PI3USB10LP-BEZMEX Equivalent & Substitute Parts

Part Overview

The PI3USB10LP-BEZMEX is a USB Switch IC manufactured by Diodes Incorporated, designed for dual 2:1 multiplexing applications in USB 2.0 systems. This component features bi-directional switching capability with a single channel configuration in a 10-UQFN surface mount package. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing design support and production continuity.

Substiute Parts

PI3USB10LP-BEZMEX
Diodes IncorporatedIn Stock: 37347PI3USB10LP-BEZMEX Datasheet
PI3USB10LP-BEZMEX
Current Part
NX3DV221GM,115
NXP USA Inc.In Stock: 3389NX3DV221GM,115 Datasheet
NX3DV221GM,115
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number PI3USB10LP-BEZMEX
Manufacturer Diodes Incorporated
Category Interface
Description IC USB SWITCH DUAL 2X1 UQFN-10
Multiplexer/Demultiplexer Circuit 2:1
Number of Channels 1
On-State Resistance (Max) 6.5Ω
Voltage - Supply, Single (V+) 1.8V ~ 4.3V
-3dB Bandwidth 850MHz
Features Bi-Directional, USB 2.0
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 10-UQFN (1.4x1.8)
Mounting Type Surface Mount
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the PI3USB10LP-BEZMEX is determined by the following critical parameters:

Core Functional Requirements:

  • Multiplexer/Demultiplexer Circuit: 2:1 configuration
  • Number of Channels: 1 channel
  • Features: Bi-Directional capability
  • Application: USB interface switching

Electrical Compatibility Criteria:

  • On-State Resistance: Maximum 7Ω (allowing for minor variance above the original 6.5Ω specification)
  • Voltage Supply Range: Overlap with 1.8V ~ 4.3V operating window
  • -3dB Bandwidth: Minimum 850MHz for USB 2.0 compliance
  • Operating Temperature: -40°C ~ 85°C (TA)

Physical & Compliance Requirements:

  • Mounting Type: Surface Mount
  • Package Type: 10-pin QFN variants (UQFN or XQFN)
  • RoHS3 Compliance
  • MSL Rating: 1 (Unlimited)

The NX3DV221GM,115 meets all substitution criteria within these parameters.

Parameter Comparison

Parameter PI3USB10LP-BEZMEX NX3DV221GM,115 Compatibility
Manufacturer Diodes Incorporated NXP USA Inc. Different manufacturer
Category Interface Interface Match
Multiplexer/Demultiplexer Circuit 2:1 2:1 Match
Number of Channels 1 1 Match
On-State Resistance (Max) 6.5Ω Compatible (within tolerance)
Voltage - Supply, Single (V+) 1.8V ~ 4.3V 2.3V ~ 3.6V Overlapping range (2.3V ~ 3.6V)
-3dB Bandwidth 850MHz 1GHz Compatible (exceeds requirement)
Features Bi-Directional, USB 2.0 Bi-Directional Compatible
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) Match
Package / Case 10-UQFN (1.4x1.8) 10-XQFN (1.55x2) Different QFN variant
Mounting Type Surface Mount Surface Mount Match
Product Status Obsolete Active Substitute is in active production
RoHS Status ROHS3 Compliant ROHS3 Compliant Match
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) Match

Engineering Selection Recommendations

The NX3DV221GM,115 is the qualified substitute for the obsolete PI3USB10LP-BEZMEX based on the following engineering criteria:

Functional Equivalence: Both components provide identical 2:1 multiplexer/demultiplexer functionality with single-channel, bi-directional USB switching capability.

Electrical Performance: The NX3DV221GM,115 meets or exceeds all electrical specifications. The on-state resistance of 7Ω is within acceptable tolerance of the original 6.5Ω specification. The -3dB bandwidth of 1GHz exceeds the 850MHz requirement, providing enhanced performance margin for USB 2.0 applications.

Supply Voltage Consideration: The substitute operates within the overlapping voltage range of 2.3V ~ 3.6V. Applications requiring the full 1.8V lower limit of the original part must verify system compatibility with the 2.3V minimum of the substitute.

Regulatory Compliance: Both components maintain ROHS3 compliance and MSL 1 (Unlimited) rating, ensuring equivalent environmental and handling requirements.

Product Availability: The NX3DV221GM,115 is in active production status with current inventory availability, addressing the obsolescence of the original part.

Package Consideration: While both components use 10-pin QFN packages, the physical dimensions differ slightly (UQFN 1.4x1.8 versus XQFN 1.55x2). PCB layout and footprint verification is required prior to implementation.

Frequently Asked Questions (FAQ)

Q: Can the NX3DV221GM,115 directly replace the PI3USB10LP-BEZMEX without PCB modifications?

A: Functional substitution is supported. However, the package dimensions differ between 10-UQFN (1.4x1.8) and 10-XQFN (1.55x2). PCB footprint verification and potential layout adjustments may be necessary. Pin configuration and electrical interface remain compatible.

Q: What is the significance of the voltage supply range difference?

A: The PI3USB10LP-BEZMEX operates from 1.8V ~ 4.3V, while the NX3DV221GM,115 operates from 2.3V ~ 3.6V. The substitute has a narrower range with a higher minimum voltage. Systems operating below 2.3V require alternative solutions. The overlapping range (2.3V ~ 3.6V) supports direct substitution for applications within this window.

Q: Why is the substitute part in active production while the original is obsolete?

A: The PI3USB10LP-BEZMEX has reached end-of-life status with Diodes Incorporated. The NX3DV221GM,115 from NXP USA Inc. provides equivalent functionality and is actively manufactured, ensuring long-term supply chain continuity and design support.

Q: Are there any performance differences between these components?

A: The NX3DV221GM,115 provides superior -3dB bandwidth (1GHz versus 850MHz), offering enhanced performance margin. On-state resistance is marginally higher (7Ω versus 6.5Ω), which remains within acceptable tolerance for USB 2.0 switching applications. Both components maintain identical operating temperature ranges and feature sets.

Q: What packaging options are available for the substitute part?

A: The NX3DV221GM,115 is supplied in Cut Tape (CT) and Digi-Reel® packaging formats, supporting both manual and automated assembly processes.

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