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PFMF.150.2 Polymeric PTC Resettable Fuse Equivalent & Substitute Parts
Part Overview
The PFMF.150.2 is a polymeric PTC resettable fuse manufactured by SCHURTER Inc., rated for 6V at 1.5A hold current in a 1812 (4532 Metric) surface mount package. This component is active in production and widely used in circuit protection applications requiring automatic recovery after overcurrent events. Equivalent and substitute parts are identified to support design flexibility, supply chain continuity, and application-specific requirements such as package size optimization or thermal performance variations.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Voltage - Max | 6V |
| Current - Hold (Ih) (Max) | 1.5 A |
| Current - Trip (It) | 3 A |
| Current - Max | 100 A |
| Time to Trip | 500 ms |
| Resistance - Initial (Ri) (Min) | 30 mOhms |
| Resistance - Post Trip (R1) (Max) | 120 mOhms |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 1812 (4532 Metric), Concave |
| Size / Dimension | 0.179" L x 0.128" W (4.55mm x 3.24mm) |
| Thickness (Max) | 0.033" (0.85mm) |
| RoHS Status | ROHS3 Compliant |
| Approval Agency | cURus, TUV |
Substitute Part Grouping Explanation
Substitute parts for the PFMF.150.2 are classified into three categories based on electrical and mechanical compatibility:
Direct Equivalent (MINISMDC150F-2): Identical electrical specifications (6V, 1.5A hold, 3A trip, 500ms trip time) and package footprint (1812/4532 Metric). Differs only in thickness (0.019" vs 0.033") and initial resistance tolerance (40 mOhms vs 30 mOhms minimum). Suitable for direct replacement with board layout verification for height clearance.
Similar Electrical Specifications with Package Variation (NANOSMDC150F-2): Matches all critical electrical parameters (6V, 1.5A hold, 3A trip) but uses a smaller 1206 (3216 Metric) package. Trip time is faster (300ms vs 500ms). Requires PCB layout redesign due to different footprint and dimensions (0.126" L x 0.063" W).
Parametric Equivalent with Current Rating Variation (NANOSMDC200F-2): Maintains 6V voltage rating but increases hold current to 2A and trip current to 4A. Uses 1206 (3216 Metric) package. Suitable only for applications where higher current protection is acceptable and package size reduction is required.
Parametric Equivalent with Identical Specifications (MF-MSMF150-2): Matches all electrical parameters and 1812 package footprint. Manufactured by Bourns Inc. under the Multifuse® series. Includes AEC-Q200 automotive qualification. Direct footprint compatibility with potential thermal performance differences due to identical thickness specification.
Parameter Comparison
| Parameter | PFMF.150.2 (Main) | MINISMDC150F-2 | NANOSMDC150F-2 | NANOSMDC200F-2 | MF-MSMF150-2 |
|---|---|---|---|---|---|
| Manufacturer | SCHURTER Inc. | Littelfuse Inc. | Littelfuse Inc. | Littelfuse Inc. | Bourns Inc. |
| Voltage - Max | 6V | 6V | 6V | 6V | 6V |
| Current - Hold (Ih) (Max) | 1.5 A | 1.5 A | 1.5 A | 2 A | 1.5 A |
| Current - Trip (It) | 3 A | 3 A | 3 A | 4 A | 3 A |
| Time to Trip | 500 ms | 500 ms | 300 ms | 1.5 s | 500 ms |
| Resistance - Initial (Ri) (Min) | 30 mOhms | 40 mOhms | 40 mOhms | 20 mOhms | 30 mOhms |
| Resistance - Post Trip (R1) (Max) | 120 mOhms | 110 mOhms | 110 mOhms | 72 mOhms | 120 mOhms |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Package / Case | 1812 (4532 Metric) | 1812 (4532 Metric) | 1206 (3216 Metric) | 1206 (3216 Metric) | 1812 (4532 Metric) |
| Size / Dimension | 0.179" L x 0.128" W (4.55mm x 3.24mm) | 0.179" L x 0.128" W (4.55mm x 3.24mm) | 0.126" L x 0.063" W (3.20mm x 1.59mm) | 0.126" L x 0.063" W (3.20mm x 1.59mm) | 0.179" L x 0.128" W (4.55mm x 3.24mm) |
| Thickness (Max) | 0.033" (0.85mm) | 0.019" (0.48mm) | 0.035" (0.89mm) | 0.043" (1.10mm) | 0.033" (0.85mm) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Approval Agency | cURus, TUV | CSA, TUV, UL | CSA, TUV, UL | CSA, TUV, UL | cURus, TUV |
| Product Status | Active | Active | Active | Active | Active |
Engineering Selection Recommendations
MINISMDC150F-2 (Littelfuse miniSMD): Select for direct replacement when board layout permits reduced thickness (0.019" vs 0.033"). All electrical parameters match the PFMF.150.2. Certifications include CSA, TUV, and UL, providing broader regulatory coverage than the main part. Verify PCB clearance for height-sensitive applications.
NANOSMDC150F-2 (Littelfuse nanoSMD): Select when package size reduction is a design requirement and faster trip response (300ms vs 500ms) is acceptable. Footprint change from 1812 to 1206 requires PCB redesign. Electrical hold and trip currents remain identical. Suitable for space-constrained applications.
NANOSMDC200F-2 (Littelfuse nanoSMD 2A): Select only when circuit protection requirements allow higher current ratings (2A hold, 4A trip). Slower trip time (1.5s) and lower initial resistance (20 mOhms) indicate different thermal and response characteristics. Package size reduction to 1206 requires PCB redesign. Not suitable for direct replacement in current-sensitive applications.
MF-MSMF150-2 (Bourns Multifuse): Select for direct footprint replacement with identical electrical specifications and 1812 package. Includes AEC-Q200 automotive qualification, suitable for automotive and high-reliability applications. Moisture sensitivity level is superior (1 vs 2A). Identical thickness specification ensures no clearance modifications required.
Frequently Asked Questions (FAQ)
Q: Can MINISMDC150F-2 be used as a direct drop-in replacement for PFMF.150.2?
A: MINISMDC150F-2 provides electrical equivalence with identical 6V, 1.5A hold, and 3A trip specifications. The primary difference is reduced thickness (0.019" vs 0.033"), which may affect board clearance in height-constrained designs. Verify PCB layout and component stacking before implementation.
Q: What is the key difference between NANOSMDC150F-2 and NANOSMDC200F-2?
A: Both use the 1206 (3216 Metric) package, but NANOSMDC150F-2 maintains the 1.5A hold current with 300ms trip time, while NANOSMDC200F-2 increases to 2A hold current with 1.5s trip time. Select NANOSMDC150F-2 for equivalent protection with faster response; select NANOSMDC200F-2 only if higher current protection is required.
Q: Why does NANOSMDC150F-2 have a faster trip time (300ms vs 500ms)?
A: Trip time is determined by the polymeric material composition and thermal design of the fuse element. The nanoSMD series uses a different formulation optimized for compact packages, resulting in faster thermal response. Verify that faster trip time is compatible with circuit protection requirements.
Q: Is MF-MSMF150-2 suitable for automotive applications?
A: Yes. MF-MSMF150-2 includes AEC-Q200 qualification, making it suitable for automotive and high-reliability applications. It maintains identical electrical specifications and 1812 package footprint as PFMF.150.2, with superior moisture sensitivity rating (MSL 1 vs MSL 2A).
Q: Can I use NANOSMDC200F-2 in a circuit designed for 1.5A protection?
A: No. NANOSMDC200F-2 is rated for 2A hold current and 4A trip current, providing higher protection thresholds than the original 1.5A/3A specification. Using this part in a 1.5A circuit will delay or prevent protection activation during overcurrent events. Select only when circuit requirements allow higher current ratings.
Q: What certifications are common across all substitute parts?
A: All substitute parts maintain TUV certification. MINISMDC150F-2, NANOSMDC150F-2, and NANOSMDC200F-2 add CSA and UL certifications. MF-MSMF150-2 maintains cURus certification matching the main part. All parts are ROHS3 compliant and REACH unaffected.
Q: How does package size affect PCB design when switching from PFMF.150.2 to NANOSMDC series?
A: PFMF.150.2 and MF-MSMF150-2 use 1812 (4.55mm x 3.24mm) footprint. NANOSMDC150F-2 and NANOSMDC200F-2 use 1206 (3.20mm x 1.59mm) footprint, requiring PCB layout redesign including trace routing, pad repositioning, and component placement adjustments.
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