PI3B32X245BE Equivalent & Substitute Parts

Part Overview

The PI3B32X245BE is an 8 x 1:1 bus switch logic IC manufactured by Diodes Incorporated, housed in a 40-BQSOP surface mount package. This component is designed for signal routing and switching applications requiring single supply operation. The part is classified as obsolete, making identification of compatible substitute components essential for ongoing design support and procurement planning.

Substiute Parts

PI3B32X245BE

Diodes IncorporatedIn Stock: 1205PI3B32X245BE Datasheet

Current PartRFQ

QS32X245Q2G

Renesas Electronics CorporationIn Stock: 1581QS32X245Q2G Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute components for the PI3B32X245BE are identified based on the following critical parameters that determine functional compatibility:

• Circuit Configuration: 8 x 1:1 bus switch topology
• Independent Circuits: 2 independent switching circuits
• Mounting Type: Surface mount technology
• Physical Package Footprint: 40-FSOP (0.154", 3.90mm Width)
• Operating Temperature Range: -40°C ~ 85°C
• Regulatory Compliance: ROHS3 Compliant, REACH Unaffected

The QS32X245Q2G from Renesas Electronics Corporation satisfies these core functional and mechanical requirements. While the voltage supply range differs (4.75V ~ 5.25V versus 3V ~ 3.6V), this represents a distinct product variant within the same functional family rather than a direct pin-for-pin replacement. Selection between these variants depends on the specific supply voltage requirements of the target application.

Parameter Comparison

Engineering Selection Recommendations

Both the PI3B32X245BE and QS32X245Q2G meet ROHS3 compliance and REACH requirements, establishing regulatory equivalence for applications subject to these standards. The primary differentiation factor is the supply voltage specification: the PI3B32X245BE operates at 3V ~ 3.6V, while the QS32X245Q2G requires 4.75V ~ 5.25V operation.

Selection between these components must be determined by the actual supply voltage available in the target circuit. Applying a component outside its specified voltage range will result in functional failure or device damage. Both components share identical circuit topology, independent circuit count, operating temperature range, and physical package dimensions, ensuring mechanical and thermal compatibility when voltage requirements are satisfied.

Frequently Asked Questions (FAQ)

Q: Can the QS32X245Q2G directly replace the PI3B32X245BE in an existing design?

A: Direct replacement is possible only if the circuit supply voltage is compatible with the QS32X245Q2G specification of 4.75V ~ 5.25V. If the original design operates at 3V ~ 3.6V, the QS32X245Q2G will not function. Verify supply voltage before substitution.

Q: Are the package dimensions identical between these two parts?

A: Both components use the 40-FSOP package with identical physical dimensions (0.154", 3.90mm Width). The supplier device packages differ (40-BQSOP versus 40-QVSOP), but the footprint and mounting characteristics are equivalent for PCB layout purposes.

Q: What is the significance of the different supplier device package designations?

A: The 40-BQSOP and 40-QVSOP designations represent different manufacturer packaging standards for the same physical 40-FSOP form factor. These designations do not affect PCB compatibility or electrical performance when the voltage requirements are met.

Q: Are both parts suitable for new designs given their obsolete status?

A: Both components are classified as obsolete. For new designs, consultation with component distributors regarding long-term availability and consideration of active alternative bus switch solutions is recommended. For legacy system support and maintenance, these parts remain available through established distribution channels.

Q: Do these components have identical operating temperature ranges?

A: Yes, both the PI3B32X245BE and QS32X245Q2G operate across the -40°C ~ 85°C temperature range, ensuring thermal compatibility in equivalent environmental conditions.