compatibility requirement)
• Mounting Type: Surface Mount (physical compatibility requirement)

The SN74ALS29827DW meets all functional and electrical requirements for substitution. Both parts operate within the same supply voltage range, provide identical logic functionality with 1 element and 10 bits per element, and feature 3-state output capability. Both are surface-mount devices suitable for equivalent PCB integration.

Parameter Comparison

Engineering Selection Recommendations

The SN74ALS29827DW from Texas Instruments serves as the functional equivalent for the obsolete PI74FCT828ATS. Selection of this substitute is supported by:

• Active product status ensuring long-term availability and supply chain reliability
• ROHS3 compliance meeting current environmental and regulatory standards
• Identical logic functionality and supply voltage specifications
• Higher output high current capability (24mA versus 15mA) providing improved drive strength

Design considerations for substitution include package differences: the SN74ALS29827DW uses 24-SOIC packaging compared to the 20-SOIC of the original part, requiring PCB layout modification. The operating temperature range of the substitute (0°C ~ 70°C) is narrower than the original (-40°C ~ 85°C), which may impact applications requiring extended temperature operation.

Frequently Asked Questions (FAQ)

Q: Can the SN74ALS29827DW directly replace the PI74FCT828ATS without PCB modifications?

A: No. While functionally equivalent, the SN74ALS29827DW uses 24-SOIC packaging versus the 20-SOIC of the PI74FCT828ATS. PCB layout and footprint modifications are required for physical integration.

Q: Are the supply voltage requirements identical between these parts?

A: Yes. Both the PI74FCT828ATS and SN74ALS29827DW operate within the 4.75V to 5.25V supply voltage range, ensuring electrical compatibility in existing designs.

Q: What is the significance of the different output high current specifications?

A: The SN74ALS29827DW provides 24mA output high current compared to 15mA for the PI74FCT828ATS. This higher drive strength can improve signal integrity in applications with higher capacitive loads or longer trace lengths.

Q: Does the narrower operating temperature range of the SN74ALS29827DW affect substitution suitability?

A: The SN74ALS29827DW operates from 0°C to 70°C, compared to -40°C to 85°C for the PI74FCT828ATS. Applications requiring operation outside the 0°C to 70°C range must retain the original part or identify alternative solutions.

Q: What compliance advantage does the SN74ALS29827DW offer?

A: The SN74ALS29827DW is ROHS3 compliant, meeting current environmental regulations. The PI74FCT828ATS is RoHS non-compliant, making the substitute preferable for new designs and systems subject to RoHS requirements.

Q: Are both parts suitable for surface-mount assembly?

A: Yes. Both the PI74FCT828ATS and SN74ALS29827DW are surface-mount devices, though the different package sizes require corresponding assembly process adjustments.