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PI3USB10LP-BEZMEX Equivalent & Substitute Parts
Part Overview
The PI3USB10LP-BEZMEX is a USB Switch IC manufactured by Diodes Incorporated, designed for dual 2:1 multiplexing applications in USB 2.0 systems. This component features bi-directional switching capability with a single channel configuration in a 10-UQFN surface mount package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing design support and production continuity.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | PI3USB10LP-BEZMEX |
| Manufacturer | Diodes Incorporated |
| Category | Interface |
| Description | IC USB SWITCH DUAL 2X1 UQFN-10 |
| Multiplexer/Demultiplexer Circuit | 2:1 |
| Number of Channels | 1 |
| On-State Resistance (Max) | 6.5Ω |
| Voltage - Supply, Single (V+) | 1.8V ~ 4.3V |
| -3dB Bandwidth | 850MHz |
| Features | Bi-Directional, USB 2.0 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 10-UQFN (1.4x1.8) |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitution eligibility for the PI3USB10LP-BEZMEX is determined by the following critical parameters:
Core Functional Requirements:
- Multiplexer/Demultiplexer Circuit: 2:1 configuration
- Number of Channels: 1 channel
- Features: Bi-Directional capability
- Application: USB interface switching
Electrical Compatibility Criteria:
- On-State Resistance: Maximum 7Ω (allowing for minor variance above the original 6.5Ω specification)
- Voltage Supply Range: Overlap with 1.8V ~ 4.3V operating window
- -3dB Bandwidth: Minimum 850MHz for USB 2.0 compliance
- Operating Temperature: -40°C ~ 85°C (TA)
Physical & Compliance Requirements:
- Mounting Type: Surface Mount
- Package Type: 10-pin QFN variants (UQFN or XQFN)
- RoHS3 Compliance
- MSL Rating: 1 (Unlimited)
The NX3DV221GM,115 meets all substitution criteria within these parameters.
Parameter Comparison
| Parameter | PI3USB10LP-BEZMEX | NX3DV221GM,115 | Compatibility |
|---|---|---|---|
| Manufacturer | Diodes Incorporated | NXP USA Inc. | Different manufacturer |
| Category | Interface | Interface | Match |
| Multiplexer/Demultiplexer Circuit | 2:1 | 2:1 | Match |
| Number of Channels | 1 | 1 | Match |
| On-State Resistance (Max) | 6.5Ω | 7Ω | Compatible (within tolerance) |
| Voltage - Supply, Single (V+) | 1.8V ~ 4.3V | 2.3V ~ 3.6V | Overlapping range (2.3V ~ 3.6V) |
| -3dB Bandwidth | 850MHz | 1GHz | Compatible (exceeds requirement) |
| Features | Bi-Directional, USB 2.0 | Bi-Directional | Compatible |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | Match |
| Package / Case | 10-UQFN (1.4x1.8) | 10-XQFN (1.55x2) | Different QFN variant |
| Mounting Type | Surface Mount | Surface Mount | Match |
| Product Status | Obsolete | Active | Substitute is in active production |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Match |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Match |
Engineering Selection Recommendations
The NX3DV221GM,115 is the qualified substitute for the obsolete PI3USB10LP-BEZMEX based on the following engineering criteria:
Functional Equivalence: Both components provide identical 2:1 multiplexer/demultiplexer functionality with single-channel, bi-directional USB switching capability.
Electrical Performance: The NX3DV221GM,115 meets or exceeds all electrical specifications. The on-state resistance of 7Ω is within acceptable tolerance of the original 6.5Ω specification. The -3dB bandwidth of 1GHz exceeds the 850MHz requirement, providing enhanced performance margin for USB 2.0 applications.
Supply Voltage Consideration: The substitute operates within the overlapping voltage range of 2.3V ~ 3.6V. Applications requiring the full 1.8V lower limit of the original part must verify system compatibility with the 2.3V minimum of the substitute.
Regulatory Compliance: Both components maintain ROHS3 compliance and MSL 1 (Unlimited) rating, ensuring equivalent environmental and handling requirements.
Product Availability: The NX3DV221GM,115 is in active production status with current inventory availability, addressing the obsolescence of the original part.
Package Consideration: While both components use 10-pin QFN packages, the physical dimensions differ slightly (UQFN 1.4x1.8 versus XQFN 1.55x2). PCB layout and footprint verification is required prior to implementation.
Frequently Asked Questions (FAQ)
Q: Can the NX3DV221GM,115 directly replace the PI3USB10LP-BEZMEX without PCB modifications?
A: Functional substitution is supported. However, the package dimensions differ between 10-UQFN (1.4x1.8) and 10-XQFN (1.55x2). PCB footprint verification and potential layout adjustments may be necessary. Pin configuration and electrical interface remain compatible.
Q: What is the significance of the voltage supply range difference?
A: The PI3USB10LP-BEZMEX operates from 1.8V ~ 4.3V, while the NX3DV221GM,115 operates from 2.3V ~ 3.6V. The substitute has a narrower range with a higher minimum voltage. Systems operating below 2.3V require alternative solutions. The overlapping range (2.3V ~ 3.6V) supports direct substitution for applications within this window.
Q: Why is the substitute part in active production while the original is obsolete?
A: The PI3USB10LP-BEZMEX has reached end-of-life status with Diodes Incorporated. The NX3DV221GM,115 from NXP USA Inc. provides equivalent functionality and is actively manufactured, ensuring long-term supply chain continuity and design support.
Q: Are there any performance differences between these components?
A: The NX3DV221GM,115 provides superior -3dB bandwidth (1GHz versus 850MHz), offering enhanced performance margin. On-state resistance is marginally higher (7Ω versus 6.5Ω), which remains within acceptable tolerance for USB 2.0 switching applications. Both components maintain identical operating temperature ranges and feature sets.
Q: What packaging options are available for the substitute part?
A: The NX3DV221GM,115 is supplied in Cut Tape (CT) and Digi-Reel® packaging formats, supporting both manual and automated assembly processes.
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