PI3V312LE Equivalent & Substitute Parts

Part Overview

The PI3V312LE is an active video multiplexer/demultiplexer interface IC manufactured by Diodes Incorporated. This 4-channel SPDT switch IC operates at 3.3V single supply with 8Ω maximum on-state resistance and 500MHz bandwidth, housed in a 16-TSSOP surface mount package. The part is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity rating. Equivalent substitute parts are identified based on matching functional architecture, electrical performance parameters, and package compatibility to enable direct replacement in circuit applications.

Substiute Parts

PI3V312LE

Diodes IncorporatedIn Stock: 1540PI3V312LE Datasheet

Current PartRFQ

ADG774ABRQZ

Analog Devices Inc.In Stock: 1276ADG774ABRQZ Datasheet

MFR RecommendedRFQ

ADG774ABRQZ-REEL7

Analog Devices Inc.In Stock: 6371ADG774ABRQZ-REEL7 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the PI3V312LE are qualified based on the following critical parameters that determine functional equivalence:

Functional Architecture Match:

• Switch circuit type: SPDT (Single Pole Double Throw)
• Multiplexer/demultiplexer configuration: 2:1
• Number of channels: 4 circuits

Electrical Performance Compatibility:

• Supply voltage range must encompass or exceed 3.3V operation
• On-state resistance must not exceed 8Ω maximum
• Bandwidth must support 500MHz operation
• Operating temperature range: -40°C to 85°C minimum

Physical & Compliance Requirements:

• Surface mount technology
• 16-pin package configuration
• ROHS3 compliance
• MSL rating of 1 (Unlimited)

The ADG774ABRQZ and ADG774ABRQZ-REEL7 (Analog Devices Inc.) meet all substitution criteria. Both variants share identical electrical specifications and differ only in packaging format (Tube vs. Cut Tape & Digi-Reel).

Parameter Comparison

Engineering Selection Recommendations

Both ADG774ABRQZ variants qualify as direct functional substitutes for the PI3V312LE based on matching switch architecture, channel configuration, and operating specifications. Selection between substitute options depends on procurement and assembly requirements:

ADG774ABRQZ (Tube Packaging): Standard tube packaging format suitable for manual assembly and small-volume production runs.

ADG774ABRQZ-REEL7 (Cut Tape & Digi-Reel): Reel packaging format optimized for automated pick-and-place assembly and high-volume manufacturing operations.

Both substitute parts maintain ROHS3 compliance, unlimited MSL rating, and active product status. The ADG774 series demonstrates superior on-state resistance performance (4.6Ω vs. 8Ω), providing improved signal integrity margins. Package geometry differences (16-SSOP vs. 16-TSSOP) require PCB layout verification to confirm mechanical fit within existing footprints.

Frequently Asked Questions (FAQ)

Q: Can ADG774ABRQZ directly replace PI3V312LE in existing designs?

A: Functional substitution is supported based on matching SPDT 2:1 multiplexer architecture and 4-channel configuration. PCB layout verification is required due to package case differences (16-SSOP vs. 16-TSSOP). Pin-to-pin compatibility must be confirmed against schematic documentation.

Q: What are the key electrical differences between PI3V312LE and ADG774ABRQZ?

A: The ADG774ABRQZ provides lower on-state resistance (4.6Ω vs. 8Ω) and wider supply voltage range (3V to 5V vs. 3.3V fixed). The PI3V312LE offers higher bandwidth (500MHz vs. 400MHz). Both operate across identical temperature ranges and maintain equivalent compliance certifications.

Q: Are packaging format differences between ADG774ABRQZ and ADG774ABRQZ-REEL7 functionally significant?

A: No. Both variants contain identical die and electrical specifications. Packaging differences (Tube vs. Cut Tape & Digi-Reel) affect only procurement, storage, and assembly handling. Selection is based on manufacturing process requirements.

Q: What compliance certifications apply to substitute parts?

A: Both ADG774ABRQZ variants maintain ROHS3 compliance, MSL 1 (Unlimited) rating, REACH Unaffected status, and EAR99 export classification, matching the PI3V312LE certification profile.

Q: Are there pin configuration differences between PI3V312LE and ADG774ABRQZ?

A: Both parts use 16-pin configurations with SPDT switch topology. Physical package dimensions differ (TSSOP vs. SSOP), requiring PCB footprint verification. Functional pin assignments must be cross-referenced against manufacturer datasheets for specific application circuits.