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PI3325-00-BGMZ Equivalent & Substitute Parts
Part Overview
The PI3325-00-BGMZ is a buck switching regulator IC manufactured by Vicor Corporation, designed to deliver a fixed 5V output at 20A from an input voltage range of 14V to 42V. This component operates as a positive step-down converter with a single output configuration and integrated synchronous rectification. The part is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Vicor Corporation |
| Category | Power Management (PMIC) |
| Function | Step-Down (Buck) |
| Output Voltage | 5V Fixed |
| Output Current | 20A |
| Input Voltage Range | 14V to 42V |
| Switching Frequency | 7MHz |
| Synchronous Rectifier | Yes |
| Operating Temperature Range | -55°C to 120°C |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| MSL Rating | 3 (168 Hours) |
Substitute Part Grouping Explanation
The PI3325-00-LGMZ qualifies as a direct functional equivalent to the PI3325-00-BGMZ based on the following critical parameters:
Matching Electrical Specifications:
- Input voltage range: 14V to 42V
- Output voltage: 5V fixed
- Output current: 20A
- Switching frequency: 7MHz
- Synchronous rectification: Enabled
- Operating temperature range: -55°C to 120°C
Matching Mechanical and Compliance Specifications:
- Mounting type: Surface Mount
- Base product number: PI3325
- MSL rating: 3 (168 Hours)
- ECCN classification: EAR99
- HTSUS code: 8542.39.0001
Distinguishing Characteristic: The primary difference between these parts is the package format. The PI3325-00-BGMZ uses a 110-BBGA (Ball Grid Array) module with dimensions 14.5x10.5mm, while the PI3325-00-LGMZ uses a 110-BLGA (Land Grid Array) module with dimensions 14x10mm. Both packages are surface-mount configurations suitable for automated assembly.
Parameter Comparison
| Parameter | PI3325-00-BGMZ | PI3325-00-LGMZ | Match |
|---|---|---|---|
| Manufacturer | Vicor Corporation | Vicor Corporation | Yes |
| Category | Power Management (PMIC) | Power Management (PMIC) | Yes |
| Function | Step-Down | Step-Down | Yes |
| Output Voltage | 5V Fixed | 5V Fixed | Yes |
| Output Current | 20A | 20A | Yes |
| Input Voltage (Min) | 14V | 14V | Yes |
| Input Voltage (Max) | 42V | 42V | Yes |
| Switching Frequency | 7MHz | 7MHz | Yes |
| Synchronous Rectifier | Yes | Yes | Yes |
| Operating Temperature | -55°C to 120°C | -55°C to 120°C | Yes |
| Mounting Type | Surface Mount | Surface Mount | Yes |
| Package / Case | 110-BBGA Module (14.5x10.5mm) | 110-BLGA Module (14x10mm) | Different |
| Packaging Format | Not specified | Tray | Different |
| Product Status | Obsolete | Obsolete | Yes |
| RoHS Status | RoHS Compliant | ROHS3 Compliant | Compatible |
| MSL Rating | 3 (168 Hours) | 3 (168 Hours) | Yes |
| ECCN | EAR99 | EAR99 | Yes |
| HTSUS | 8542.39.0001 | 8542.39.0001 | Yes |
Engineering Selection Recommendations
The PI3325-00-LGMZ serves as a direct electrical and functional substitute for the PI3325-00-BGMZ. Both components deliver identical performance across all critical power management parameters: input voltage range, output voltage and current specifications, switching frequency, and thermal operating range.
Compliance Considerations:
Both parts maintain obsolete product status and carry equivalent export classifications (EAR99). The PI3325-00-LGMZ provides enhanced regulatory compliance through ROHS3 certification compared to the standard RoHS compliance of the PI3325-00-BGMZ. Both parts are REACH-classified, though with different regulatory statuses (REACH Affected versus REACH Unaffected).
Package Compatibility:
The substitution requires PCB layout modification due to package format differences. The PI3325-00-BGMZ employs a 110-BBGA (Ball Grid Array) configuration, while the PI3325-00-LGMZ uses a 110-BLGA (Land Grid Array) configuration. These packages have different footprints and interconnection methods. The BLGA format uses land-based connections rather than solder balls, necessitating redesign of the PCB landing pattern and assembly process adjustments.
Inventory and Availability:
The PI3325-00-LGMZ maintains higher inventory availability (1204 units) compared to the PI3325-00-BGMZ (772 units), supporting procurement continuity for ongoing production requirements.
Frequently Asked Questions (FAQ)
Q: Can the PI3325-00-LGMZ replace the PI3325-00-BGMZ without PCB modifications?
A: No. While the electrical specifications are identical, the package formats differ fundamentally. The BGMZ uses a Ball Grid Array (BGA) with solder balls, while the LGMZ uses a Land Grid Array (LGA) with flat lands. PCB footprint redesign and revalidation are required.
Q: Are the electrical performance characteristics identical between these two parts?
A: Yes. Both parts deliver 5V at 20A from a 14V to 42V input, operate at 7MHz switching frequency, include synchronous rectification, and support the same -55°C to 120°C temperature range.
Q: What is the primary reason for substitution between these parts?
A: Both parts are classified as obsolete. The PI3325-00-LGMZ provides an alternative from the same manufacturer with identical electrical performance but different packaging, allowing design flexibility for new implementations or redesigns.
Q: Do both parts meet current regulatory requirements?
A: Both parts carry RoHS compliance certifications. The PI3325-00-LGMZ provides ROHS3 compliance, representing a more current regulatory standard. Both parts are classified under EAR99 export control and carry the same HTSUS commodity code.
Q: What are the moisture sensitivity considerations for these parts?
A: Both parts carry MSL (Moisture Sensitivity Level) rating 3 with a 168-hour floor life. Identical handling, storage, and reflow procedures apply to both components.
Q: How do the package dimensions affect board design?
A: The PI3325-00-BGMZ measures 14.5x10.5mm, while the PI3325-00-LGMZ measures 14x10mm. The LGMZ is slightly smaller. However, the primary design impact stems from the BGA-to-LGA transition, which affects via placement, trace routing, and assembly equipment compatibility rather than board space alone.
Q: Can these parts be used interchangeably in existing designs?
A: No. Existing designs using the PI3325-00-BGMZ require PCB layout modifications to accommodate the PI3325-00-LGMZ package format. Assembly process parameters and reflow profiles may also require adjustment based on the LGA interconnection method.
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