PI3L301DAE Equivalent & Substitute Parts

Part Overview

The PI3L301DAE is an 8-channel telecommunications switch IC manufactured by Diodes Incorporated in a 48-TSSOP package. This component is classified as obsolete, making substitute parts necessary for new designs and ongoing production requirements. The part operates within a 3V to 3.6V single supply voltage range with a maximum on-state resistance of 8Ohm and supports 10/100/1000 Base-T Ethernet switching applications across an operating temperature range of -40°C to 85°C.

Substiute Parts

PI3L301DAE
Diodes IncorporatedIn Stock: 1546PI3L301DAE Datasheet
PI3L301DAE
Current Part
TS3L301DGG
Texas InstrumentsIn Stock: 2223TS3L301DGG Datasheet
TS3L301DGG
MFR Recommended
TS3L301DGGR
Texas InstrumentsIn Stock: 22897TS3L301DGGR Datasheet
TS3L301DGGR
MFR Recommended
TS3L301DGVR
Texas InstrumentsIn Stock: 2767TS3L301DGVR Datasheet
TS3L301DGVR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number PI3L301DAE
Manufacturer Diodes Incorporated
Category Interface
Number of Channels 8
On-State Resistance (Max) 8Ohm
Voltage - Supply, Single (V+) 3V ~ 3.6V
-3dB Bandwidth 700MHz
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 48-TFSOP (0.240", 6.10mm Width)
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the PI3L301DAE is determined by the following critical parameters:

  • Number of Channels: Must equal 8 channels
  • On-State Resistance (Max): Must not exceed 8Ohm
  • Voltage - Supply, Single (V+): Must support 3V ~ 3.6V range
  • Operating Temperature: Must support -40°C ~ 85°C (TA)
  • Package / Case: Must be compatible with 48-TFSOP or 48-TVSOP footprints
  • RoHS Status: Must maintain ROHS3 Compliance
  • Moisture Sensitivity Level (MSL): Must be rated 1 (Unlimited)

The Texas Instruments TS3L301 series parts meet all substitution criteria. TS3L301DGG and TS3L301DGGR are functionally equivalent with identical electrical specifications and the same 48-TFSOP package footprint. TS3L301DGVR provides electrical equivalence with a narrower 48-TVSOP package variant (0.173" width versus 0.240" width), suitable for space-constrained applications where PCB layout permits the reduced package width.

Parameter Comparison

Parameter PI3L301DAE TS3L301DGG TS3L301DGGR TS3L301DGVR
Manufacturer Diodes Incorporated Texas Instruments Texas Instruments Texas Instruments
Number of Channels 8 8 8 8
On-State Resistance (Max) 8Ohm 8Ohm 8Ohm 8Ohm
Voltage - Supply, Single (V+) 3V ~ 3.6V 3V ~ 3.6V 3V ~ 3.6V 3V ~ 3.6V
-3dB Bandwidth 700MHz 900MHz 900MHz 900MHz
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package / Case 48-TFSOP (0.240", 6.10mm Width) 48-TFSOP (0.240", 6.10mm Width) 48-TFSOP (0.240", 6.10mm Width) 48-TFSOP (0.173", 4.40mm Width)
Product Status Obsolete Last Time Buy Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Primary Recommendation: TS3L301DGGR

TS3L301DGGR is the preferred substitute for new designs and production. This part carries Active product status with the highest inventory availability (22,808 pcs), ensuring long-term supply continuity. It maintains identical electrical and mechanical specifications to the PI3L301DAE with ROHS3 compliance and MSL 1 rating. The Cut Tape and Digi-Reel packaging format supports both manual and automated assembly processes.

Secondary Recommendation: TS3L301DGG

TS3L301DGG provides equivalent functionality with Last Time Buy status. This variant is suitable for applications where Tube packaging is preferred or where existing supply agreements specify this packaging format. Electrical performance and compliance certifications are identical to TS3L301DGGR.

Alternative for Space-Constrained Designs: TS3L301DGVR

TS3L301DGVR offers the same electrical specifications with a narrower 48-TVSOP package (0.173" width). This variant is appropriate only when PCB layout constraints require reduced package width and when the design has been validated for the TVSOP footprint. Active product status ensures availability.

Frequently Asked Questions (FAQ)

Q: Can TS3L301DGGR be used as a direct replacement for PI3L301DAE without PCB modifications?

A: Yes. TS3L301DGGR maintains identical pin configuration, package footprint (48-TFSOP, 0.240" width), electrical specifications, and operating parameters. No PCB layout changes are required for direct substitution.

Q: What is the difference between TS3L301DGG and TS3L301DGGR?

A: Both parts are electrically and mechanically identical. The primary difference is packaging format: TS3L301DGG is supplied in Tube packaging, while TS3L301DGGR is supplied in Cut Tape and Digi-Reel format. TS3L301DGGR has higher inventory availability and Active product status.

Q: Can TS3L301DGVR be used if the original design uses PI3L301DAE?

A: TS3L301DGVR is electrically equivalent but uses a narrower 48-TVSOP package (0.173" width versus 0.240" width). PCB footprint modification is required. This substitution is only valid if the design has been re-validated for the TVSOP package and layout permits the reduced width.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. PI3L301DAE and all recommended substitutes (TS3L301DGG, TS3L301DGGR, TS3L301DGVR) maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity rating.

Q: What is the bandwidth difference between PI3L301DAE and TS3L301 substitutes?

A: PI3L301DAE operates at 700MHz -3dB bandwidth. All TS3L301 substitutes operate at 900MHz -3dB bandwidth. This represents improved performance and does not restrict compatibility in applications designed for the original part.

Q: Which substitute should be selected for new production?

A: TS3L301DGGR is the recommended choice for new production due to Active product status, highest inventory availability, and standard Cut Tape/Digi-Reel packaging format compatible with automated assembly processes.

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