PI3325-00-BGMZ Equivalent & Substitute Parts

Part Overview

The PI3325-00-BGMZ is a buck switching regulator IC manufactured by Vicor Corporation, designed to deliver a fixed 5V output at 20A from an input voltage range of 14V to 42V. This component operates as a positive step-down converter with a single output configuration and integrated synchronous rectification. The part is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement requirements.

Substiute Parts

PI3325-00-BGMZ
Vicor CorporationIn Stock: 823PI3325-00-BGMZ Datasheet
PI3325-00-BGMZ
Current Part
PI3325-00-LGMZ
Vicor CorporationIn Stock: 1244PI3325-00-LGMZ Datasheet
PI3325-00-LGMZ
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Key Parameters

Parameter Value
Manufacturer Vicor Corporation
Category Power Management (PMIC)
Function Step-Down (Buck)
Output Voltage 5V Fixed
Output Current 20A
Input Voltage Range 14V to 42V
Switching Frequency 7MHz
Synchronous Rectifier Yes
Operating Temperature Range -55°C to 120°C
Mounting Type Surface Mount
RoHS Status RoHS Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

The PI3325-00-LGMZ qualifies as a direct functional equivalent to the PI3325-00-BGMZ based on the following critical parameters:

Matching Electrical Specifications:

  • Input voltage range: 14V to 42V
  • Output voltage: 5V fixed
  • Output current: 20A
  • Switching frequency: 7MHz
  • Synchronous rectification: Enabled
  • Operating temperature range: -55°C to 120°C

Matching Mechanical and Compliance Specifications:

  • Mounting type: Surface Mount
  • Base product number: PI3325
  • MSL rating: 3 (168 Hours)
  • ECCN classification: EAR99
  • HTSUS code: 8542.39.0001

Distinguishing Characteristic: The primary difference between these parts is the package format. The PI3325-00-BGMZ uses a 110-BBGA (Ball Grid Array) module with dimensions 14.5x10.5mm, while the PI3325-00-LGMZ uses a 110-BLGA (Land Grid Array) module with dimensions 14x10mm. Both packages are surface-mount configurations suitable for automated assembly.

Parameter Comparison

Parameter PI3325-00-BGMZ PI3325-00-LGMZ Match
Manufacturer Vicor Corporation Vicor Corporation Yes
Category Power Management (PMIC) Power Management (PMIC) Yes
Function Step-Down Step-Down Yes
Output Voltage 5V Fixed 5V Fixed Yes
Output Current 20A 20A Yes
Input Voltage (Min) 14V 14V Yes
Input Voltage (Max) 42V 42V Yes
Switching Frequency 7MHz 7MHz Yes
Synchronous Rectifier Yes Yes Yes
Operating Temperature -55°C to 120°C -55°C to 120°C Yes
Mounting Type Surface Mount Surface Mount Yes
Package / Case 110-BBGA Module (14.5x10.5mm) 110-BLGA Module (14x10mm) Different
Packaging Format Not specified Tray Different
Product Status Obsolete Obsolete Yes
RoHS Status RoHS Compliant ROHS3 Compliant Compatible
MSL Rating 3 (168 Hours) 3 (168 Hours) Yes
ECCN EAR99 EAR99 Yes
HTSUS 8542.39.0001 8542.39.0001 Yes

Engineering Selection Recommendations

The PI3325-00-LGMZ serves as a direct electrical and functional substitute for the PI3325-00-BGMZ. Both components deliver identical performance across all critical power management parameters: input voltage range, output voltage and current specifications, switching frequency, and thermal operating range.

Compliance Considerations:

Both parts maintain obsolete product status and carry equivalent export classifications (EAR99). The PI3325-00-LGMZ provides enhanced regulatory compliance through ROHS3 certification compared to the standard RoHS compliance of the PI3325-00-BGMZ. Both parts are REACH-classified, though with different regulatory statuses (REACH Affected versus REACH Unaffected).

Package Compatibility:

The substitution requires PCB layout modification due to package format differences. The PI3325-00-BGMZ employs a 110-BBGA (Ball Grid Array) configuration, while the PI3325-00-LGMZ uses a 110-BLGA (Land Grid Array) configuration. These packages have different footprints and interconnection methods. The BLGA format uses land-based connections rather than solder balls, necessitating redesign of the PCB landing pattern and assembly process adjustments.

Inventory and Availability:

The PI3325-00-LGMZ maintains higher inventory availability (1204 units) compared to the PI3325-00-BGMZ (772 units), supporting procurement continuity for ongoing production requirements.

Frequently Asked Questions (FAQ)

Q: Can the PI3325-00-LGMZ replace the PI3325-00-BGMZ without PCB modifications?

A: No. While the electrical specifications are identical, the package formats differ fundamentally. The BGMZ uses a Ball Grid Array (BGA) with solder balls, while the LGMZ uses a Land Grid Array (LGA) with flat lands. PCB footprint redesign and revalidation are required.

Q: Are the electrical performance characteristics identical between these two parts?

A: Yes. Both parts deliver 5V at 20A from a 14V to 42V input, operate at 7MHz switching frequency, include synchronous rectification, and support the same -55°C to 120°C temperature range.

Q: What is the primary reason for substitution between these parts?

A: Both parts are classified as obsolete. The PI3325-00-LGMZ provides an alternative from the same manufacturer with identical electrical performance but different packaging, allowing design flexibility for new implementations or redesigns.

Q: Do both parts meet current regulatory requirements?

A: Both parts carry RoHS compliance certifications. The PI3325-00-LGMZ provides ROHS3 compliance, representing a more current regulatory standard. Both parts are classified under EAR99 export control and carry the same HTSUS commodity code.

Q: What are the moisture sensitivity considerations for these parts?

A: Both parts carry MSL (Moisture Sensitivity Level) rating 3 with a 168-hour floor life. Identical handling, storage, and reflow procedures apply to both components.

Q: How do the package dimensions affect board design?

A: The PI3325-00-BGMZ measures 14.5x10.5mm, while the PI3325-00-LGMZ measures 14x10mm. The LGMZ is slightly smaller. However, the primary design impact stems from the BGA-to-LGA transition, which affects via placement, trace routing, and assembly equipment compatibility rather than board space alone.

Q: Can these parts be used interchangeably in existing designs?

A: No. Existing designs using the PI3325-00-BGMZ require PCB layout modifications to accommodate the PI3325-00-LGMZ package format. Assembly process parameters and reflow profiles may also require adjustment based on the LGA interconnection method.

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